摘要:
A non-volatile semiconductor memory having: a memory cell array having non-volatile memory cells disposed in a matrix form, each memory cell having a floating gate, a control gate, an erase gate, a source and a drain, and data being written through injection of electrons into the floating gate and erased through removal of electrons from the floating gate; and a peripheral circuit driven by a high voltage power source and a low voltage power source, predetermined voltages being applied to the control gate, erase gate and drain respectively of each memory cell to enter one of a data write mode, data erase mode and data read mode, in the data write mode, high voltages being applied to the control gate and drain of the memory cell to be data-written, a stress relaxing voltage being applied to each erase gate of memory cells not to be data-written, and the stress relaxing voltage being an intermediate voltage between the voltages of the high and low power sources.
摘要:
There is disclosed a non-volatile semiconductor memory device wherein a pair of memory cells constituting one bit data memory unit are connected to a data line in a manner that their drains are commonly connected. When compared to the case where drains of two memory cells are respectively connected to different data lines, the number of the connecting portions between drains and data lines is reduced and the area required for connection is lessened. Thus, a semiconductor memory device satisfactorily miniaturized from the viewpoint of practical use is provided. Further, since there is employed an arrangement such that the one bit data memory unit is comprised of two (a pair of) memory cells, the reliability can be improved. Individual select transistors may be arranged between the drain common junctions in the pair of memory cells, respectively, or a common select transistor may be arranged therebetween. In addition, the sources of the two memory cells may be respectively formed as individual sources.
摘要:
A semiconductor memory device having a memory cell array with a plurality of transistors (memory cells MC) disposed in a matrix form capable of electrically altering data. In writing data to a plurality of memory cells (MC), a write voltage (V.sub.pp ') is applied to the plurality of memory cells (MC) from a plurality of write circuits (7). The write voltage is generated by boosting an internal voltage (V.sub.CC) by a charge pump circuit (21). In writing data, one of the following methods is used. The plurality of write circuits (7) are sequentially activated by a write control circuit (20) at intervals of delayed timings. The operating point of each memory cell (transistor)(MC) is controlled by operating point control means so as to reduce a current. A capacitor is connected to the output side of the charge pump circuit, and a boosted write voltage is supplied via the capacitor to the write circuit.
摘要:
In response to a plurality of address signal input from the outside in sequence, an erase information inputting section controls an erase information holding section corresponding to the batch erase block to be erased so as to hold an erase information data. By repeating this operation in sequence, the erase information data are stored in the erase information holding sections corresponding to the plural batch erase blocks to be erased. Successively, on the basis of the erase information data stored in the erase information holding sections, block erasing sections are activated to erase all the nonvolatile memory cells of each of the corresponding blocks where the erase information data are held. As a result, the erasure operation is achieved for all the batch erase blocks corresponding to the erase information holding sections in each of which the erase information data is held, so that a plurality of batch erase blocks can be erased simulataneously, thus reducing the erasure time, as compared with the prior art memory device.
摘要:
Source and drain regions of a second conductivity type are formed in a stripe form in the surface area of a semiconductor substrate of a first conductivity type. A first insulation film is formed on the source and drain regions of the substrate. A second thin insulation film having a tunnel effect is formed on that part of the substrate which lies between the source and drain regions. A floating gate is formed on the second insulation film. A third insulation film is formed on the first insulation film, the floating gate and that part of the substrate which lies between the source and drain regions and on which the second insulation film is not formed. A control gate is formed on the third insulation film in a stripe form extending in a direction which intersects the source and drain regions. An impurity region of the first conductivity type having an impurity concentration higher than the substrate is formed in the substrate except the source and drain regions and the portions lying below the control gate. A floating gate transistor is constituted to include the substrate, source and drain regions, second insulation film, floating gate, third insulation film and control gate. An offset transistor is constituted to include the substrate, source and drain regions, third insulation film and control gate. The first insulation film and the impurity region are used as an element isolation region of a memory cell.
摘要:
A spare memory cell comprises a read FET (Field Effect Transistor), a fusing FET and a current fuse. The FETs are connected in series between a read data line and a low voltage source. The fuse is inserted between a series node of the FETs and a write data line. The fuse is molten when data is written to the spare memory cell. By applying a power source voltage to a control electrode of the fusing FET and by applying a voltage that is higher than the power source voltage to the write data line, the fusing FET is set to its secondary breakdown state. Under this state, a large current flows through the fusing FET to cut off the fuse, thus writing data to the spare memory cell.
摘要:
A semiconductor memory using a DLL circuit having a phase comparison circuit for comparing phases of an internal clock and a delay clock and a variable delay addition circuit for adjusting delay amount according to a signal from the phase comparison circuit comprises a means for inputting a first signal latched to a logic “1” by start of one clock cycle of the internal clock to the variable delay addition circuit through a dummy delay at the start of burst and a means for detecting the duration time of the logic “1” of the first signal inputted by the variable delay addition circuit through the dummy delay until one clock cycle of the internal clock is completed and setting the initial value of delay amount of the variable delay addition circuit based on the duration time.
摘要:
When an erase voltage is applied to the sources of data erasable and rewritable memory cells each having a floating gate, the erasure characteristics of the memory cells can be improved by controlling the rise time of the erase voltage or by increasing the erase voltage stepwise. In test mode, no row lines are selected by a row decoder and further the sources of the respective memory cells are set to ground level. Under these conditions, in case there exists an overerased memory cell, this cell is turned on due to depletion, so that it is possible to detect the presence of the overerased memory cell on the basis of change in potential of the column line connected to this turned on memory cell. A differential amplifier is used to detect the change in potential of the column line. In the test mode, the potential of the column lines is compared with a reference potential applied to a dummy column line, and a source bias generating circuit applies a test potential suitable for test to the respective sources of the cells, to shift the threshold level of the respective cells in a positive direction, for instance. By applying this test potential to the cells, it is possible to detect the pseudo-threshold level shifted in the positive direction; that is, to detect the overerased status of the memory cell more properly. Further, the erasure is effected until the threshold level of a memory cell of the highest erasure speed reaches a predetermined level, irrespective of the threshold distribution width of the memory cells, thus realizing a higher speed access to the device of narrower threshold distribution width, as compared with the conventional device.
摘要:
When an erase voltage is applied to the sources of data erasable and rewritable memory cells each having a floating gate, the erasure characteristics of the memory cells can be improved by controlling the rise time of the erase voltage or by increasing the erase voltage stepwise. In test mode, no row lines are selected by a row decoder and further the sources of the respective memory cells are set to ground level. Under these conditions, in case there exists an overerased memory cell, this cell is turned on due to depletion, so that it is possible to detect the presence of the overerased memory cell on the basis of change in potential of the column line connected to this turned on memory cell. A differential amplifier is used to detect the change in potential of the column line. In the test mode, the potential of the column lines is compared with a reference potential applied to a dummy column line, and a source bias generating circuit applies a test potential suitable for test to the respective sources of the cells, to shift the threshold level of the respective cells in a positive direction, for instance. By applying this test potential to the cells, it is possible to detect the pseudo-threshold level shifted in the positive direction; that is, to detect the overerased status of the memory cell more properly. Further, the erasure is effected until the threshold level of a memory cell of the highest erasure speed reaches a predetermined level, irrespective of the threshold distribution width of the memory cells, thus realizing a higher speed access to the device of narrower threshold distribution width, as compared with the conventional device.
摘要:
A memory cell array is divided into a plurality of blocks. In altering data for a block (selected block), a moderating voltage is applied to the source or control gate of a memory cell in another block (non-selected block) to moderate stress between the floating gate and source/drain, thereby preventing write error and erase error. In the program operation, the source and drain of a memory cell in the non-selected block are equalized to moderate an electric field between the control gate and source/drain and not to flow a channel current, thereby preventing write error. In carrying out a negative voltage erase method, prior to setting the source line and word line of a cell in a non-selected block to an erase voltage, the source and word lines are equalized. The equalization operation is released after the erase operation, thereby preventing malfunction of a non-selected cell.