公开(公告)号：US07968918B2

公开(公告)日：2011-06-28

申请号：US12493290

申请日：2009-06-29

申请人： Sung Min Kim

发明人： Sung Min Kim

IPC分类号： H01L23/48 ,  H01L21/70 ,  H01L29/40 ,  H01L23/04

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor package includes a semiconductor chip having two or more regions that partially overlap so as to define an overlapping region. Through-holes are defined through the two or more partially overlapping regions. One or more first electrodes are disposed on inner surfaces of the semiconductor chip within the through-holes. One or more second electrodes are disposed so as to be insulated from the first electrodes. The one or more second electrodes are at least partially disposed in the overlapping region. Insulation members are disposed in the through-holes.

摘要翻译： 半导体封装包括具有部分重叠以限定重叠区域的两个或更多个区域的半导体芯片。 通过两个或更多个部分重叠的区域限定通孔。 一个或多个第一电极设置在通孔内的半导体芯片的内表面上。 一个或多个第二电极设置成与第一电极绝缘。 一个或多个第二电极至少部分地设置在重叠区域中。 绝缘构件设置在通孔中。

公开(公告)号：US07858439B2

公开(公告)日：2010-12-28

申请号：US11851741

申请日：2007-09-07

申请人： Sung Min Kim

发明人： Sung Min Kim

IPC分类号： H01L21/00

CPC分类号： H01L25/0657 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/3128 ,  H01L24/24 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05551 ,  H01L2224/0557 ,  H01L2224/13009 ,  H01L2224/16225 ,  H01L2224/24145 ,  H01L2224/821 ,  H01L2224/83 ,  H01L2224/9202 ,  H01L2224/92244 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2224/05552

摘要： Disclosed are a stacked semiconductor package and a method for manufacturing the same. The method for manufacturing a stacked semiconductor package includes preparing a substrate formed with a seed metal layer; laminating semiconductor chips having via holes aligned with one another on the seed metal layer to form a semiconductor chip module; and growing a conductive layer inside of the via holes using the seed metal layer to form a conductive growth layer inside of the via holes.

摘要翻译： 公开了层叠半导体封装及其制造方法。 层叠半导体封装的制造方法包括：准备形成有种子金属层的基板; 层叠具有在种子金属层上彼此对准的通孔的半导体芯片，以形成半导体芯片模块; 以及使用所述种子金属层在所述通孔内部生长导电层，以在所述通孔内部形成导电生长层。

公开(公告)号：US20090199601A1

公开(公告)日：2009-08-13

申请号：US12251597

申请日：2008-10-15

申请人： Na Eun KIM ,  Ki Chul Woo ,  Sung Ryong Kim ,  Dong Soo Lee ,  Sung Min Kim ,  Dong Won Kim

发明人： Na Eun KIM ,  Ki Chul Woo ,  Sung Ryong Kim ,  Dong Soo Lee ,  Sung Min Kim ,  Dong Won Kim

IPC分类号： D06F39/08

CPC分类号： D06F39/125 ,  D06F37/22 ,  D06F39/083 ,  D06F39/085 ,  D06F39/10 ,  D06F39/12

摘要： A laundry treating device is disclosed, which includes a cabinet that defines an exterior appearance of the device, a tub installed in the cabinet, a lower water holding part recessed in a lower portion of the tub to form a predetermined space, and a water drain hose connected with a side surface of the lower water holding part. The laundry treating device is capable of providing a sufficient water drain height, with improved inner space utilization.

摘要翻译： 公开了一种衣物处理装置，其包括限定装置的外观的机壳，安装在机壳中的桶，下部保持部分，其凹入桶的下部以形成预定的空间，以及排水 软管与下部水保持部的侧面连接。 洗衣处理装置能够提供足够的排水高度，具有改善的内部空间利用率。

公开(公告)号：US20090189267A1

公开(公告)日：2009-07-30

申请号：US12059308

申请日：2008-03-31

申请人： Sung Min Kim ,  Chang Jun Park ,  Kwon Whan Han ,  Seong Cheol Kim ,  Ha Na Lee

发明人： Sung Min Kim ,  Chang Jun Park ,  Kwon Whan Han ,  Seong Cheol Kim ,  Ha Na Lee

IPC分类号： H01L23/02 ,  H01L23/52

CPC分类号： H01L23/50 ,  H01L24/05 ,  H01L24/06 ,  H01L24/14 ,  H01L24/17 ,  H01L25/0657 ,  H01L2224/0235 ,  H01L2224/02375 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05552 ,  H01L2224/06051 ,  H01L2224/06165 ,  H01L2224/06167 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2924/0001 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2224/13099

摘要： A semiconductor chip with a chip selection structure suitable for a stacked semiconductor chip includes a semiconductor chip body and a chip selection structure. The chip selection structure includes a chip selection pad disposed over the semiconductor chip body, a main through electrode electrically connected to the chip selection pad, and a sub through electrode interposed between the main through electrode and the chip selection pad. A plurality of the semiconductor chips, each having the same chip selection structure, can be stacked by offsetting the stacked semiconductor chips.

摘要翻译： 具有适合堆叠半导体芯片的芯片选择结构的半导体芯片包括半导体芯片体和芯片选择结构。 芯片选择结构包括设置在半导体芯片主体上的芯片选择焊盘，电连接到芯片选择焊盘的主通孔以及置于主通孔和芯片选择焊盘之间的副通孔。 可以通过抵消堆叠的半导体芯片来堆叠各自具有相同芯片选择结构的多个半导体芯片。

公开(公告)号：US20090158784A1

公开(公告)日：2009-06-25

申请号：US12252985

申请日：2008-10-16

申请人： Sung Ryong KIM ,  Ki Chul Woo ,  Dong Soo Lee ,  Dong Won Kim ,  Sung Min Kim ,  Na Eun Kim

发明人： Sung Ryong KIM ,  Ki Chul Woo ,  Dong Soo Lee ,  Dong Won Kim ,  Sung Min Kim ,  Na Eun Kim

IPC分类号： D06F39/08 ,  D06F31/00

CPC分类号： D06F31/00 ,  D06F39/083

摘要： A laundry machine includes a first laundry treating device, and a second laundry treating device arranged adjacent to the first laundry treating device. The second laundry treating device is operable independently of the first laundry treating device. A first draining pipe guides water discharged from the first laundry treating device, and a second draining pipe guides water discharged from the second laundry treating device. A joining pipe is connected to the first and second draining pipes at a joining point.

摘要翻译： 洗衣机包括第一衣物处理装置和邻近第一衣物处理装置布置的第二衣物处理装置。 第二衣物处理装置可独立于第一衣物处理装置操作。 第一排水管引导从第一衣物处理装置排出的水，第二排水管引导从第二衣物处理装置排出的水。 连接管在接合点与第一和第二排水管连接。

公开(公告)号：US20090132122A1

公开(公告)日：2009-05-21

申请号：US12276160

申请日：2008-11-21

申请人： Hong Sig Kim ,  Sung Min Kim

发明人： Hong Sig Kim ,  Sung Min Kim

IPC分类号： B60G17/018 ,  F16F9/50

CPC分类号： F16F9/5126 ,  B60G17/06 ,  F16F9/46

摘要： Disclosed herein is a shock absorber capable of controlling damping force characteristics. The shock absorber includes a cylinder filled with an operating fluid, a piston valve disposed inside the cylinder to divide an interior of the cylinder into a first chamber and a second chamber, a piston rod having one end extending outside the cylinder and the other end coupled to the piston valve inside the cylinder, a hollow chamber formed inside the piston rod to communicate with the first and second chambers, a free piston disposed within the hollow chamber to move up and down and to divide the hollow chamber into upper and lower chambers, and a variable part configured to control the damping force characteristics by adjusting a vertical displacement of the free piston.

摘要翻译： 本文公开了一种能够控制阻尼力特性的减震器。 该减震器包括一个填充有工作流体的气缸，一个活塞阀，设置在气缸内部，以将汽缸的内部分隔成第一腔室和第二腔室;活塞杆，其一端延伸到气缸外部，另一端连接 在缸体内的活塞阀，形成在活塞杆的内部以与第一和第二腔室连通的中空室，设置在中空室内的自由活塞，上下移动并将中空室分成上下腔室， 以及可变部件，其构造成通过调节自由活塞的垂直位移来控制阻尼力特性。

公开(公告)号：US07525186B2

公开(公告)日：2009-04-28

申请号：US11647704

申请日：2006-12-29

申请人： Sung Min Kim ,  Min Suk Suh

发明人： Sung Min Kim ,  Min Suk Suh

IPC分类号： H01L25/07 ,  H01L25/18 ,  H01L23/02 ,  H01L23/055 ,  H01L23/12 ,  H01L29/00

CPC分类号： H01L21/76898 ,  H01L23/585 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/0557 ,  H01L2224/056 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2224/05099

摘要： A stack package comprises a substrate having a circuit pattern; at least two semiconductor chips stacked on the substrate, having a plurality of through-via interconnection plugs and a plurality of guard rings which surround the respective through-via interconnection plugs, and connected with each other by the medium of the through-via interconnection plugs; a molding material for molding an upper surface of the substrate including the stacked semiconductor chips; and solder balls mounted to a lower surface of the substrate.

摘要翻译： 堆叠封装包括具有电路图案的衬底; 堆叠在基板上的至少两个半导体芯片，具有多个通孔互连插头和围绕相应通孔互连插头的多个保护环，并且通过通孔互连插头的介质彼此连接 ; 用于模制包括堆叠的半导体芯片的基板的上表面的模制材料; 以及安装到基板的下表面的焊球。

公开(公告)号：US20080157357A1

公开(公告)日：2008-07-03

申请号：US11754555

申请日：2007-05-29

申请人： Sung Min Kim ,  Min Suk Suh

发明人： Sung Min Kim ,  Min Suk Suh

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L25/0657 ,  H01L21/563 ,  H01L21/76898 ,  H01L24/11 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/16235 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/73203 ,  H01L2224/90 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06565 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2224/29075 ,  H01L2224/83851 ,  H01L2224/05099

摘要： A stack package includes an upper semiconductor chip having a plurality of first bonding pads which are formed on an upper surface of the upper semiconductor chip and via-holes which are defined in the upper semiconductor chip under the respective first bonding pads; and a lower semiconductor chip attached to a lower surface of the upper semiconductor chip and having a plurality of second bonding pads which are formed on an upper surface of the lower semiconductor chip and bumps which are formed on the respective second bonding pads and are inserted into the respective via-holes to be come into the respective first bonding pads.

摘要翻译： 堆叠封装包括上半导体芯片，其具有形成在上半导体芯片的上表面上的多个第一焊盘和在相应的第一焊盘下方的上半导体芯片中限定的通孔; 以及下半导体芯片，其安装在上半导体芯片的下表面，并且具有多个第二焊盘，其形成在下半导体芯片的上表面上，并且形成在各个第二焊盘上并被插入 各个通孔将进入相应的第一接合焊盘。

公开(公告)号：US09640285B2

公开(公告)日：2017-05-02

申请号：US13335197

申请日：2011-12-22

申请人： Jung Cheol Shin ,  Sang Kyun Woo ,  Yong Chan Kim ,  Sung Min Kim ,  Chae Joon Lim

发明人： Jung Cheol Shin ,  Sang Kyun Woo ,  Yong Chan Kim ,  Sung Min Kim ,  Chae Joon Lim

IPC分类号： G21C17/06

CPC分类号： G21C17/06

摘要： Provided are a probe and an apparatus for measuring a thickness of an oxide layer of a fuel rod, capable of testing claddings of inner and outer fuel rods of a nuclear fuel assembly without disassembling the nuclear fuel assembly. The probe includes a fuel rod transfer region on which an eddy current sensor capable of continuously testing claddings of outer fuel rods of a fixed nuclear fuel assembly is mounted. Further, the apparatus includes a frame in which a cylinder driven in upward and downward directions is mounted, a first probe connected to one side of the cylinder in order to test claddings of outer fuel rods of a nuclear fuel assembly, and a second probe connected to the other side of the cylinder in order to test claddings of inner fuel rods of the nuclear fuel assembly.

公开(公告)号：US09416953B2

公开(公告)日：2016-08-16

申请号：US14113126

申请日：2012-04-19

申请人： Sung Min Kim ,  Kwang Jae Lee

发明人： Sung Min Kim ,  Kwang Jae Lee

IPC分类号： F21V29/02 ,  F21V29/00 ,  F21K99/00 ,  F21V29/77 ,  F21Y101/02

CPC分类号： F21V29/773 ,  F21K9/23 ,  F21K9/232 ,  F21V29/004 ,  F21Y2101/00 ,  F21Y2115/10

摘要： Provided is an LED lighting apparatus. The LED lighting apparatus include an LED, a socket part supplying a power into the LED, a heat sink body having one side on which the LED is mounted and the other side to which the socket part is coupled, and a heat sink pin disposed along a circumference of the heat sink body, the heat sink pin having one side extending downward from the heat sink body. The heat sink body may be modified in shape to reduce a weight and improve heat dissipation performance.

摘要翻译： 提供了一种LED照明装置。 LED照明装置包括LED，向LED提供电力的插座部分，具有LED的一侧的散热体和与插座部分耦合的另一侧，以及沿着 所述散热体的周边，所述散热片的一侧从所述散热体本体向下延伸。 散热体的形状可以被改变以减轻重量并改善散热性能。