公开(公告)号：US06754219B1

公开(公告)日：2004-06-22

申请号：US09326733

申请日：1999-06-04

申请人： Bradley Cain ,  William Miller ,  Robert Lee ,  Larry DiBurro ,  Michael Berger

发明人： Bradley Cain ,  William Miller ,  Robert Lee ,  Larry DiBurro ,  Michael Berger

IPC分类号： H04L1251

CPC分类号： H04L45/00 ,  H04L45/56

摘要： A routing device includes a routing application program interface that routing programs utilize to route data packets to other devices in a network. To that end, the routing device includes a processor for executing a routing program, a plurality of functional modules that control the operation of the routing device and forward data packets to the other network devices as specified by the routing program, and the routing application program interface operatively coupled with the processor. The routing program utilizes a set of specified commands associated with the routing application program interface for interacting with the plurality of functional modules through the routing application program interface. The routing program specifies a data packet routing protocol, while the functional modules comprise at least one of hardware and software.

摘要翻译： 路由设备包括路由应用程序接口，路由程序用于将数据分组路由到网络中的其他设备。 为此，路由设备包括用于执行路由程序的处理器，控制路由设备的操作并将数据分组转发到由路由程序指定的其他网络设备的多个功能模块，以及路由应用程序 接口可操作地与处理器耦合。 路由程序利用与路由应用程序接口相关联的一组指定命令，以通过路由应用程序接口与多个功能模块进行交互。 路由程序指定数据分组路由协议，而功能模块包括硬件和软件中的至少一个。

公开(公告)号：US06287126B1

公开(公告)日：2001-09-11

申请号：US09344887

申请日：1999-06-25

申请人： Michael Berger ,  Lewis S. Goldmann ,  Harvey C. Hamel ,  Mario J. Interrante ,  Marlene W. Moyer ,  Thomas P. Moyer ,  Karl J. Puttlitz, Sr.

发明人： Michael Berger ,  Lewis S. Goldmann ,  Harvey C. Hamel ,  Mario J. Interrante ,  Marlene W. Moyer ,  Thomas P. Moyer ,  Karl J. Puttlitz, Sr.

IPC分类号： H01R1200

CPC分类号： H01R4/64

摘要： An electrical connector arrangement for connecting electronic devices to one another. The connector arrangement uses tensile members and compression members, at least the tensile members of which act to provide both an electrical connection between electronic devices and force over a range of distances to hold the devices together. The tensile members provides tensile force acting to hold the electronic devices together while the compression members provide an opposing compressive force over a range of distances which balances the tensile force to thereby form a cellforce connector used to connect an array of electrical contact points on one electronic device to a corresponding array of electrical contact points on another electronic device.

摘要翻译： 一种用于将电子设备彼此连接的电连接器装置。 连接器装置使用拉伸构件和压缩构件，其至少其拉伸构件用于提供电子装置之间的电连接并在一定距离范围内施力以将装置保持在一起。 拉伸构件提供作用以将电子装置保持在一起的张力，同时压缩构件在一定距离范围内提供相反的压缩力，其平衡拉伸力从而形成用于连接一个电子装置上的电接触点阵列的电池单元连接器 设备到另一电子设备上的对应的电接触点阵列。

公开(公告)号：US5773561A

公开(公告)日：1998-06-30

申请号：US692033

申请日：1996-08-02

申请人： Krishna Gandhi Sachdev ,  Michael Berger ,  Patrick A. Coico ,  Frank L. Pompeo

发明人： Krishna Gandhi Sachdev ,  Michael Berger ,  Patrick A. Coico ,  Frank L. Pompeo

IPC分类号： C08L79/08 ,  C08G73/10 ,  C09J179/08 ,  C09J183/10 ,  H01L21/52 ,  C08G69/26

CPC分类号： C09J183/10 ,  C08G73/1042 ,  C08G73/106 ,  C09J179/08 ,  Y10T428/31681

摘要： The present invention relates generally to a new adhesive comprising a vinyl containing siloxane-containing polyimide for use in TSM capping of electronic package assemblies with adhesive capability of providing a seal band width of less than 4mm and even less than 2mm, solubility in non-toxic and environmentally safe solvents and durable adhesive properties and to a method for making the polyimides, a method for using the polyimides to make electronic packages and electronic packages made using the adhesive. The preferred vinyl-containing siloxane containing polyimide is a block type polymer containing blocks of a dianhydride-aromatic diamine oligomeric reaction product joined by non-vinyl/vinyl containing siloxane diamine forming links.

摘要翻译： 本发明一般涉及包含含乙烯基的含硅氧烷的聚酰亚胺的新型粘合剂，用于电子封装组件的TSM封盖，具有提供小于4mm甚至小于2mm的密封带宽度的粘合能力，在无毒的溶解度 和环境安全的溶剂和耐久的粘合性能以及制造聚酰亚胺的方法，使用聚酰亚胺制造使用该粘合剂制成的电子封装和电子封装的方法。 优选的含乙烯基的含硅氧烷的聚酰亚胺是含有通过非乙烯基/乙烯基的硅氧烷二胺形成连接物连接的二酐 - 芳族二胺低聚反应产物的嵌段的嵌段型聚合物。

公开(公告)号：US5507872A

公开(公告)日：1996-04-16

申请号：US343151

申请日：1994-11-22

申请人： Annette B. Antenucci ,  Michael Berger ,  Judy E. Lambert ,  David T. Naugle ,  Stephen A. Olson ,  Jae M. Park ,  Thomas Rednour ,  Benoit Ventimiglia ,  Richard J. Weckesser

发明人： Annette B. Antenucci ,  Michael Berger ,  Judy E. Lambert ,  David T. Naugle ,  Stephen A. Olson ,  Jae M. Park ,  Thomas Rednour ,  Benoit Ventimiglia ,  Richard J. Weckesser

IPC分类号： B05C11/10 ,  B05C5/00

CPC分类号： B05C11/1034 ,  Y10T156/1798

摘要： A contact-based microdispensing tool for delivering extremely minute globules of epoxy material to repaired sites on high circuit density modules. The tool includes a solid probe integrally mounted in a contact sensor assembly incorporating an air-levitated core of a linear voltage differential transducer. The levitated core and the probe connected thereto are supported in neutral equilibrium by an air bearing assembly. As the assembly probe is brought into contact with one of the sites, the globule flows upon the site, the equilibrium is disturbed and a signal is produced by the transducer to halt movement of the probe relative to the site.

摘要翻译： 一种基于接触的微型分配工具，用于将高分辨环氧树脂材料的小球提供给高电压密度模块上的修复位置。 该工具包括整体地安装在包含线性电压差分换能器的空气悬浮芯的接触传感器组件中的固体探头。 悬浮的芯和与其连接的探针通过空气轴承组件支撑在中性平衡中。 当组装探针与其中一个部位接触时，球体流过现场，平衡受到干扰，传感器产生信号，以阻止探针相对于部位的移动。

公开(公告)号：US5446961A

公开(公告)日：1995-09-05

申请号：US137547

申请日：1993-10-15

申请人： James M. Levite ,  Michael Berger ,  Richard L. Chartrand ,  Mary A. Emmett ,  Raymond A. Jackson ,  James J. Petrone ,  Richard F. Shortt ,  Roger A. Stinemire

发明人： James M. Levite ,  Michael Berger ,  Richard L. Chartrand ,  Mary A. Emmett ,  Raymond A. Jackson ,  James J. Petrone ,  Richard F. Shortt ,  Roger A. Stinemire

IPC分类号： H01L21/48 ,  H05K1/00 ,  H05K1/09 ,  H05K3/00 ,  H05K3/10 ,  H05K3/22 ,  H05K3/46 ,  H01K3/10

CPC分类号： H05K3/222 ,  H01L21/485 ,  H05K3/225 ,  H05K1/0298 ,  H05K1/095 ,  H05K2201/10287 ,  H05K2203/0769 ,  H05K2203/107 ,  H05K2203/121 ,  H05K2203/1338 ,  H05K2203/173 ,  H05K3/0017 ,  H05K3/107 ,  H05K3/4685 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49167 ,  Y10T29/49742

摘要： The present invention relates generally to a new structure and a method for repairing semiconductor substrates, and more particularly, the invention encompasses a structure and a method for repairing Printed Circuit Boards or other electronic substrates by providing electrical lines on the defective board. On a substrate that has an open or an electrical discontinuity, after the discontinuity has been established, a portion of the electrical line across from the electrical discontinuity are exposed and one or more trenches or grooves are made between the two or more exposed portions of the electrical line. The two exposed portions of the exposed electrical line is then joined by either an electrical wire that is routed through the trench or using a standard deposition process one or more metals or material are deposited in the open trench to provide or restore electrical continuity and the excess deposition material is removed. This invention also provides means for impedance matching of the net that is repaired.

摘要翻译： 本发明一般涉及用于修复半导体衬底的新结构和方法，更具体地，本发明包括通过在缺陷板上提供电线来修复印刷电路板或其它电子衬底的结构和方法。 在具有开放或电气不连续性的基板上，在不连续性已经建立之后，从电气不连续部分横跨的一部分电线被暴露，并且在两个或多个暴露部分之间形成一个或多个沟槽或凹槽 电线。 暴露的电线的两个暴露部分然后通过通过沟槽穿过的电线或使用标准沉积工艺连接，一个或多个金属或材料沉积在开放沟槽中，以提供或恢复电连续性， 去除沉积材料。 本发明还提供了用于修复网络的阻抗匹配的装置。

公开(公告)号：US5193732A

公开(公告)日：1993-03-16

申请号：US771706

申请日：1991-10-04

申请人： Mario J. Interrante ,  Michael Berger ,  Edward F. Handford ,  Eugene Tas

发明人： Mario J. Interrante ,  Michael Berger ,  Edward F. Handford ,  Eugene Tas

IPC分类号： B23K20/10 ,  H01L21/607 ,  H05K3/22 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40

CPC分类号： H01L24/85 ,  B23K20/10 ,  H01L24/48 ,  H01L24/78 ,  H05K3/225 ,  H01L2224/45109 ,  H01L2224/45113 ,  H01L2224/45116 ,  H01L2224/4512 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/45169 ,  H01L2224/45171 ,  H01L2224/4518 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/78313 ,  H01L2224/8501 ,  H01L2224/85191 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L24/45 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/19041 ,  H05K2201/10287 ,  H05K2203/0285 ,  H05K2203/049 ,  H05K2203/173 ,  H05K3/328 ,  H05K3/3457

摘要： The present invention relates generally to apparatus and methods for making simultaneous electrical connections, and more particularly to making these electrical connections simultaneously using a new bond tip configuration. Various methods and processes are being disclosed to simultaneously make electrical connections between electrical conductor lines or pads. The electrical connection is made by placing an electrically conductive wire across a pair of electrical lines or pads that have to be electrically connected and then by using a special tip, both ends of the electrically conductive wire are simultaneously secured to the two electrically conductive lines or pads.

公开(公告)号：US4767691A

公开(公告)日：1988-08-30

申请号：US45445

申请日：1987-05-04

申请人： Michael Berger ,  Robert Cavallaro ,  Frank M. Czumak

发明人： Michael Berger ,  Robert Cavallaro ,  Frank M. Czumak

IPC分类号： G03B17/52 ,  G03C3/00 ,  G03C8/44 ,  G03C5/54 ,  G03D5/02

CPC分类号： G03C8/44

摘要： A photographic film assemblage includes a pair of sheets bonded together around their edges and being in liquid communication with a sealed rupturable container of film processing liquid. An aperture in one of the sheets is covered by a film chip which, subsequent to exposure, is exposed to the processing liquid through the aperture after the container is ruptured. An image-receiving portion of the film chip is manually separable from the assemblage after suitable developing has occurred. Preferably, the image-receiving portion is a positive color transparency of a 35 MM size ready for immediate placement in a film mount for subsequent use in a viewer or projector.

公开(公告)号：US20240173202A1

公开(公告)日：2024-05-30

申请号：US18431394

申请日：2024-02-02

申请人： Eduardo Emanuelli ,  Marco Perry ,  Mark Prommel ,  Pil-Ho Chung ,  Michael Berger ,  Cody Moore ,  Colby Johnson

发明人： Eduardo Emanuelli ,  Marco Perry ,  Mark Prommel ,  Pil-Ho Chung ,  Michael Berger ,  Cody Moore ,  Colby Johnson

IPC分类号： A61H15/02 ,  A61H15/00

CPC分类号： A61H15/02 ,  A61H2015/0014 ,  A61H2201/0157 ,  A61H2201/0207 ,  A61H2201/0228 ,  A61H2201/1695

摘要： A cordless portable composite foam roller generates and applies heat and/or cold to muscles, and operates using an internal rechargeable power source combined with a flex-proof heating layer when in use. The cordless foam roller includes an elongated cylindrically-shaped body having a sandwich of heating layer(s) and textured exterior surface, heat reflector and an inner cavity for hosting the rechargeable power source components.

公开(公告)号：US20220079837A1

公开(公告)日：2022-03-17

申请号：US17453245

申请日：2021-11-02

申请人： Eduardo Emanuelli ,  Marco Perry ,  Mark Prommel ,  Pil-Ho Chung ,  Michael Berger ,  Cody Moore

发明人： Eduardo Emanuelli ,  Marco Perry ,  Mark Prommel ,  Pil-Ho Chung ,  Michael Berger ,  Cody Moore

IPC分类号： A61H15/02

摘要： A cordless portable composite foam roller generates and applies heat and/or cold to muscles, and operates using an internal rechargeable power source combined with a flex-proof heating layer when in use. The cordless foam roller includes an elongated cylindrically-shaped body having a sandwich of heating layer(s) and textured exterior surface, and an inner cavity for hosting the rechargeable power source components.

公开(公告)号：US09619671B2

公开(公告)日：2017-04-11

申请号：US13992238

申请日：2011-12-22

申请人： Michael Berger ,  Mukesh Kataria ,  Jeffrey M. Tripp ,  Yasser Rasheed ,  David Birnbaum ,  Hung P. Huynh ,  Eli Kupermann ,  Mazen G. Gedeon ,  Joshua M. Resch

发明人： Michael Berger ,  Mukesh Kataria ,  Jeffrey M. Tripp ,  Yasser Rasheed ,  David Birnbaum ,  Hung P. Huynh ,  Eli Kupermann ,  Mazen G. Gedeon ,  Joshua M. Resch

IPC分类号： G06F21/70 ,  G06F21/88 ,  H04W12/12

CPC分类号： G06F21/70 ,  G06F21/88 ,  H04W12/12

摘要： A platform including a security system is described. The security system comprises, in one embodiment, a multi-state system having a plurality of modes, available whenever the platform has a source of power. The modes comprise an unarmed mode, in which the security system is not protecting the platform, an armed mode, in which the platform is protected, the armed mode reached from the unarmed mode, after an arming command, and a suspecting mode, in which the platform is suspecting theft, the suspecting mode reached from the armed mode, when a risk behavior is detected.