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    Lateral collection photovoltaics
    61.
    发明授权
    Lateral collection photovoltaics 有权
    横向收集光伏

    公开(公告)号：US08294025B2

    公开(公告)日：2012-10-23

    申请号：US11972491

    申请日：2008-01-10

    申请人： Stephen J. Fonash ,  Handong Li ,  David Stone

    发明人： Stephen J. Fonash ,  Handong Li ,  David Stone

    IPC分类号： H01L31/02224

    CPC分类号： H01L31/035281 ,  B82Y20/00 ,  H01L31/022425 ,  H01L31/022433 ,  H01L31/03529 ,  H01L31/18 ,  H01L51/445 ,  H01L51/447 ,  Y02E10/549 ,  Y10T428/24174

    摘要： Lateral collection photovoltaic (LCP) structures based on micro- and nano-collecting elements are used to collect photogenerated carriers. In one set of embodiments, the collecting elements are arrayed on a conducting substrate. In certain versions, the collecting elements are substantially perpendicular to the conductor. In another set of embodiments, the micro- or nano-scale collecting elements do not have direct physical and electrical contact to any conducting substrate. In one version, both anode and cathode electrodes are laterally arrayed. In another version, the collecting elements of one electrode are a composite wherein a conductor is separated by an insulator, which is part of each collector element, from the opposing electrode residing on the substrate. In still another version, the collection of one electrode structure is a composite containing both the anode and the cathode collecting elements for collection. An active material is positioned among the collector elements.

    摘要翻译： 使用基于微纳米收集元件的侧向收集光伏（LCP）结构来收集光生载流子。 在一组实施例中，集合元件排列在导电衬底上。 在某些形式中，收集元件基本上垂直于导体。 在另一组实施例中，微尺度或纳米级收集元件不具有与任何导电衬底的直接物理和电接触。 在一个版本中，阳极和阴极电极都是横向排列的。 在另一个版本中，一个电极的收集元件是复合材料，其中导体由驻留在基底上的相对电极的绝缘体分隔开，绝缘体是每个集电器元件的一部分。 在另一个版本中，一个电极结构的集合是包含阳极和阴极收集元件用于收集的复合物。 活性物质位于收集器元件之间。

    JAVA VIRTUAL MACHINE HAVING INTEGRATED TRANSACTION MANAGEMENT SYSTEM
    62.
    发明申请
    JAVA VIRTUAL MACHINE HAVING INTEGRATED TRANSACTION MANAGEMENT SYSTEM 有权
    具有集成交易管理系统的JAVA虚拟机

    公开(公告)号：US20120254867A1

    公开(公告)日：2012-10-04

    申请号：US13464814

    申请日：2012-05-04

    申请人： Otto LIND ,  Jonathon C. Pile ,  Ramiro Sarmiento ,  Daniel J. Sifter ,  David Stone ,  Xiguang Zang ,  Mark Phillips

    发明人： Otto LIND ,  Jonathon C. Pile ,  Ramiro Sarmiento ,  Daniel J. Sifter ,  David Stone ,  Xiguang Zang ,  Mark Phillips

    IPC分类号： G06F9/455

    CPC分类号： G06F9/466

    摘要： A computing system is configured to deploy a JAVA application for execution in a distributed manner. The computing system includes a plurality of computing nodes including a domain manager node, the plurality of computing nodes forming a computing domain configured as an administrative grouping of the nodes administered by the domain manager node. The domain manager node is configured to provide, to each of the computing nodes, a main portion of the JAVA application. The main portion defines, for each computing node, a portion of the behavior of the JAVA application to be accomplished by that computing node. Furthermore, each computing node is configured to receive at least one class file having classes appropriate for the portion of the behavior of the JAVA application defined, by the main portion, to be accomplished by that computing node.

    摘要翻译： 计算系统配置为以分布式方式部署JAVA应用程序以执行。 计算系统包括多个包括域管理器节点的计算节点，所述多个计算节点形成被配置为域管理器节点管理的节点的管理分组的计算域。 域管理器节点被配置为向每个计算节点提供JAVA应用的主要部分。 主要部分为每个计算节点定义要由该计算节点完成的JAVA应用的行为的一部分。 此外，每个计算节点被配置为接收至少一个类文件，该类文件具有适于由主要部分定义的由该计算节点实现的JAVA应用程序的行为部分的类别。

    System and Method of Transaction Settlement Using Trade Credit
    64.
    发明申请
    System and Method of Transaction Settlement Using Trade Credit 审中-公开
    使用贸易信贷的交易结算制度和方法

    公开(公告)号：US20090024500A1

    公开(公告)日：2009-01-22

    申请号：US12038273

    申请日：2008-02-27

    申请人： Alan Kay ,  Roy Hatfield ,  David Stone

    发明人： Alan Kay ,  Roy Hatfield ,  David Stone

    IPC分类号： G06Q40/00

    CPC分类号： G06Q40/06 ,  G06Q40/00 ,  G06Q40/025 ,  G06Q40/04

    摘要： A method and system for settling a transaction with trade credit value which makes use of computer hardware and software, allows Members of a trade credit settlement system to transfer electronic instruments, called trade credits, in exchange for goods and services. These trade credits are effectively electronic bills of exchange that are divisible, transferable, discountable, continuously available and have been credit-enhanced to A/P1 status. Sponsors facilitate the system by registering buyers and suppliers as Members in the system and offering them operational accounts and drawdown accounts with authorized lines of credit. A Member-buyer approves the purchase invoice of a Member-supplier and authorizes the Sponsor to transfer trade credit value from the Member-buyer's operational and/or drawdown account into the operational account of the Member-supplier. The trade credit value received by the Member-supplier can be held in the Member-supplier's operational account until it matures, or discount it to cash before it matures, or transfer it to other Members for the purchase of goods or services.

    摘要翻译： 利用计算机硬件和软件解决具有贸易信用价值的交易的方法和系统，允许贸易信贷结算系统的成员转让称为贸易信贷的电子工具，以换取商品和服务。 这些贸易信贷实际上是电子汇票，是可分割的，可转让的，可折扣的，不断提供的，并已被信用增强为A / P1状态。 赞助商通过将买家和供应商作为会员登记在系统中来为系统提供便利，并向其提供具有授权信用额度的运营账户和提取账户。 会员买家批准会员供应商的采购发票，并授权赞助商将会员 - 买方的经营和/或提取账户的贸易信用额度转移到会员供应商的营业账户。 会员供应商收到的贸易信用额度可以在成员供应商的业务账户中持有，直到成熟为止，或者在成熟前将其折现到现金，或者将其转移给其他会员购买商品或服务。

    Auto connection assignment system and method
    66.
    发明申请
    Auto connection assignment system and method 失效
    自动连接分配系统和方法

    公开(公告)号：US20060294487A1

    公开(公告)日：2006-12-28

    申请号：US11159915

    申请日：2005-06-23

    申请人： Adam Bittner ,  Timothy Budell ,  Robert Cusimano ,  Richard Dauphin ,  Matthew Guzowski ,  Craig Lussier ,  David Stone ,  Patrick Wilder

    发明人： Adam Bittner ,  Timothy Budell ,  Robert Cusimano ,  Richard Dauphin ,  Matthew Guzowski ,  Craig Lussier ,  David Stone ,  Patrick Wilder

    IPC分类号： G06F17/50

    CPC分类号： H01L23/50 ,  G06F17/5077 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/3011

    摘要： A system and method for generating simulated wiring connections between first I/O terminals of a semiconductor device and second I/O terminals of a carrier. The method comprises identifying a plurality of first factors and instances of each first factor relating to a semiconductor device and identifying a plurality of second factors and instances of each second factor relating to a carrier. The first and second factors are associated with each other on a one-to-one basis. The instances of each first factor are correlated to the instances of each associated second factor on a one-to-one basis. A simulated wiring connection automatically is generated between each first I/O terminal and a matching second I/O terminal, subject to an identified instance of each first factor of each first I/O terminal being correlated to an identified instance of the associated second factor of the matching second I/O terminal.

    摘要翻译： 一种用于在半导体器件的第一I / O端子与载体的第二I / O端子之间产生模拟布线连接的系统和方法。 该方法包括识别与半导体器件相关的每个第一因素的多个第一因素和实例，并且识别与载波相关的每个第二因素的多个第二因素和实例。 第一和第二因素在一对一的基础上相互关联。 每个第一因子的实例与每个相关联的第二因子的实例在一对一的基础上相关。 在每个第一I / O终端和匹配的第二I / O终端之间自动生成模拟接线连接，受到每个第一I / O端子的每个第一因子的识别实例与相关联的第二因素的识别实例相关联 的匹配第二个I / O端子。

    Packaging reliability super chips
    67.
    发明申请
    Packaging reliability super chips 有权
    包装可靠性超级芯片

    公开(公告)号：US20060290372A1

    公开(公告)日：2006-12-28

    申请号：US11491216

    申请日：2006-07-21

    申请人： Jason Blanchet ,  James Crain ,  Charles Griffin ,  David Stone ,  Robert White

    发明人： Jason Blanchet ,  James Crain ,  Charles Griffin ,  David Stone ,  Robert White

    IPC分类号： G01R31/26

    CPC分类号： G01R31/2856 ,  G01R31/2853 ,  G01R31/2855 ,  G01R31/2875 ,  G01R31/2879

    摘要： A test chip module for testing the integrity of the flip chip solder ball interconnections between chip and substrate. The interconnections are thermally stressed through an array of individual heaters formed in a layer of chip metallurgy to provide a uniform and ubiquitous source of heat. Current is passed through the interconnection to be tested by a current supply circuit using one signal I/O interconnection and the voltage drop across the interconnection to be tested from the current passed therethrough is measured by a voltage measuring circuit connected through another signal I/O interconnection. Stress initiating cracking and degradation at the interconnection creates a measurable change in voltage drop across the interconnection.

    摘要翻译： 用于测试芯片和衬底之间的倒装芯片焊球互连的完整性的测试芯片模块。 互连通过在芯片冶金层中形成的各个加热器的阵列进行热应力，以提供均匀且普遍存在的热源。 电流通过互连使用一个信号I / O互连由电流供应电路进行测试，并且通过其中通过的电流将要测试的互连线上的电压降由通过另一个信号I / O连接的电压测量电路测量 互连。 在互连处的应力引发开裂和退化在互连上产生可测量的电压降变化。

    In-line modification of protocol handshake by protocol aware proxy
    69.
    发明申请
    In-line modification of protocol handshake by protocol aware proxy 审中-公开
    通过协议感知代理进行协议握手的在线修改

    公开(公告)号：US20060075114A1

    公开(公告)日：2006-04-06

    申请号：US10957165

    申请日：2004-09-30

    申请人： Anatoliy Panasyuk ,  David Stone ,  Bradley Pedersen

    发明人： Anatoliy Panasyuk ,  David Stone ,  Bradley Pedersen

    IPC分类号： G06F15/16

    CPC分类号： H04L67/28 ,  H04L67/14 ,  H04L67/288 ,  H04L69/24 ,  H04L69/326

    摘要： The present invention relates to systems and methods for network communication between a client and server via multiple proxies. A network protocol is used to establish and control an end-to-end connection between the client and the server via a single handshake mechanism. Through the protocol and end-to-end handshake, the proxies can participate in the establishment of the end-to-end connection. The present invention also provides a method and system by which a connection from one end-point to another end-point can be independently controlled and configured by the proxies along the connection path. Furthermore, the protocol is forward-compatible so that different proxies can be upgraded to different protocol versions at different times and the end-to-end connection control continues to operate.

    摘要翻译： 本发明涉及通过多个代理在客户机和服务器之间进行网络通信的系统和方法。 网络协议用于通过单个握手机制建立和控制客户端与服务器之间的端对端连接。 通过协议和端对端握手，代理可以参与建立端到端连接。 本发明还提供了一种方法和系统，通过该方法和系统，可以通过连接路径的代理独立地控制和配置从一个端点到另一个端点的连接。 此外，协议是前向兼容的，因此不同代理可以在不同时间升级到不同的协议版本，并且端到端连接控制继续运行。