-
公开(公告)号:US20210167329A1
公开(公告)日:2021-06-03
申请号:US17267857
申请日:2019-08-08
Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Inventor: Hiroki ADACHI , Junpei YANAKA , Masataka SATO
Abstract: A light-emitting device capable of long-time display in a bent state is provided. A light-emitting device that can be repeatedly bent with a small radius of curvature is provided. The flexible light-emitting device includes a light-emitting element, a first inorganic insulating layer, a second inorganic insulating layer, and a first organic insulating layer. The first organic insulating layer is positioned over the first inorganic insulating layer. The light-emitting element is positioned over the first inorganic insulating layer with the first organic insulating layer therebetween. The second inorganic insulating layer is positioned over the light-emitting element. An end portion of the first inorganic insulating layer and an end portion of the second inorganic insulating layer are each positioned inward from an end portion of the first organic insulating layer. The end portion of the first organic insulating layer is exposed on a side surface of the light-emitting device. The first inorganic insulating layer and the second inorganic insulating layer are preferably in contact with each other outside an end portion of the light-emitting element.
-
62.
公开(公告)号:US20210026188A1
公开(公告)日:2021-01-28
申请号:US16319649
申请日:2017-05-11
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Masakatsu OHNO , Seiji YASUMOTO , Naoto GOTO , Hiroki ADACHI
IPC: G02F1/1333 , G02F1/1362 , G02F1/1368
Abstract: A method for manufacturing a display device with low power consumption is provided.
A method for manufacturing a display device includes a step of forming a first layer over a substrate by using a material containing a resin or a resin precursor, a step of forming a first region and a second region thinner than the first region in the first layer, a step of forming a first resin layer including a first region and a second region thinner than the first region by performing first heat treatment on the first layer in a gas containing oxygen, a step of forming, over the first resin layer, a layer to be separated including a display element, and a step of separating the layer to be separated and the substrate from each other. A step of forming a conductive layer over the first resin layer in a position overlapping with the second region is included in the step of forming the layer to be separated. A step of exposing the conductive layer by removing the first resin layer is included after the step of separating the layer to be separated and the substrate from each other.-
公开(公告)号:US20190333976A1
公开(公告)日:2019-10-31
申请号:US16509819
申请日:2019-07-12
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei YAMAZAKI , Masakatsu OHNO , Hiroki ADACHI , Satoru IDOJIRI , Koichi TAKESHIMA
IPC: H01L27/32 , B23K26/0622 , B23K26/04 , B23K26/06 , B23K26/08 , H01L51/52 , H01L29/66 , H01L29/786 , H01L51/00 , H01L51/56 , H01L27/12 , H01L29/24
Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
-
公开(公告)号:US20190096977A1
公开(公告)日:2019-03-28
申请号:US16204102
申请日:2018-11-29
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei YAMAZAKI , Masakatsu OHNO , Hiroki ADACHI , Satoru IDOJIRI , Koichi TAKESHIMA
IPC: H01L27/32 , B23K26/08 , H01L51/00 , H01L51/56 , H01L29/786 , H01L27/12 , B23K26/0622 , H01L51/52 , B23K26/04 , B23K26/06 , H01L29/66 , H01L29/24 , H01L41/314 , H01L51/50
Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
-
公开(公告)号:US20180166524A1
公开(公告)日:2018-06-14
申请号:US15894117
申请日:2018-02-12
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei YAMAZAKI , Masakatsu OHNO , Hiroki ADACHI , Satoru IDOJIRI , Koichi TAKESHIMA
CPC classification number: H01L27/3272 , B23K26/04 , B23K26/0617 , B23K26/0622 , B23K26/0643 , B23K26/0648 , B23K26/083 , H01L27/1225 , H01L27/1266 , H01L27/322 , H01L27/3244 , H01L27/3258 , H01L27/3262 , H01L29/24 , H01L29/66969 , H01L29/78603 , H01L29/7869 , H01L41/314 , H01L51/0024 , H01L51/0027 , H01L51/003 , H01L51/0097 , H01L51/5096 , H01L51/5246 , H01L51/5253 , H01L51/5284 , H01L51/56 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2251/558 , Y02E10/549 , Y02P70/521
Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
-
公开(公告)号:US20180076401A1
公开(公告)日:2018-03-15
申请号:US15810249
申请日:2017-11-13
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Tatsuya SAKUISHI , Yutaka UCHIDA , Hiroki ADACHI , Saki EGUCHI , Junpei YANAKA , Kayo KUMAKURA , Seiji YASUMOTO , Kohei YOKOYAMA , Akihiro CHIDA
CPC classification number: H01L51/0097 , B32B7/02 , B32B7/06 , B32B7/12 , B32B15/08 , B32B15/18 , B32B15/20 , B32B17/00 , B32B17/06 , B32B27/20 , B32B27/286 , B32B27/30 , B32B27/325 , B32B27/34 , B32B27/36 , B32B27/365 , B32B37/02 , B32B37/10 , B32B37/1292 , B32B37/18 , B32B38/10 , B32B2250/05 , B32B2255/20 , B32B2260/021 , B32B2260/046 , B32B2264/102 , B32B2307/202 , B32B2307/40 , B32B2307/50 , B32B2307/536 , B32B2307/558 , B32B2310/0843 , B32B2315/08 , B32B2457/20 , H01L51/003 , H01L51/5253 , H01L2251/5338 , Y02E10/549 , Y02P70/521
Abstract: A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.
-
67.
公开(公告)号:US20180019425A1
公开(公告)日:2018-01-18
申请号:US15646146
申请日:2017-07-11
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Seiji YASUMOTO , Masataka SATO , Hiroki ADACHI , Toru TAKAYAMA , Natsuko TAKASE
IPC: H01L51/50 , G09G5/02 , G02F1/1362
Abstract: A display device with high visibility regardless of the ambient brightness is manufactured at low cost. A method for manufacturing a display device that includes a first display element, a second display element, and an insulating layer is provided.The first display element includes a first pixel electrode that reflects visible light, a liquid crystal layer, and a first common electrode that transmits visible light. The second display element includes a second pixel electrode that transmits visible light, a light-emitting layer, and a second common electrode that reflects visible light. The first common electrode is formed over a first substrate. A separation layer that reflects visible light is formed over a formation substrate, the insulating layer is formed over the separation layer, and the second display element is formed over the insulating layer. The formation substrate and a second substrate are bonded to each other with an adhesive. Then, the formation substrate and the separation layer are separated from each other. The exposed separation layer is processed into the first pixel electrode. The liquid crystal layer is positioned between the first common electrode and the first pixel electrode and the first substrate and the second substrate are bonded to each other with an adhesive to form the first display element.
-
公开(公告)号:US20160300865A1
公开(公告)日:2016-10-13
申请号:US15100476
申请日:2014-11-26
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei YAMAZAKI , Masakatsu OHNO , Hiroki ADACHI , Satoru IDOJIRI , Koichi TAKESHIMA
IPC: H01L27/12 , H01L29/786
CPC classification number: H01L27/1266 , H01L21/6835 , H01L27/1222 , H01L27/1285 , H01L27/3244 , H01L29/78648 , H01L29/78675 , H01L51/003 , H01L2221/6835
Abstract: An object is to provide a novel separation method or a novel manufacturing method of a device. In the case where a bond of M——W (M is a given element) is divided by application of physical force, a liquid is absorbed into the gap, whereby the bond becomes bonds of M—OH HO—W with a longer bond distance and the detachment can be promoted accordingly. In the detachment, a roller such as a drum roller can be used. Part of the roller surface may have adhesiveness. For example, an adhesive tape or the like may be put on part of the roller surface. By rotating the roller, the layer to be separated is wound and detached from the substrate having an insulating surface.
Abstract translation: 目的在于提供一种新的分离方法或新颖的器件制造方法。 在M-W(M为给定元素)的键通过施加物理力分离的情况下,液体被吸收到间隙中,由此键变为具有较长键的M-OH HO-W的键 距离和分离可以相应推动。 在拆卸中,可以使用诸如鼓辊的辊。 辊表面的一部分可能具有粘合性。 例如,可以将胶带等放置在辊表面的一部分上。 通过旋转辊,待分离的层从具有绝缘表面的基板上卷绕并分离。
-
公开(公告)号:US20160247868A1
公开(公告)日:2016-08-25
申请号:US15145246
申请日:2016-05-03
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei YAMAZAKI , Masakatsu OHNO , Hiroki ADACHI , Satoru IDOJIRI , Koichi TAKESHIMA
CPC classification number: H01L27/3272 , B23K26/04 , B23K26/0617 , B23K26/0622 , B23K26/0643 , B23K26/0648 , B23K26/083 , H01L27/1225 , H01L27/1266 , H01L27/322 , H01L27/3244 , H01L27/3258 , H01L27/3262 , H01L29/24 , H01L29/66969 , H01L29/78603 , H01L29/7869 , H01L41/314 , H01L51/0024 , H01L51/0027 , H01L51/003 , H01L51/0097 , H01L51/5096 , H01L51/5246 , H01L51/5253 , H01L51/5284 , H01L51/56 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2251/558 , Y02E10/549 , Y02P70/521
Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
-
公开(公告)号:US20160243647A1
公开(公告)日:2016-08-25
申请号:US15145260
申请日:2016-05-03
Applicant: Semiconductor Energy Laboratory Co., Ltd.
Inventor: Shunpei YAMAZAKI , Masakatsu OHNO , Hiroki ADACHI , Satoru IDOJIRI , Koichi TAKESHIMA
IPC: B23K26/0622 , B23K26/06 , B23K26/08 , B23K26/04
CPC classification number: H01L27/3272 , B23K26/04 , B23K26/0617 , B23K26/0622 , B23K26/0643 , B23K26/0648 , B23K26/083 , H01L27/1225 , H01L27/1266 , H01L27/322 , H01L27/3244 , H01L27/3258 , H01L27/3262 , H01L29/24 , H01L29/66969 , H01L29/78603 , H01L29/7869 , H01L41/314 , H01L51/0024 , H01L51/0027 , H01L51/003 , H01L51/0097 , H01L51/5096 , H01L51/5246 , H01L51/5253 , H01L51/5284 , H01L51/56 , H01L2227/323 , H01L2227/326 , H01L2251/5338 , H01L2251/558 , Y02E10/549 , Y02P70/521
Abstract: A first organic resin layer is formed over a first substrate; a first insulating film is formed over the first organic resin layer; a first element layer is formed over the first insulating film; a second organic resin layer is formed over a second substrate; a second insulating film is formed over the second organic resin layer; a second element layer is formed over the second insulating film; the first substrate and the second substrate are bonded; a first separation step in which adhesion between the first organic resin layer and the first substrate is reduced; the first organic resin layer and a first flexible substrate are bonded with a first bonding layer; a second separation step in which adhesion between the second organic resin layer and the second substrate is reduced; and the second organic resin layer and a second flexible substrate are bonded with a second bonding layer.
-
-
-
-
-
-
-
-
-