Abstract:
The object amide compounds of the present invention are novel and can be represented by the following general formula (I): whereinR.sup.1 is indolyl or benzofuranyl;R.sup.2 is hydrogen, lower alkylthio(lower)alkyl or a group of the formula: ##STR1## in which R.sup.5 is hydrogen, lower alkoxy or halogen; R.sup.3 is hydrogen, quinolyl or phenyl which may have a suitable substituent selected from the group consisting of lower alkyl, lower alkoxy, lower alkylthio and halogen;R.sup.4 is hydrogen or optionally esterified carboxy; andX is S or NR.sup.6in which R.sup.6 is hydrogen, lower alkyl or a group of the formula: ##STR2## in which R.sup.7 is lower alkyl or lower alkoxy.
Abstract:
This invention relates to new heterocyclic compounds and pharmaceutically acceptable salts thereof. More particularly, this invention relates to new heterocyclic compounds and salts thereof which display bradykinin antagonist activity, to processes for preparing these compounds, to a pharmaceutical composition comprising these compounds, and to methods of using same in the prevention and/or the treatment of bradykinin- or bradykinin analogue-mediated diseases such as allergy, inflammation, autoimmune disease, shock, pain, or the like, in human beings or in animals.
Abstract:
This invention related to compounds of the formula ##STR1## wherein the radicals are as defined in the claims. The compounds are angiotensin II antagonists useful in treating hypertension, etc.
Abstract:
A transparent resin composition is described, comprising (i) from 65 to 99.9 parts by weight of a modified polyolefin which is at least partially modified with an unsaturated carboxylic acid or the anhydride thereof and having an unsaturated carboxylic acid or anhydride content of from 0.002 to 5 wt %, (2) from 35 to 0.1 parts by weight of a saponified ethylene/vinyl acetate copolymer having an ethylene content of from 25 to 75 mol % and a degree of saponification of at least 96%, and (3) from 0.5 to 200 parts by weight per 100 parts by weight of the copolymer (2) of a plasticizer. Molded articles of the resin composition have excellent transparency, moldability, mechanical strength, moisture barrier property, etc. The resin composition can be easily prepared from trimming wastes, wastes of extrusion or the like of multi-layered articles.
Abstract:
A multi-layer laminated structure comprising a polycarbonate or thermoplastic polyester layer having adjacently adhered thereto a layer comprised of a modified olefin polymer having a stiffness modulus of from 100 to 3,000 Kg/cm.sup.2 and a degree of crystallinity of not more than 33%, in which an unsaturated carboxylic acid or the derivative thereof is grafted to at least a part of a polymer consisting of a hydrocarbon. The laminated structure is excellent in moisture impermeability, oxygen barrier property, adhesion durability under a high temperature and high humidity condition, moldability, processability, and the like, and is useful as a packaging material.
Abstract translation:一种多层层叠结构,其包含聚碳酸酯或热塑性聚酯层,其相邻地粘附有由硬度模量为100至3,000Kg / cm 2和结晶度不超过33%的改性烯烃聚合物构成的层, 将不饱和羧酸或其衍生物接枝到由烃组成的聚合物的至少一部分上。 该层压结构在高温和高湿度条件下的不透水性,氧气阻隔性,粘合耐久性,成型性,加工性等方面优异,并且可用作包装材料。
Abstract:
A plurality of connecting wires to be connected to separate devices are arranged regularly and fastened with a string at the front end, the intermediate end and the rear end corresponding to the position of the respective device so as to provide a flat structure including the fastening points in connection with the arrangement in order and the position of each end of the connecting wires so that the wiring can be easily attained to improve productivity; the reading of wiring diagram in the wiring operation is needless by connecting a data card; the flat structure facilitates employment of machines and the combination with a computer allows a fully automatic system. When the connecting wires are bundled, the increase of occupied sectional area is prevented and the occupied sectional area is substantially the same as that of the conventional one. The present invention is suited to the wiring of electric control devices.
Abstract:
A structure of the plasma treatment apparatus is employed in which an upper electrode has projected portions provided with first introduction holes and recessed portions provided with second introduction holes, the first introduction hole of the upper electrode is connected to a first cylinder filled with a gas which is not likely to be dissociated, the second introduction hole is connected to a second cylinder filled with a gas which is likely to be dissociated, the gas which is not likely to be dissociated is introduced into a reaction chamber from an introduction port of the first introduction hole provided on a surface of the projected portion of the upper electrode, and the gas which is likely to be dissociated is introduced into the reaction chamber from an introduction port of the second introduction hole provided on a surface of the recessed portion.
Abstract:
An object is to provide a semiconductor device including an oxide semiconductor film, which has stable electrical characteristics and high reliability. A stack of first and second material films is formed by forming the first material film (a film having a hexagonal crystal structure) having a thickness of 1 nm to 10 nm over an insulating surface and forming the second material film having a hexagonal crystal structure (a crystalline oxide semiconductor film) using the first material film as a nucleus. As the first material film, a material film having a wurtzite crystal structure (e.g., gallium nitride or aluminum nitride) or a material film having a corundum crystal structure (α-Al2O3, α-Ga2O3, In2O3, Ti2O3, V2O3, Cr2O3, or α-Fe2O3) is used.
Abstract translation:本发明的目的是提供一种具有稳定的电气特性和高可靠性的氧化物半导体膜的半导体装置。 通过在绝缘表面上形成厚度为1nm至10nm的第一材料膜(具有六方晶体结构的膜)形成第一和第二材料膜的叠层,并形成具有六方晶系结构的第二材料膜( 使用第一材料膜作为核的结晶氧化物半导体膜)。 作为第一材料膜,具有纤锌矿晶体结构的材料膜(例如氮化镓或氮化铝)或具有刚玉晶体结构的材料膜(α-Al 2 O 3,α-Ga 2 O 3,In 2 O 3,Ti 2 O 3,V 2 O 3,Cr 2 O 3,或 α-Fe 2 O 3)。
Abstract:
There is disclosed a honeycomb structure including a honeycomb structure section including: porous partition walls to divide and form a plurality of cells which extend from one end surface to the other end surface and become through channels of a fluid; and an outer peripheral wall positioned in an outermost periphery. The partition walls and the outer peripheral wall contain silicon carbide particles as an aggregate, and silicon as a binder to bind the silicon carbide particles, thicknesses of the partition walls are from 50 to 200 μm, a cell density is from 50 to 150 cells/cm2, an average particle diameter of silicon carbide as the aggregate is from 3 to 40 μm, and a volume resistivity at 400° C. is from 1 to 40 Ωcm.
Abstract translation:公开了一种蜂窝结构体,其包括蜂窝结构部分,该蜂窝结构部分包括:多孔分隔壁,用于分隔并形成从一个端面延伸到另一端面的多个单元,并且通过流体通道; 以及位于最外周的外周壁。 分隔壁和外周壁包含作为骨料的碳化硅颗粒和作为粘结剂的硅作为结合碳化硅颗粒的分隔壁,隔壁的厚度为50至200μm,电池密度为50至150个/ cm 2,作为骨料的碳化硅的平均粒径为3〜40μm,400℃下的体积电阻率为1〜40Ω·cm。
Abstract:
An object is to provide an n-channel transistor and a p-channel transistor having a preferred structure using an oxide semiconductor. A first source or drain electrode which is electrically connected to a first oxide semiconductor layer and is formed using a stacked-layer structure including a first conductive layer containing a first material and a second conductive layer containing a second material, and a second source or drain electrode which is electrically connected to a second oxide semiconductor layer and is formed using a stacked-layer structure including a third conductive layer containing the first material and a fourth conductive layer containing the second material are included. The first oxide semiconductor layer is in contact with the first conductive layer of the first source or drain electrode, and the second oxide semiconductor layer is in contact with the third and the fourth conductive layers of the second source or drain electrode.