公开(公告)号：US5477339A

公开(公告)日：1995-12-19

申请号：US143137

申请日：1993-10-29

申请人： Kazuhiro Sugawara ,  Toru Maeda ,  Hitoshi Saito ,  Akemi Sato ,  Akira Matsui

发明人： Kazuhiro Sugawara ,  Toru Maeda ,  Hitoshi Saito ,  Akemi Sato ,  Akira Matsui

IPC分类号： H04N1/00 ,  H04N1/32

CPC分类号： H04N1/00029 ,  H04N1/00002 ,  H04N1/00058 ,  H04N1/00082 ,  H04N1/00204 ,  H04N1/32363 ,  H04N1/32683 ,  H04N2201/0074

摘要： Remote data entry is performed in such a manner that a plurality of entry items and a plurality of data items are caused to collectively enter within one communication and the check sum is calculated simultaneously with the data entry so that abnormality of the data is easily detected even if the contents of the entry data are changed due to the abnormality occurring in a facsimile apparatus. Data is collectively stored in a receiving buffer and a great quantity of data is caused to remote enter if the capacity of the buffer permits. After all remote data entries have been completed, the check sums of all entry memory regions are performed so that the memory capacity of the program code of the check sum is saved.

摘要翻译： 执行远程数据输入，使得多个输入项和多个数据项被集体输入到一个通信中，并且与数据输入同时计算校验和，使得甚至容易检测数据的异常 如果输入数据的内容由于在传真设备中发生的异常而改变。 数据被集中存储在接收缓冲器中，并且如果缓冲器的容量允许，则导致大量数据被远程进入。 在完成所有远程数据条目之后，执行所有条目存储器区域的校验和，以便保存校验和的程序代码的存储器容量。

公开(公告)号：US4357965A

公开(公告)日：1982-11-09

申请号：US138917

申请日：1980-04-10

申请人： Yasuo Kosuge ,  Masamori Yakabe ,  Tadanori Oga ,  Toru Maeda

发明人： Yasuo Kosuge ,  Masamori Yakabe ,  Tadanori Oga ,  Toru Maeda

IPC分类号： B65H54/80 ,  B21C47/02 ,  B21C47/14 ,  B21C47/26 ,  B65B27/06 ,  B21F3/04

CPC分类号： B21C47/14 ,  B21C47/26

摘要： In a method for gathering a ring shaped wire rod, particularly a wire rod made of steel, the wire rod is continuously conveyed and gathered in the form of a coil by means of a gathering apparatus including a gathering tub and a coil plate. In accordance with the present invention, the lowering speed of the coil plate is controlled in such a manner that piling position of said rings is always within a predetermined range. In addition, the ring shaped wire rod is dropped, while imparting a movement having a horizontal component to the ring shaped wire rod so as to increase the filling ratio over that of the prior art. The coils gathered in the present invention are more compact than in the prior art.

摘要翻译： 在用于收集环形线材，特别是钢制线材的方法中，线材通过包括收集桶和线圈板的收集装置连续地以线圈的形式传送和收集。 根据本发明，线圈板的下降速度被控制成使得所述环的打桩位置始终在预定范围内。 此外，环形线材掉落，同时赋予环形线材水平部分的运动，以增加填充比率超过现有技术。 在本发明中收集的线圈比现有技术更紧凑。

公开(公告)号：US09196403B2

公开(公告)日：2015-11-24

申请号：US13511061

申请日：2011-05-10

申请人： Toru Maeda ,  Asako Watanabe

发明人： Toru Maeda ,  Asako Watanabe

IPC分类号： H01F1/06 ,  H01F1/08 ,  H01F1/055 ,  H01F1/057 ,  B22F1/00 ,  C22C33/02 ,  C22C38/00

CPC分类号： H01F1/0552 ,  B22F1/0062 ,  B22F2998/10 ,  C22C33/0278 ,  C22C38/002 ,  C22C38/005 ,  C22C2202/02 ,  H01F1/0572 ,  H01F1/0573 ,  H01F1/0575 ,  H01F1/0576 ,  H01F1/0578 ,  H01F1/061 ,  H01F1/083 ,  H01F41/0293 ,  B22F3/02 ,  B22F2003/248

摘要： The present invention provides a powder for a magnetic member being excellent in moldability and difficult to oxidize, a powder compact produced from the powder, and a magnetic member suitable for a raw material of a magnetic member such as a rare earth magnet. A powder for a magnetic member includes magnetic particles 1 which constitute the powder for a magnetic member and each of which is composed of less than 40% by volume of a hydrogen compound 3 of a rare earth element, and the balance composed of an iron-containing material 2 which contains iron and an iron-boron alloy containing iron and boron. The hydrogen compound 3 of a rare earth element is dispersed in a phase of the iron-containing material 2. An antioxidant layer 4 having a low-oxygen permeability coefficient is provided on the surface of each of the magnetic particles 1.

摘要翻译： 本发明提供了一种成型性好，难以氧化的磁性部件粉末，由该粉末制成的粉末成形体，以及适用于稀土类磁铁等磁性部件的原料的磁性部件。 磁性部件用粉末包括构成磁性部件用粉末的磁性粒子1，它们各自由少于40体积％的稀土元素的氢化合物3构成，其余由铁 - 含有铁的含铁材料2和含有铁和硼的铁 - 硼合金。 稀土元素的氢化合物3分散在含铁材料2的相中。在每个磁性粒子1的表面上设置有低氧透过系数的抗氧化层4。

公开(公告)号：US08797137B2

公开(公告)日：2014-08-05

申请号：US13505003

申请日：2011-05-17

申请人： Asako Watanabe ,  Toru Maeda

发明人： Asako Watanabe ,  Toru Maeda

IPC分类号： H01F27/24 ,  H01F27/02 ,  H01F5/00 ,  H01F1/00 ,  H01F1/04 ,  C22C38/06 ,  H01F1/33 ,  H01F1/24 ,  H01F41/02 ,  C22C38/08 ,  C22C38/02 ,  C22C38/00 ,  C22C38/04 ,  H01F3/08

CPC分类号： C22C38/02 ,  B22F1/02 ,  C22C38/002 ,  C22C38/04 ,  C22C38/06 ,  C22C38/08 ,  C22C2202/02 ,  H01F1/24 ,  H01F1/33 ,  H01F3/08 ,  H01F41/0246

摘要： Provided is a soft magnetic powder used for obtaining a dust core having a low hysteresis loss, in particular, in a high temperature range. A soft magnetic powder includes an aggregate of composite magnetic particles, each including a soft magnetic particle containing Fe, Si, and Al, and an insulating coating film disposed on the surface thereof, and satisfies the expressions (1) and (2) below: Expression (1) . . . 27≦2.5a+b≦29 and Expression (2) . . . 6≦b≦9, where a represents the Si content (mass %) and b represents the Al content (mass %). The soft magnetic powder is capable of reducing the hysteresis loss, in a high-temperature environment, of a dust core obtained using the soft magnetic powder.

摘要翻译： 提供一种用于获得具有低磁滞损耗的压粉磁芯的软磁性粉末，特别是在高温范围内。 软磁性粉末包括复合磁性粒子的集合体，各自包含含有Fe，Si，Al的软磁性粒子和配置在其表面的绝缘涂膜，满足下述式（1）和（2）： 表达式（1）。 。 。 27＆nlE; 2.5a + b＆nlE; 29和表达式（2）。 。 。 6＆nlE; b＆nlE; 9，其中a表示Si含量（质量％），b表示Al含量（质量％）。 该软磁性粉末能够降低在高温环境下使用软磁性粉末获得的粉尘芯的磁滞损耗。

公开(公告)号：US08585427B2

公开(公告)日：2013-11-19

申请号：US13046734

申请日：2011-03-12

申请人： Teiji Ukawa ,  Toru Maeda

发明人： Teiji Ukawa ,  Toru Maeda

IPC分类号： H01R13/64

CPC分类号： H01R13/627 ,  H01R11/12 ,  H01R12/774 ,  H01R12/81 ,  H01R13/66 ,  H01R24/28 ,  H01R24/62 ,  H01R24/84 ,  H01R2107/00 ,  H01R2201/12 ,  Y10T29/49204

摘要： A connector includes: a card edge connector; a first cable drawn out from the card edge connector in a first direction; a first terminal disposed in the card edge connector and connected to the first cable; a receptacle into and from which the card edge connector is inserted and extracted; a second cable drawn out from the receptacle in a second direction; and a second terminal disposed in the receptacle and connected to the second cable. Insertion/extraction directions of the card edge connector are substantially perpendicular to at least one of the first direction and the second direction. The card edge connector includes a first end face which is substantially parallel to the insertion/extraction directions, and the receptacle includes a first wall face which is substantially parallel to the insertion/extraction directions. In a state where the card edge connector and the receptacle are coupled to each other, the first end face and the first wall face are in contact with each other.

摘要翻译： 连接器包括：卡缘连接器; 从所述卡边缘连接器沿第一方向拉出的第一电缆; 第一端子，设置在所述卡缘连接器中并连接到所述第一电缆; 卡边缘连接器插入和拔出的插座; 从所述容器沿第二方向拉出的第二电缆; 以及设置在所述插座中并连接到所述第二电缆的第二端子。 卡边缘连接器的插入/取出方向基本上垂直于第一方向和第二方向中的至少一个。 卡边缘连接器包括基本上平行于插入/取出方向的第一端面，并且插座包括基本上平行于插入/取出方向的第一壁面。 在卡边缘连接器和插座彼此联接的状态下，第一端面和第一壁面彼此接触。

公开(公告)号：US08328928B2

公开(公告)日：2012-12-11

申请号：US13055747

申请日：2009-07-08

申请人： Toru Maeda ,  Tetsuro Tanikawa ,  Akinobu Teramoto ,  Masaaki Oda

发明人： Toru Maeda ,  Tetsuro Tanikawa ,  Akinobu Teramoto ,  Masaaki Oda

IPC分类号： C09D11/00 ,  H01B1/02

CPC分类号： B22F1/0062 ,  B22F2999/00 ,  H01L21/4867 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/111 ,  H01L2224/11318 ,  H01L2224/1152 ,  H01L2224/1329 ,  H01L2224/13324 ,  H01L2224/13339 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13364 ,  H01L2224/13369 ,  H01L2224/13399 ,  H01L2224/16 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75745 ,  H01L2224/75753 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/8184 ,  H01L2225/06513 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  B22F1/0018 ,  H01L2924/00014 ,  H01L2924/00

摘要： Metal nanoink (100) for bonding an electrode of a semiconductor die and an electrode of a substrate and/or bonding an electrode of a semiconductor die and an electrode of another semiconductor die by sintering under pressure is produced by injecting oxygen into an organic solvent (105) in the form of oxygen nanobubbles (125) or oxygen bubbles (121) either before or after metal nanoparticles (101) whose surfaces are coated with a dispersant (102) are mixed into the organic solvent (105). Bumps are formed on the electrode of the semiconductor die and the electrode of the substrate by ejecting microdroplets of the metal nanoink (100) onto the electrodes, the semiconductor die is turned upside down and overlapped in alignment over the substrate, and then, the metal nanoparticles of the bumps are sintered under pressure by pressing and heating the bumps between the electrodes. As a result, generation of voids during sintering under pressure is minimized.

摘要翻译： 通过将氧气注入到有机溶剂中来制造用于将半导体管芯的电极和基板的电极接合和/或接合半导体管芯的电极和另一个半导体管芯的电极的金属纳米管（100） 在其表面涂布有分散剂（102）的金属纳米颗粒（101）之前或之后，将氧纳米气泡（125）或氧气（121）的形式混合到有机溶剂（105）中。 通过将金属纳米线（100）的微滴喷射到电极上，在半导体管芯的电极和基板的电极上形成凸起，将半导体管芯上下颠倒并重叠在衬底上，然后将金属 通过按压和加热电极之间的凸块，在凸起的纳米颗粒被烧结。 结果，在压力下烧结过程中产生的空隙被最小化。

公开(公告)号：US07975901B2

公开(公告)日：2011-07-12

申请号：US12794911

申请日：2010-06-07

申请人： Toru Maeda ,  Tetsuya Utano ,  Akinobu Teramoto

发明人： Toru Maeda ,  Tetsuya Utano ,  Akinobu Teramoto

IPC分类号： B23K31/02 ,  B23K37/00 ,  C23F1/00

CPC分类号： H01L24/85 ,  B23K20/007 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85009 ,  H01L2224/85013 ,  H01L2224/85045 ,  H01L2224/85065 ,  H01L2224/85075 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01018 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/00014 ,  H01L2924/01001 ,  H01L2924/00

摘要： A bonding apparatus including a chamber for maintaining an inert gas atmosphere; a first plasma torch for performing a surface treatment on pads and electrodes, the first plasma torch being attached in the chamber, to apply gas plasma to a substrate and a semiconductor chip that is placed inside the chamber; a second plasma torch for performing a surface treatment on an initial ball and/or wire at a tip end of a capillary that is positioned inside the chamber, the second plasma torch being attached in the chamber, to apply gas plasma to the initial ball and/or wire; and a bonding unit for bonding the surface-treated initial ball and/or wire to the surface-treated pads and electrodes in the chamber, thereby cleaning of the surface of the electrodes and pads as well as the wire can be effectively performed.

摘要翻译： 一种接合装置，包括用于维持惰性气体气氛的室; 用于对焊盘和电极执行表面处理的第一等离子体焰炬，第一等离子体焰炬附接在腔室中，以将气体等离子体施加到衬底和放置在腔室内的半导体芯片; 第二等离子体焰炬，用于对位于所述腔室内的毛细管的前端处的初始球和/或线进行表面处理，所述第二等离子体焰炬附接在所述腔室中，以将气体等离子体施加到所述初始球体;以及 /或电线; 以及用于将表面处理的初始球和/或线结合到腔室中的表面处理的垫和电极的接合单元，从而可以有效地执行电极和垫的表面以及线的清洁。

公开(公告)号：US07738130B2

公开(公告)日：2010-06-15

申请号：US11625122

申请日：2007-01-19

申请人： Toru Maeda

发明人： Toru Maeda

IPC分类号： G06F15/16 ,  H04N1/32

CPC分类号： H04N1/00214 ,  H04L12/5692 ,  H04L51/00 ,  H04L51/066 ,  H04N1/00209 ,  H04N1/00212 ,  H04N1/00217 ,  H04N1/0022 ,  H04N1/32117 ,  H04N1/32122 ,  H04N1/33323 ,  H04N1/33338 ,  H04N1/33376 ,  H04N1/33392 ,  H04N2201/002 ,  H04N2201/0067 ,  H04N2201/0068 ,  H04N2201/0086 ,  H04N2201/3205 ,  H04N2201/3208 ,  H04N2201/3209 ,  H04N2201/3274 ,  H04N2201/33342 ,  H04N2201/33364 ,  H04N2201/33378

摘要： Disclosed is an Internet FAX apparatus which, after receiving an Internet address from a certain destination, can communicate with the same destination in later transmission or during communication by connecting to a LAN and switching to an Internet FAX mode requiring no communication charge. An Internet facsimile apparatus on the receiving side transmits its Internet facsimile function and Internet address on an NSF signal in a standard protocol of G3 facsimile transmission and/or transmits its telephone number, Internet facsimile function, and Internet address on TSI and NSS signals in the standard protocol of G3 facsimile communication. The Internet facsimile apparatus registers an Internet facsimile function and Internet address of a partner apparatus as destination data. The Internet facsimile apparatus communicates with the partner apparatus by using the Internet address in the destination data in later transmission or by disconnecting ordinary facsimile mode communication and switching to the Internet FAX mode.

摘要翻译： 公开了一种互联网传真设备，其在从特定目的地接收到因特网地址之后可以在稍后的传输中或在通信期间通过连接到LAN并切换到不需要通信费用的因特网传真模式来与之通信。 接收侧的因特网传真装置以G3传真发送的标准协议在NSF信号上发送其因特网传真功能和因特网地址，和/或在TSI和NSS信号中发送其电话号码，因特网传真功能和因特网地址 G3传真通信标准协议。 互联网传真装置将对方装置的因特网传真功能和因特网地址登录为目的地数据。 互联网传真装置通过在以后的传输中使用目的地数据中的因特网地址或通过断开普通传真模式通信并切换到因特网传真模式来与对方装置进行通信。

公开(公告)号：US07576297B2

公开(公告)日：2009-08-18

申请号：US11480195

申请日：2006-06-30

申请人： Kazuo Fujita ,  Toru Maeda

发明人： Kazuo Fujita ,  Toru Maeda

IPC分类号： B23K10/00

CPC分类号： H01L24/85 ,  B23K20/005 ,  B23K2101/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/78252 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/7865 ,  H01L2224/85009 ,  H01L2224/85013 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85201 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00015

摘要： A bonding apparatus including a capillary 40 having a high-frequency coil 50 on its tip end portion and allowing a bonding wire 2 to pass therethrough, a position changing unit for changing the position of the tip of the bonding wire, a gas supply unit for supplying gas into the capillary, and a high-frequency power supply unit for supplying high-frequency power to the high-frequency coil. When the bonding wire is outside a plasma region 52 in the capillary, a microplasma generated in the plasma region is ejected out of the capillary and removes foreign matter or contaminants on the surface of a bonding subject. When the bonding wire is inside the plasma region, the material of the bonding wire is turned into fine particles, and a microplasma 303 containing sputtered fine particles is ejected from the capillary, allowing the material the same as the bonding wire to be deposited on the bonding subject.

摘要翻译： 一种接合装置，包括：毛细管40，其顶端部具有高频线圈50，并使接合线2通过;位置改变单元，用于改变接合线的前端的位置;气体供给单元， 向毛细管供应气体，以及用于向高频线圈提供高频电力的高频电源单元。 当接合线在毛细管中的等离子体区域52之外时，在等离子体区域中产生的微血浆从毛细管中排出，并去除粘合对象表面上的异物或污染物。 当接合线在等离子体区域内时，接合线的材料变成微细的颗粒，并且从毛细管喷出含有溅射的细颗粒的微量的等离子体303，使得与接合线相同的材料沉积在 绑定主体。

公开(公告)号：US20080093416A1

公开(公告)日：2008-04-24

申请号：US11818754

申请日：2007-06-15

申请人： Tetsuya Utano ,  Yutaka Kondo ,  Toru Maeda

发明人： Tetsuya Utano ,  Yutaka Kondo ,  Toru Maeda

IPC分类号： B23K1/06 ,  B23K1/00 ,  B23K3/00

CPC分类号： B23K20/004 ,  B23K2101/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/78252 ,  H01L2224/78302 ,  H01L2224/78308 ,  H01L2224/78313 ,  H01L2224/78318 ,  H01L2224/851 ,  H01L2224/85181 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01049

摘要： A tip end portion and an outer surface of a capillary (or of a wedge tool) used in, for instance, a wire bonding apparatus and method, being covered by a diamond layer with a heating element attached to the outer surface thereof. The inside of the capillary is formed by alumina ceramics, having a tapered hole. The tip end of the capillary is formed by the diamond layer, and a face portion and an inner chamfer portion are formed at the tip end to make a wire heating portion. Heat is transferred from the heating element to the wire heating portion through a heat supply path formed by the diamond layer, and a bonding surface formed by a wire and a pad is heated.

摘要翻译： 在例如引线接合装置和方法中使用的毛细管（或楔形工具）的前端部分和外表面被金刚石层覆盖，加热元件附接到其外表面。 毛细管内部由具有锥形孔的氧化铝陶瓷形成。 毛细管的前端由金刚石层形成，并且在前端形成面部和内倒角部，以形成线加热部。 通过由金刚石层形成的供热路径将加热元件从加热元件传递到线加热部分，并且加热由金属丝和焊盘形成的接合表面。