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61.发明申请公开(公告)号：US20160284679A1
公开(公告)日：2016-09-29
申请号：US15036794
申请日：2014-10-23
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Jürgen Moosburger , Markus Pindl , Simon Jerebic , Frank Singer
CPC classification number: H01L25/50 , H01L33/46 , H01L33/483 , H01L33/54 , H01L33/60 , H01L2933/0025 , H01L2933/0033 , H01L2933/0058
Abstract: A method for producing a plurality of optoelectronic semiconductor devices is provided. A number of semiconductor chips are fastened on an auxiliary support. The semiconductor chips are spaced apart from one another in a lateral direction. A reflective layer is formed, at least in regions between the semiconductor chips. A composite package body is formed at least in certain regions between the semiconductor chips. The auxiliary support is removed and the composite housing body is separated into a number of optoelectronic semiconductor devices. Each optoelectronic semiconductor device has at least one semiconductor chip, part of the reflective layer and part of the composite package body as a package body.
Abstract translation: 提供了一种制造多个光电半导体器件的方法。 许多半导体芯片被紧固在辅助支架上。 半导体芯片在横向彼此间隔开。 至少在半导体芯片之间的区域中形成反射层。 至少在半导体芯片之间的某些区域中形成复合封装体。 辅助支撑件被移除并且复合壳体被分离成多个光电子半导体器件。 每个光电半导体器件具有至少一个半导体芯片，反射层的一部分和作为封装体的复合封装体的一部分。
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公开(公告)号：US20160093783A1
公开(公告)日：2016-03-31
申请号：US14782698
申请日：2014-04-03
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Frank Singer , Jürgen Moosburger , Thomas Schwarz
CPC classification number: H01L33/62 , H01L33/486 , H01L33/502 , H01L33/54 , H01L2224/48091 , H01L2224/48471 , H01L2224/48479 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/181 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2924/00012 , H01L2224/4554
Abstract: An optoelectronic component includes an optoelectronic semiconductor chip embodied as a volume emitter, wherein the optoelectronic semiconductor chip is embedded into an optically transparent molded body, a soldering contact is arranged at an underside of the molded body, a bonding wire forms an electrically conductive connection between an electrical contact area of the optoelectronic semiconductor chip and the soldering contact, and the bonding wire is embedded into the molded body.
Abstract translation: 光电子部件包括实施为体积发射体的光电子半导体芯片，其中光电子半导体芯片被嵌入到光学透明的成型体中，焊接接头布置在成型体的下侧，接合线形成导电连接， 光电半导体芯片和焊接触点的电接触区域，并且接合线嵌入到模制体中。
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63.发明申请公开(公告)号：US20160056344A1
公开(公告)日：2016-02-25
申请号：US14779818
申请日：2014-03-24
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Joachim Reill , Frank Singer , Norwin von Malm , Matthias Sabathil
CPC classification number: H01L33/486 , H01L23/49805 , H01L33/005 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2924/00
Abstract: An optoelectronic semiconductor component includes a semiconductor chip having a semiconductor layer sequence including an active region that generates radiation; a radiation exit surface running parallel to the active region; a mounting side surface that fixes the semiconductor component and runs obliquely or perpendicularly to the radiation exit surface and at which at least one contact area for external electrical contacting is accessible; a molded body molded onto the semiconductor chip in places and forming the mounting side surface at least in regions; and a contact track arranged on the molded body and electrically conductively connecting the semiconductor chip to the at least one contact area.
Abstract translation: 光电半导体元件包括半导体芯片，半导体芯片具有包括产生辐射的有源区的半导体层序列; 辐射出口表面平行于有源区域延伸; 安装侧表面，其固定所述半导体部件并且倾斜地或垂直于所述辐射出射表面延伸，并且至少一个用于外部电接触的接触区域可接近; 在半导体芯片上成型的成型体，至少在区域形成安装侧面; 以及布置在所述模制体上并将所述半导体芯片导电连接到所述至少一个接触区域的接触轨道。
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公开(公告)号：US11486819B2
公开(公告)日：2022-11-01
申请号：US16323504
申请日：2017-08-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Frank Singer , Matthias Sperl
IPC: G01N21/3504
Abstract: A detection assembly and a method for producing a detection assemblies are disclosed. In an embodiment a detection arrangement includes an emitter configured to generate radiation having a peak wavelength in an infrared spectral range, a detector configured to receive the radiation, a mounting surface comprising at least a first contact surface and a second contact surface for external electrical connection of the detection arrangement, a form body adjoining the emitter and the detector at least in places and deflection optics, on which the radiation impinges during operation of the detection arrangement so that an optical path is formed between the emitter and the detector by the deflection optics, wherein the deflection optics include a scattering body into which the radiation enters during the operation through a surface of the scattering body facing the emitter.
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公开(公告)号：US11158770B2
公开(公告)日：2021-10-26
申请号：US16294789
申请日：2019-03-06
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Britta Göötz , Frank Singer
IPC: H01L33/50
Abstract: An optoelectronic component and a lighting apparatus are disclosed. In an embodiment an optoelectronic component includes a carrier having an upper side and an underside opposite the upper side, an optoelectronic semiconductor chip arranged on the upper side of the carrier, the semiconductor chip configured to emit primary radiation during operation via one or more sides. The component further includes a first conversion layer having an inorganic phosphor on the semiconductor chip, the first conversion layer covering at least all radiation-emitting sides of the semiconductor chip not facing the carrier and a solid body in which an organic phosphor is distributed, wherein the solid body is arranged and fastened on the carrier and is at least in indirect contact with the carrier, and wherein the solid body is spaced from the radiation-emitting sides of the semiconductor chip at least by the first conversion layer and/or by the carrier.
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Patent Agency Ranking
公开(公告)号：US11114411B2
公开(公告)日：2021-09-07
申请号：US16345449
申请日：2017-10-25
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Jürgen Moosburger , Frank Singer
IPC: H01L23/00 , H01L33/00 , H01L21/67 , B65G47/90 , H01L21/683
Abstract: A method of transferring semiconductor chips includes providing a transfer tool having a plurality of segments, each segment having a liquid receiving area; providing a plurality of semiconductor chips in a regular array on a source carrier; providing a target carrier; selectively arranging liquid drops on the liquid receiving areas of some of the segments; causing the transfer tool to approach the source carrier, each liquid drop contacting and wetting a semiconductor chip; lifting the transfer tool from the source carrier, wherein semiconductor chips wetted by liquid drops are lifted from the source carrier by the transfer tool; causing the target carrier by the transfer tool, to approach the semiconductor chips arranged on the transfer tool contacting the target carrier; and lifting the transfer tool from the target carrier, the semiconductor chips contacting the target carrier remaining on the target carrier
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公开(公告)号：US10741996B2
公开(公告)日：2020-08-11
申请号：US15765706
申请日：2016-09-29
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Frank Singer , Norwin Von Malm , Tilman Ruegheimer , Thomas Kippes
Abstract: In one embodiment of the invention, the semiconductor laser (1) comprises a semiconductor layer sequence (2). The semiconductor layer sequence (2) contains an n-type region (23), a p-type region (21) and an active zone (22) lying between the two. A laser beam is produced in a resonator path (3). The resonator path (3) is aligned parallel to the active zone (22). In addition, the semiconductor laser (1) contains an electrical p-contact (41) and an electrical n-contact (43) each of which is located on the associated region (21, 23) of the semiconductor layer sequence (2) and is configured to input current directly into the associated region (21, 23). A p-contact surface (61) is electrically connected to the p-contact (41), and an n-contact surface (63) is electrically connected to the n-contact (43) such that the p-contact surface (61) and the n-contact surface (63) are configured for external electrical and mechanical connection of the semiconductor laser (1). The contact surfaces (61, 63) are oriented parallel to a growth direction (G) of the semiconductor layer sequence (2). The semiconductor laser (1) can be surface-mounted without wires.
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公开(公告)号：US10396260B2
公开(公告)日：2019-08-27
申请号：US15574602
申请日：2016-05-13
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Matthias Sabathil , Jürgen Moosburger , Frank Singer
IPC: H01L33/62 , H01L21/683 , H01L21/66 , H01L25/075 , H01L33/00 , H01L33/54 , H01L33/60 , H01L33/32
Abstract: A method of producing an optoelectronic component includes providing a wafer substrate that includes a light-emitting layer sequence, singulating the wafer substrate having the layer sequence into semiconductor components, applying the semiconductor components to an intermediate carrier, arranging a potting material on the intermediate carrier such that the potting material laterally surrounds the semiconductor components and is in direct contact, at least in places, with side surfaces of the semiconductor components, arranging one contact on one semiconductor component and the potting material, wherein one contact is arranged on a side of the semiconductor component and the potting material remote from the intermediate carrier, connecting the component to a carrier element, on a side of the semiconductor components remote from the intermediate carrier, removing the intermediate carrier and the wafer substrate of the semiconductor components, and bringing the semiconductor components into electrical contact by the contacts and the potting material.
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公开(公告)号：US20190157247A1
公开(公告)日：2019-05-23
申请号：US16098212
申请日：2017-05-09
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Jürgen Moosburger , Frank Singer , Thomas Schwarz , Alexander Martin
IPC: H01L25/075 , H01L33/58 , H01L33/62 , G09F9/302
Abstract: A module for a video wall is disclosed. In an embodiment a module includes a carrier, a plurality of components comprising at least one light-emitting structural element arranged on the carrier and an optical element, wherein the components are arranged at a prespecified lateral distance in relation to one another, wherein a retaining recess is formed between at least two components, wherein the retaining recess comprises at least two component recesses of two components which are arranged next to one another, wherein a retaining pin is fastened in the retaining recess, wherein the retaining pin is connected to the optical element, and wherein the optical element is configured to influence light irradiation onto the components and/or light emission from the components.
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公开(公告)号：US20190155564A1
公开(公告)日：2019-05-23
申请号：US16314467
申请日：2017-06-30
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Thomas Schwarz , Frank Singer , Jürgen Moosburger , Karl Engl , Alexander Martin
Abstract: An arrangement includes at least two modules for a video wall including light-emitting components arranged on a carrier, wherein a drive circuit that selectively drives the component at the carrier is provided for each component, row lines and column lines are provided, each drive circuit connects to a row line and a column line, each drive circuit connects to power supply lines, the carrier includes plated-through holes that guide the row lines and the column lines onto an underside of the carrier, the two modules are arranged on a further carrier, the further carrier includes at least one recess, an electrical connector is arranged in the recess, and the electrical connector connects column lines and/or row lines of the two modules to one another.
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