-
公开(公告)号：US20190012514A1
公开(公告)日：2019-01-10
申请号：US16131247
申请日：2018-09-14
Applicant: CORNING INCORPORATED
Inventor： Yuhui Jin , Matthew Evan Wilhelm
IPC: G06K9/00 , C03C17/36 , B23K26/382 , B23K26/53 , B23K26/00 , H05K5/00 , H05K3/40 , H05K3/22 , H05K3/00 , H05K1/11 , H05K1/03 , C03C23/00 , C03C21/00 , C03C15/00 , C03B33/02 , B23K26/402 , B23K26/386 , B23K101/42 , B23K103/00
CPC classification number: G06K9/00013 , B23K26/0006 , B23K26/382 , B23K26/386 , B23K26/389 , B23K26/402 , B23K26/53 , B23K2101/42 , B23K2103/54 , C03B33/0222 , C03C15/00 , C03C17/36 , C03C17/3649 , C03C17/3668 , C03C21/002 , C03C23/0025 , H05K1/0306 , H05K1/115 , H05K3/002 , H05K3/0029 , H05K3/22 , H05K3/4038 , H05K5/0017 , H05K2201/09509 , H05K2201/10151
Abstract: A glass sensor substrate including metallizable through vias and related process is provided. The glass substrate has a first major surface, a second major surface and an average thickness of greater than 0.3 mm. A plurality of etch paths are created through the glass substrate by directing a laser at the substrate in a predetermined pattern. A plurality of through vias through the glass substrate are etched along the etch paths using a hydroxide based etching material. The hydroxide based etching material highly preferentially etches the substrate along the etch path. Each of the plurality of through vias is long compared to their diameter for example such that a ratio of the thickness of the glass substrate to a maximum diameter of each of the through vias is greater than 8 to 1.
-
公开(公告)号：US20170335466A1
公开(公告)日：2017-11-23
申请号：US15672599
申请日：2017-08-09
Applicant: CORNING INCORPORATED
Inventor： Jeffrey John Domey , John Tyler Keech , Xinghua Li , Garrett Andrew Piech , Arie Bruce Shorey , Paul John Shustack , John Christopher Thomas
IPC: C23F4/04 , C03B33/10 , C03B33/02 , B23K26/386 , B23K26/18 , B23K26/0622 , B23K26/382 , H05K3/00 , B23K26/40 , B23K103/00
CPC classification number: C23F4/04 , B23K26/0622 , B23K26/18 , B23K26/386 , B23K26/389 , B23K26/40 , B23K2103/50 , B23K2103/54 , C03B33/0222 , C03B33/102 , H05K3/0026 , Y10T428/24322
Abstract: A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.
-
63.发明申请公开(公告)号：US20170326689A1
公开(公告)日：2017-11-16
申请号：US15593906
申请日：2017-05-12
Applicant: Purdue Research Foundation
Inventor： Alexander Wei , Naveen Reddy Kadasala , Gary J. Cheng , Mojib Saei
IPC: B23K26/386 , H05K3/04 , H01L21/677 , H01L21/027 , H01L21/02 , H05K3/42
CPC classification number: B23K26/386 , B23K26/18 , B23K26/389 , B23K2103/42 , C03C14/006 , C03C23/0025 , C03C2214/08 , H01L21/0203 , H01L21/02422 , H01L21/0275 , H01L21/67709 , H05K3/04 , H05K3/42
Abstract: Methods and products formed thereby that include depositing a light-absorbing particle on a substrate and irradiating the particle with a pulsed laser beam to cause an increase in local temperature of a portion of the substrate contacted by and adjacent to the particle, enabling the particle to penetrate and migrate through the substrate to form a pore. The methods may include additional steps of applying a magnetic field gradient to the particle as the particle is irradiated with the laser beam in order to promote the movement of the particle within the substrate or to direct the movement of the particle within the substrate, and/or the step of filling the pore with a material that provides a functional capability independent of the properties of the substrate.
-
公开(公告)号：US20170197279A1
公开(公告)日：2017-07-13
申请号：US15321487
申请日：2015-08-19
Applicant: M-SOLV LTD.
Inventor： David Charles MILNE , Philip Thomas RUMSBY , David Thomas Edmund MYLES
IPC: B23K26/386 , B23K26/082 , H05K3/00 , B23K26/06
CPC classification number: B23K26/386 , B23K26/0643 , B23K26/0648 , B23K26/082 , B23K26/389 , B23K2101/42 , H05K3/0032 , H05K3/0035 , H05K3/0038 , H05K3/465 , H05K2203/107 , H05K2203/163
Abstract: Apparatus and methods are disclosed for performing laser ablation. In an example arrangement a spatial light modulator (54) is used to modulate a pulsed laser beam from a solid state laser (52). A two-stage de-magnification process (58, 62) is used to allow radiation intensity to be kept relatively low at the spatial light modulator (54) while allowing access to feedback sensors (64) in an intermediate imaging plane.
-
公开(公告)号：US20170103249A1
公开(公告)日：2017-04-13
申请号：US15286803
申请日：2016-10-06
Applicant: CORNING INCORPORATED
Inventor： Yuhui Jin , Matthew Evan Wilhelm
IPC: G06K9/00 , C03C15/00 , H05K3/00 , H05K3/40 , B23K26/53 , H05K3/22 , H05K1/11 , H05K5/00 , B23K26/00 , C03C23/00 , H05K1/03
CPC classification number: G06K9/00013 , B23K26/0006 , B23K26/382 , B23K26/386 , B23K26/389 , B23K26/402 , B23K26/53 , B23K2101/42 , B23K2103/54 , C03B33/0222 , C03C15/00 , C03C17/36 , C03C17/3649 , C03C17/3668 , C03C21/002 , C03C23/0025 , H05K1/0306 , H05K1/115 , H05K3/002 , H05K3/0029 , H05K3/22 , H05K3/4038 , H05K5/0017 , H05K2201/09509 , H05K2201/10151
Abstract: A glass sensor substrate including metallizable through vias and related process is provided. The glass substrate has a first major surface, a second major surface and an average thickness of greater than 0.3 mm. A plurality of etch paths are created through the glass substrate by directing a laser at the substrate in a predetermined pattern. A plurality of through vias through the glass substrate are etched along the etch paths using a hydroxide based etching material. The hydroxide based etching material highly preferentially etches the substrate along the etch path. Each of the plurality of through vias is long compared to their diameter for example such that a ratio of the thickness of the glass substrate to a maximum diameter of each of the through vias is greater than 8 to 1.
-
Patent Agency Ranking
公开(公告)号：US09561560B2
公开(公告)日：2017-02-07
申请号：US14132199
申请日：2013-12-18
Applicant: UNITED TECHNOLOGIES CORPORATION
Inventor： Richard F. Norman
CPC classification number: B23K26/034 , B23K26/032 , B23K26/386 , B23K26/389 , B23K2101/001
Abstract: In accordance with one aspect of the disclosure, a drill and detection system is disclosed. The system may include a drill and a thermal detector spaced apart from the drill. The drill may be directed in a first direction and the thermal detector may be directed in a second direction opposite the first direction.
Abstract translation: 根据本公开的一个方面，公开了一种钻探和检测系统。 该系统可以包括与钻头间隔开的钻头和热探测器。 钻头可以在第一方向上引导，并且热检测器可以在与第一方向相反的第二方向上被引导。
-
公开(公告)号：US09221124B2
公开(公告)日：2015-12-29
申请号：US14098229
申请日：2013-12-05
Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.
Inventor： Jeffrey A. Albelo , Peter Pirogovsky
CPC classification number: B23K26/364 , B23K26/0624 , B23K26/384 , B23K26/386 , B23K26/389 , B23K26/40 , B23K2101/40 , B23K2103/50
Abstract: Systems and methods are provided for scribing wafers with short laser pulses so as to reduce the ablation threshold of target material. In a stack of material layers, a minimum laser ablation threshold based on laser pulse width is determined for each of the layers. The highest of the minimum laser ablation thresholds is selected and a beam of one or more laser pulses is generated having a fluence in a range between the selected laser ablation threshold and approximately ten times the selected laser ablation threshold. In one embodiment, a laser pulse width in a range of approximately 0.1 picosecond to approximately 1000 picoseconds is used. In addition, or in other embodiments, a high pulse repetition frequency is selected to increase the scribing speed. In one embodiment, the pulse repetition frequency is in a range between approximately 100 kHz and approximately 100 MHz.
Abstract translation: 提供了用短激光脉冲刻划晶片的系统和方法，以减少目标材料的消融阈值。 在堆叠的材料层中，针对每个层确定基于激光脉冲宽度的最小激光烧蚀阈值。 选择最小激光消融阈值中的最高值，并且产生一个或多个激光脉冲的光束，其具有在所选择的激光烧蚀阈值和所选激光烧蚀阈值的大约十倍之间的范围内的能量密度。 在一个实施例中，使用在约0.1皮秒至约1000皮秒范围内的激光脉冲宽度。 另外或在其他实施例中，选择高脉冲重复频率以增加划线速度。 在一个实施例中，脉冲重复频率在大约100kHz到大约100MHz之间的范围内。
-
公开(公告)号：US20140301425A1
公开(公告)日：2014-10-09
申请号：US14132199
申请日：2013-12-18
Applicant: United Technologies Corporation
Inventor： Richard F. Norman
IPC: G01N25/72
CPC classification number: B23K26/034 , B23K26/032 , B23K26/386 , B23K26/389 , B23K2101/001
Abstract: In accordance with one aspect of the disclosure, a drill and detection system is disclosed. The system may include a drill and a thermal detector spaced apart from the drill. The drill may be directed in a first direction and the thermal detector may be directed in a second direction opposite the first direction.
Abstract translation: 根据本公开的一个方面，公开了一种钻探和检测系统。 该系统可以包括与钻头间隔开的钻头和热探测器。 钻头可以在第一方向上引导，并且热检测器可以在与第一方向相反的第二方向上被引导。
-
69.发明申请公开(公告)号：US20140147623A1
公开(公告)日：2014-05-29
申请号：US14092536
申请日：2013-11-27
Applicant: CORNING INCORPORATED
Inventor： Aric Bruce Shorey , Garrett Andrew Piech , Xinghua Li , John Christopher Thomas , John Tyler Keech , Jeffrey John Domey , Paul John Shustack
CPC classification number: C23F4/04 , B23K26/0622 , B23K26/18 , B23K26/386 , B23K26/389 , B23K26/40 , B23K2103/50 , B23K2103/54 , C03B33/0222 , C03B33/102 , H05K3/0026 , Y10T428/24322
Abstract: A method for forming a plurality of precision holes in a substrate by drilling, including affixing a sacrificial cover layer to a surface of the substrate, positioning a laser beam in a predetermined location relative to the substrate and corresponding to a desired location of one of the plurality of precision holes, forming a through hole in the sacrificial cover layer by repeatedly pulsing a laser beam at the predetermined location, and pulsing the laser beam into the through hole formed in the sacrificial cover layer. A work piece having precision holes including a substrate having the precision holes formed therein, wherein a longitudinal axis of each precision hole extends in a thickness direction of the substrate, and a sacrificial cover layer detachably affixed to a surface of the substrate, such that the sacrificial cover layer reduces irregularities of the precision holes.
Abstract translation: 一种用于通过钻孔在基板中形成多个精密孔的方法，包括将牺牲覆盖层固定到基板的表面，将激光束相对于基板定位在预定位置，并且对应于 多个精密孔，通过在预定位置重复地激励激光束在牺牲覆盖层中形成通孔，并将激光束脉冲到形成在牺牲覆盖层中的通孔中。 一种具有精密孔的工件，包括其中形成有精密孔的基板，其中每个精密孔的纵轴在基板的厚度方向上延伸，并且牺牲盖层可拆卸地固定到基板的表面，使得 牺牲覆盖层减少精密孔的不规则性。
-
公开(公告)号：US20140091069A1
公开(公告)日：2014-04-03
申请号：US14098229
申请日：2013-12-05
Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.
Inventor： Jeffrey A. Albelo , Peter Pirogovsky
IPC: B23K26/36
CPC classification number: B23K26/364 , B23K26/0624 , B23K26/384 , B23K26/386 , B23K26/389 , B23K26/40 , B23K2101/40 , B23K2103/50
Abstract: Systems and methods are provided for scribing wafers with short laser pulses so as to reduce the ablation threshold of target material. In a stack of material layers, a minimum laser ablation threshold based on laser pulse width is determined for each of the layers. The highest of the minimum laser ablation thresholds is selected and a beam of one or more laser pulses is generated having a fluence in a range between the selected laser ablation threshold and approximately ten times the selected laser ablation threshold. In one embodiment, a laser pulse width in a range of approximately 0.1 picosecond to approximately 1000 picoseconds is used. In addition, or in other embodiments, a high pulse repetition frequency is selected to increase the scribing speed. In one embodiment, the pulse repetition frequency is in a range between approximately 100 kHz and approximately 100 MHz.
Abstract translation: 提供了用短激光脉冲刻划晶片的系统和方法，以减少目标材料的消融阈值。 在堆叠的材料层中，针对每个层确定基于激光脉冲宽度的最小激光烧蚀阈值。 选择最小激光消融阈值中的最高值，并且产生一个或多个激光脉冲的光束，其具有在所选择的激光烧蚀阈值和所选激光烧蚀阈值的大约十倍之间的范围内的能量密度。 在一个实施例中，使用在约0.1皮秒至约1000皮秒范围内的激光脉冲宽度。 另外或在其他实施例中，选择高脉冲重复频率以增加划线速度。 在一个实施例中，脉冲重复频率在大约100kHz到大约100MHz之间的范围内。
-
-
-
-
-
-
-
-
-
Search Results
109
records
(took 0.02 seconds)
