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67 条记录 (耗时 0.034 秒)

    Wiring structure of laminated capacitors
    61.
    发明授权
    Wiring structure of laminated capacitors 有权
    层压电容器的接线结构

    公开(公告)号：US07742276B2

    公开(公告)日：2010-06-22

    申请号：US11950381

    申请日：2007-12-04

    申请人： Chien-Min Hsu ,  Shih-Hsien Wu ,  Min-Lin Lee ,  Shinn-Juh Lai

    发明人： Chien-Min Hsu ,  Shih-Hsien Wu ,  Min-Lin Lee ,  Shinn-Juh Lai

    IPC分类号： H01G4/228

    CPC分类号： H05K1/162 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/112 ,  H05K3/429 ,  H05K3/4688 ,  H05K2201/0792 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/09636 ,  H05K2201/10734 ,  H01L2224/0401

    摘要： The present invention relates to a wiring structure for reducing the equivalent series inductance (ESL) of a laminated capacitor. The laminated capacitor comprises a number of conductive layers, a power via extending along a thickness direction of the laminated capacitor and arranged to extend from the top conductive layer to the bottom conductive layer, and a ground via extending along the thickness direction of the laminated capacitor and arranged to extend from the top conductive layer to the bottom conductive layer. The conductive layers include a set of first conductive layers and a set of second conductive layers. The power via is electrically coupled to the first conductive layers and the ground via is electrically coupled to the second conductive layers. The laminated capacitor further comprises a supplemental via between the power via and the ground via. The supplemental via is shorter in length than the power via and the ground via. The supplemental via is electrically coupled to one of the first conductive layers and the second conductive layer.

    摘要翻译： 本发明涉及一种用于降低层叠电容器的等效串联电感（ESL）的布线结构。 层叠电容器包括多个导电层，沿层叠电容器的厚度方向延伸的电力通孔，并且从顶部导电层延伸至底部导电层，沿着层叠电容器的厚度方向延伸的接地通孔 并布置成从顶部导电层延伸到底部导电层。 导电层包括一组第一导电层和一组第二导电层。 电源通孔电耦合到第一导电层，并且接地通孔电耦合到第二导电层。 层叠电容器还包括电源通孔和接地通孔之间的补充通路。 补充通孔的长度要短于电源通孔和接地通孔。 辅助通孔电耦合到第一导电层和第二导电层之一。

    CAPACITOR DEVICES WITH CO-COUPLING ELECTRODE PLANES
    63.
    发明申请
    CAPACITOR DEVICES WITH CO-COUPLING ELECTRODE PLANES 有权
    具有CO耦合电极平面的电容器件

    公开(公告)号：US20090213526A1

    公开(公告)日：2009-08-27

    申请号：US12390237

    申请日：2009-02-20

    申请人： Chien-Min Hsu ,  Min-Lin Lee ,  Shinn-Juh Lai ,  Chen-Hsuan Chiu

    发明人： Chien-Min Hsu ,  Min-Lin Lee ,  Shinn-Juh Lai ,  Chen-Hsuan Chiu

    IPC分类号： H01G4/228 ,  H05K1/18

    CPC分类号： H01G4/005 ,  H01G4/228 ,  H01L2224/16225 ,  H05K1/0231 ,  H05K1/0298 ,  H05K1/112 ,  H05K1/162 ,  H05K3/429 ,  H05K2201/09309 ,  H05K2201/09672 ,  H05K2201/09845 ,  H05K2201/10734

    摘要： A capacitive module is provided. The capacitive module may include a first capacitor including a first electrode and a second electrode, one of the first electrode and the second electrode being coupled to at least one first conductive via and the other one of the first electrode and the second electrode being coupled to at least one second conductive via. The capacitive module may also include a second capacitor spaced apart from the first capacitor, the second capacitor including a third electrode and a fourth electrode, one of the third electrode and the fourth electrode being coupled to the at least one first conductive via and the other one of the third electrode and the fourth electrode being coupled to the at least one second conductive via. Furthermore, the capacitive module may include a first conductive plane being electrically coupled to a first plane with a first polarity through one of the at least one first conductive via and a second conductive plane being electrically coupled to a second plane with a second polarity, opposite to the first polarity, through one of the at least one second conductive via.

    摘要翻译： 提供电容模块。 电容性模块可以包括包括第一电极和第二电极的第一电容器，第一电极和第二电极中的一个耦合到至少一个第一导电通孔，而第一电极和第二电极中的另一个耦合到 至少一个第二导电通孔。 电容性模块还可以包括与第一电容器间隔开的第二电容器，第二电容器包括第三电极和第四电极，第三电极和第四电极中的一个耦合到至少一个第一导电通孔和另一个 第三电极和第四电极中的一个耦合到至少一个第二导电通孔。 此外，电容性模块可以包括第一导电平面，其通过第一导电通孔中的一个与第一极性电耦合到第一平面，第二导电平面电耦合到具有第二极性的第二平面， 通过至少一个第二导电通孔中的一个延伸到第一极性。

    HYBRID CAPACITOR
    65.
    发明申请
    HYBRID CAPACITOR 有权
    混合电容器

    公开(公告)号：US20090161298A1

    公开(公告)日：2009-06-25

    申请号：US12050188

    申请日：2008-03-18

    申请人： Min-Lin Lee ,  Li-Duan Tsai ,  Shur-Fen Liu ,  Bang-Hao Wu ,  Cheng-Liang Cheng

    发明人： Min-Lin Lee ,  Li-Duan Tsai ,  Shur-Fen Liu ,  Bang-Hao Wu ,  Cheng-Liang Cheng

    IPC分类号： H01G9/26 ,  H01G9/15

    CPC分类号： H01G9/15 ,  H01G9/0029 ,  H01G9/012 ,  H01L23/642 ,  H01L28/40 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/19015 ,  H01L2924/3011 ,  H01L2924/00

    摘要： A hybrid capacitor is provided which includes a substrate, at least one plate capacitor and at least one through hole capacitor. The substrate has through holes and the plate capacitors are on the substrate. At least one through hole capacitor and at least one plate capacitor are in parallel. The through hole capacitor at least includes an anode layer, a first dielectric layer, a first cathode layer and a second cathode layer. The anode layer is disposed on an inner surface of at least one through hole, and a surface of the anode layer is a porous structure. The first dielectric layer is disposed on the porous structure of the anode layer and covered with the first cathode layer. The first cathode layer is covered with the second cathode layer. A conductivity of the second cathode layer is larger than a conductivity of the first cathode layer.

    摘要翻译： 提供了一种混合电容器，其包括基板，至少一个平板电容器和至少一个通孔电容器。 衬底具有通孔，并且板电容器在衬底上。 至少一个通孔电容器和至少一个平板电容器是并联的。 通孔电容器至少包括阳极层，第一电介质层，第一阴极层和第二阴极层。 阳极层设置在至少一个通孔的内表面上，阳极层的表面是多孔结构。 第一介电层设置在阳极层的多孔结构上并被第一阴极层覆盖。 第一阴极层被第二阴极层覆盖。 第二阴极层的导电率大于第一阴极层的导电率。

    THROUGH HOLE CAPACITOR AND METHOD OF MANUFACTURING THE SAME
    66.
    发明申请
    THROUGH HOLE CAPACITOR AND METHOD OF MANUFACTURING THE SAME 有权
    通孔电容器及其制造方法

    公开(公告)号：US20090159322A1

    公开(公告)日：2009-06-25

    申请号：US12046422

    申请日：2008-03-11

    申请人： Bang-Hao Wu ,  Li-Duan Tsai ,  Min-Lin Lee ,  Cheng-Liang Cheng

    发明人： Bang-Hao Wu ,  Li-Duan Tsai ,  Min-Lin Lee ,  Cheng-Liang Cheng

    IPC分类号： H05K1/18 ,  H01G4/35

    CPC分类号： H05K1/162 ,  H01G9/012 ,  H01G11/48 ,  H05K2201/09809 ,  H05K2203/0315 ,  Y02E60/13 ,  Y10T29/417 ,  Y10T29/435

    摘要： A through hole capacitor at least including a substrate, an anode layer, a dielectric layer, a first cathode layer, and a second cathode layer is provided. The substrate has a plurality of through holes. The anode layer is disposed on the inner surface of at least one through hole, and the surface of the anode layer is a porous structure. The dielectric layer is disposed on the porous structure of the anode layer. The first cathode layer covers a surface of the dielectric layer. The second cathode layer covers a surface of the first cathode layer, and the conductivity of the second cathode layer is greater than that of the first cathode layer. The through hole capacitor can be used for impedance control, as the cathode layers of the through hole are used for signal transmission.

    摘要翻译： 提供至少包括基板，阳极层，电介质层，第一阴极层和第二阴极层的通孔电容器。 基板具有多个通孔。 阳极层设置在至少一个通孔的内表面上，阳极层的表面是多孔结构。 电介质层设置在阳极层的多孔结构上。 第一阴极层覆盖电介质层的表面。 第二阴极层覆盖第一阴极层的表面，第二阴极层的导电率大于第一阴极层的导电率。 通孔电容器可用于阻抗控制，因为通孔的阴极层用于信号传输。