利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

90 条记录 (耗时 0.039 秒)

    AIR GAP STRUCTURE HAVING PROTECTIVE METAL SILICIDE PADS ON A METAL FEATURE
    63.
    发明申请
    AIR GAP STRUCTURE HAVING PROTECTIVE METAL SILICIDE PADS ON A METAL FEATURE 有权
    在金属特征上具有保护性金属硅化物垫的气隙结构

    公开(公告)号：US20090140428A1

    公开(公告)日：2009-06-04

    申请号：US11949189

    申请日：2007-12-03

    申请人： Griselda Bonilla ,  Daniel C. Edelstein ,  Satyanarayana V. Nitta ,  Takeshi Nogami ,  Shom Ponoth ,  David L. Rath ,  Chih-Chao Yang

    发明人： Griselda Bonilla ,  Daniel C. Edelstein ,  Satyanarayana V. Nitta ,  Takeshi Nogami ,  Shom Ponoth ,  David L. Rath ,  Chih-Chao Yang

    IPC分类号： H01L23/52 ,  H01L21/4763

    CPC分类号： H01L23/5222 ,  H01L21/31144 ,  H01L21/7682 ,  H01L21/76849 ,  H01L21/76852 ,  H01L23/53238 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A hard mask is formed on an interconnect structure comprising a low-k material layer and a metal feature embedded therein. A block polymer is applied to the hard mask layer, self-assembled, and patterned to form a polymeric matrix of a polymeric block component and containing cylindrical holes. The hard mask and the low-k material layer therebelow are etched to form cavities. A conductive material is plated on exposed metallic surfaces including portions of top surfaces of the metal feature to form metal pads. Metal silicide pads are formed by exposure of the metal pads to a silicon containing gas. An etch is performed to enlarge and merge the cavities in the low-k material layer. The metal feature is protected from the etch by the metal silicide pads. An interconnect structure having an air gap and free of defects to surfaces of the metal feature is formed.

    摘要翻译： 在包括低k材料层和嵌入其中的金属特征的互连结构上形成硬掩模。 将嵌段聚合物施加到硬掩模层上，自组装和图案化以形成聚合物嵌段组分的聚合物基质并且包含圆柱形孔。 蚀刻硬掩模和低k材料层以形成空腔。 导电材料镀在暴露的金属表面上，包括金属特征的顶表面的部分以形成金属垫。 金属硅化物焊盘通过将金属焊盘暴露于含硅气体而形成。 进行蚀刻以放大和合并低k材料层中的空腔。 通过金属硅化物焊盘防止金属特征被蚀刻。 形成具有空隙并且没有金属特征表面的缺陷的互连结构。

    INTERCONNECT STRUCTURES WITH TERNARY PATTERNED FEATURES GENERATED FROM TWO LITHOGRAPHIC PROCESSES
    66.
    发明申请
    INTERCONNECT STRUCTURES WITH TERNARY PATTERNED FEATURES GENERATED FROM TWO LITHOGRAPHIC PROCESSES 审中-公开
    具有由两个光刻过程产生的三维特征的互连结构

    公开(公告)号：US20080284039A1

    公开(公告)日：2008-11-20

    申请号：US11750892

    申请日：2007-05-18

    申请人： Matthew E. Colburn ,  Elbert Huang ,  Satyanarayana V. Nitta ,  Sampath Purushothaman

    发明人： Matthew E. Colburn ,  Elbert Huang ,  Satyanarayana V. Nitta ,  Sampath Purushothaman

    IPC分类号： H01L23/52 ,  H01L21/4763

    CPC分类号： H01L23/53238 ,  H01L21/76801 ,  H01L21/76808 ,  H01L21/76816 ,  H01L21/7682 ,  H01L23/5222 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method for fabricating an interconnect structure for interconnecting a semiconductor substrate to have three distinct patterned structures such that the interconnect structure provides both a low k and high structural integrity. The method includes depositing an interlayer dielectric onto the semiconductor substrate, forming a first pattern within the interlayer dielectric material by a first lithographic process that results in both via features and ternary features being formed in the interconnect structure. The method further includes forming a second pattern within the interlayer dielectric material by a second lithographic process to form line features within the interconnect structure. Hence the method forms the three separate distinct patterned structures using only two lithographic processes for each interconnect level.

    摘要翻译： 一种制造互连结构的方法，用于将半导体衬底互连以具有三个不同的图案化结构，使得互连结构既提供低k和高结构完整性。 该方法包括在半导体衬底上沉积层间电介质，通过第一光刻工艺在层间电介质材料内形成第一图案，该第一光刻工艺导致在互连结构中形成通孔特征和三元特征。 该方法还包括通过第二光刻工艺在层间电介质材料内形成第二图案以在互连结构内形成线特征。 因此，该方法仅对每个互连级别仅使用两个光刻工艺形成三个独立的不同图案结构。

    Interconnect structure with precise conductor resistance and method to form same
    69.
    发明授权
    Interconnect structure with precise conductor resistance and method to form same 有权
    具有精确导体电阻的互连结构和形成相同的方法

    公开(公告)号：US06710450B2

    公开(公告)日：2004-03-23

    申请号：US09795430

    申请日：2001-02-28

    申请人： Stephen McConnell Gates ,  Jeffrey Curtis Hedrick ,  Satyanarayana V. Nitta ,  Sampath Purushothaman ,  Cristy Sensenich Tyberg

    发明人： Stephen McConnell Gates ,  Jeffrey Curtis Hedrick ,  Satyanarayana V. Nitta ,  Sampath Purushothaman ,  Cristy Sensenich Tyberg

    IPC分类号： H01L23532

    CPC分类号： H01L21/76835 ,  H01L21/02118 ,  H01L21/02126 ,  H01L21/02134 ,  H01L21/02137 ,  H01L21/022 ,  H01L21/02203 ,  H01L21/02282 ,  H01L21/3122 ,  H01L21/76811 ,  H01L21/7684

    摘要： An interconnect structure including a patterned multilayer of spun-on dielectrics as well as methods for manufacturing the same are provided. The interconnect structure includes a patterned multilayer of spun-on dielectrics formed on a surface of a substrate. The patterned multilayer of spun-on dielectrics is composed of a bottom low-k dielectric, a buried etch stop layer, and a top low-k dielectric, wherein the bottom and top low-k dielectrics have a first composition, the said buried etch stop layer has a second composition which is different from the first composition and the buried etch stop layer is covalently bonded to said top and bottom low-k dielectrics. The interconnect structure further includes a polish stop layer formed on the patterned multilayer of spun-on dielectrics; and metal conductive regions formed within the patterned multilayer of spun-on dielectrics. Covalent bonding is achieved by employing an organosilane having functional groups that are capable of bonding with the top and bottom dielectric layers.

    摘要翻译： 提供了包括旋涂电介质的图案化多层的互连结构及其制造方法。 互连结构包括形成在衬底的表面上的旋涂电介质的图案化多层。 旋涂电介质的图案化多层由底部低k电介质，掩埋蚀刻停止层和顶部低k电介质组成，其中底部和顶部低k电介质具有第一组成，所述掩埋蚀刻 停止层具有与第一组成不同的第二组成，并且掩埋蚀刻停止层共价键合到所述顶部和底部低k电介质。 互连结构还包括形成在旋涂电介质的图案化多层上的抛光停止层; 以及形成在旋涂电介质的图案化多层中的金属导电区域。 通过使用具有能够与顶部和底部电介质层结合的官能团的有机硅烷来实现共价键合。