公开(公告)号：US20130056751A1

公开(公告)日：2013-03-07

申请号：US13696569

申请日：2010-05-07

Applicant: Afshin Ziaei ,  Matthieu Le Baillif

Inventor： Afshin Ziaei ,  Matthieu Le Baillif

IPC: H01L29/20 ,  H01L21/02

CPC classification number: B81C1/00246 ,  B81B2201/016 ,  B81C2203/0735 ,  H01H59/0009

Abstract: Methods of fabrication of electronic modules comprise, on the one hand, power electronic components fabricated on a substrate made of gallium nitride (GaN) and, on the other hand, micro-switches using electrostatic activation of the MEMS (Micro Electro Mechanical System) type. The electronic components and the micro-switches are fabricated on a single gallium nitride substrate and the fabrication method comprises at least the following steps: fabrication of the power components on the gallium nitride substrate; deposition of a first common passivation layer on said components and on the substrate; fabrication of the micro-switches on said substrate.

Abstract translation: 电子模块的制造方法一方面包括制造在由氮化镓（GaN）制成的衬底上的功率电子部件，另一方面，使用使用MEMS（微机电系统）型的静电激活的微型开关 。 电子部件和微型开关在单个氮化镓衬底上制造，并且制造方法至少包括以下步骤：在氮化镓衬底上制造功率部件; 在所述组件和衬底上沉积第一公共钝化层; 所述基板上的微型开关的制造。

公开(公告)号：US20120319528A1

公开(公告)日：2012-12-20

申请号：US13164331

申请日：2011-06-20

Applicant: Christopher V. JAHNES ,  Anthony K. STAMPER

Inventor： Christopher V. JAHNES ,  Anthony K. STAMPER

IPC: H02N1/00 ,  H05K13/00

CPC classification number: H01H59/0009 ,  B81B3/001 ,  B81B7/0006 ,  B81B2201/016 ,  B81B2203/0118 ,  B81B2203/04 ,  B81C1/0015 ,  B81C1/00293 ,  B81C2203/0145 ,  G06F17/5045 ,  G06F17/5068 ,  H01H1/0036 ,  H01H2001/0057 ,  Y10T29/49121

Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming fixed actuator electrodes and a contact point on a substrate. The method further includes forming a MEMS beam over the fixed actuator electrodes and the contact point. The method further includes forming an array of actuator electrodes in alignment with portions of the fixed actuator electrodes, which are sized and dimensioned to prevent the MEMS beam from collapsing on the fixed actuator electrodes after repeating cycling. The array of actuator electrodes are formed in direct contact with at least one of an underside of the MEMS beam and a surface of the fixed actuator electrodes.

Abstract translation: 提供微机电系统（MEMS）结构，制造方法和设计结构。 形成MEMS结构的方法包括在基板上形成固定的致动器电极和接触点。 该方法还包括在固定的致动器电极和接触点上形成MEMS光束。 该方法还包括形成与固定致动器电极的部分对准的致动器电极阵列，其尺寸和尺寸被设计成防止MEMS光束在重复循环之后塌陷在固定的致动器电极上。 致动器电极阵列形成为与MEMS光束的下侧和固定的致动器电极的表面中的至少一个直接接触。

公开(公告)号：US20120319527A1

公开(公告)日：2012-12-20

申请号：US13164323

申请日：2011-06-20

Applicant: Christopher V. JAHNES ,  Anthony K. STAMPER

Inventor： Christopher V. JAHNES ,  Anthony K. STAMPER

IPC: H02N1/00 ,  H05K13/00

CPC classification number: B81B3/001 ,  B81B3/0021 ,  B81B3/0059 ,  B81B3/0072 ,  B81B7/0006 ,  B81B7/008 ,  B81B2201/016 ,  B81B2203/0163 ,  B81C1/00015 ,  B81C1/0015 ,  B81C1/00476 ,  G06F17/5045 ,  H01L41/094 ,  H01L41/1134 ,  H01L41/1138 ,  Y10T29/49002 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49121

Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming a wiring layer on a substrate comprising actuator electrodes and a contact electrode. The method further includes forming a MEMS beam above the wiring layer. The method further includes forming at least one spring attached to at least one end of the MEMS beam. The method further includes forming an array of mini-bumps between the wiring layer and the MEMS beam.

Abstract translation: 提供微机电系统（MEMS）结构，制造方法和设计结构。 形成MEMS结构的方法包括在包括致动器电极和接触电极的基板上形成布线层。 该方法还包括在布线层上方形成MEMS光束。 该方法还包括形成至少一个连接到MEMS梁的至少一端的弹簧。 该方法还包括在布线层和MEMS光束之间形成微小凸块的阵列。

公开(公告)号：US07972884B2

公开(公告)日：2011-07-05

申请号：US12399348

申请日：2009-03-06

Applicant: Susumu Obata ,  Michinobu Inoue ,  Takeshi Miyagi

Inventor： Susumu Obata ,  Michinobu Inoue ,  Takeshi Miyagi

IPC: H01L21/00

CPC classification number: B81B3/0078 ,  B81B2201/016 ,  B81B2203/0109 ,  H01H1/50 ,  H01H3/60 ,  H01H59/0009 ,  Y10T29/49002

Abstract: An example of the present invention is a micromechanical device including, a substrate in which a signal line is provided, a micromachine which is mounted on the substrate, is formed of a conductive material into a beam-like shape, is elastically deformed by a function of an electric field in such a manner that the beam-like part moves closer to or apart from the signal line, and changes the electric characteristics concomitantly with the deformation, a deformation restraint section constituted of a material having a higher viscosity coefficient than the conductive material, provided on the opposite side of the micromachine to the signal line, for restraining deformation of the micromachine in a direction in which the micromachine is separated from the signal line, and a sealing body provided on the principal surface of the substrate, for covering the micromachine with a hollow section located therebetween.

Abstract translation: 本发明的一个实例是一种微机械装置，其特征在于，包括：设置有信号线的基板，安装在基板上的微机械，由导电材料形成为梁状，通过功能弹性变形 电场的方式使得束状部分靠近信号线或离开信号线移动，并且随着变形而改变电特性，变形抑制部分由具有比导电性更高的粘度系数的材料构成 材料，其设置在所述微机械相对于所述信号线的相反侧，用于限制所述微机械从所述微机械与所述信号线分离的方向上的变形;以及设置在所述基板主表面上的密封体， 具有位于其间的中空部分的微机械。

公开(公告)号：US20100201003A1

公开(公告)日：2010-08-12

申请号：US11817563

申请日：2005-11-23

Applicant: Dane Thompson ,  Guoan Wang ,  Nickolas D. Kingsley ,  Ioannis Papapolymerou ,  Emmanouil M. Tentzeris

Inventor： Dane Thompson ,  Guoan Wang ,  Nickolas D. Kingsley ,  Ioannis Papapolymerou ,  Emmanouil M. Tentzeris

IPC: H01L23/28 ,  H01L21/56

CPC classification number: B81B7/0041 ,  B81B2201/016 ,  B81C2203/0136 ,  H01L23/3107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01L2924/00

Abstract: Packaging systems and methods of manufacture are provided. In this regard, a representative system comprises a first layer of liquid crystal polymer (LCP), a first electronic component supported by the first layer, and a second layer of LCP. The first layer and the second layer encase the first electronic component.

Abstract translation: 提供包装系统和制造方法。 在这方面，代表性系统包括第一层液晶聚合物（LCP），由第一层支撑的第一电子部件和第二层LCP。 第一层和第二层封装第一电子部件。

公开(公告)号：US20100038732A1

公开(公告)日：2010-02-18

申请号：US12502500

申请日：2009-07-14

Applicant: Hiroaki Yamazaki

Inventor： Hiroaki Yamazaki

IPC: H01L29/84

CPC classification number: H01H59/0009 ,  B81B3/0086 ,  B81B7/007 ,  B81B2201/016 ,  B81B2201/0264 ,  B81B2207/098 ,  H01H2059/0054

Abstract: A micro movable device includes a protection cap for protecting a movable unit arranged above a semiconductor substrate and the movable unit, signal line for transmitting a high-frequency signal formed above the semiconductor substrate, and insulation layer that has projection formed to project upward from the semiconductor substrate and coated surfaces with the signal line.

Abstract translation: 微型可移动装置包括用于保护布置在半导体衬底上方的可移动单元的保护盖和用于传输形成在半导体衬底上方的高频信号的可移动单元，信号线，以及具有突起的绝缘层，所述突起形成为从 半导体衬底和涂有表面的信号线。

公开(公告)号：US20090174014A1

公开(公告)日：2009-07-09

申请号：US12300831

申请日：2007-05-16

Applicant: Mike Kunze ,  Ingo Daumiller

Inventor： Mike Kunze ,  Ingo Daumiller

IPC: H01L29/84

CPC classification number: F04B43/046 ,  B81B3/0024 ,  B81B2201/014 ,  B81B2201/016 ,  B81B2201/032 ,  H01F21/04 ,  H01F2007/068 ,  H01G5/18 ,  H01L41/047 ,  H01L41/0933 ,  H01L41/094 ,  H01L41/0973

Abstract: A semiconductor actuator includes a substrate base, a bending structure which is connected to the substrate base and can be deflected at least partially relative to the substrate base. The bending structure has semiconductor compounds on the basis of nitrides of main group III elements and at least two electrical supply contacts which impress an electrical current in or for applying an electrical voltage to the bending structure. At least two of the supply contacts are disposed at a spacing from each other respectively on the bending structure and/or integrated in the latter.

Abstract translation: 半导体致动器包括基板，弯曲结构，其连接到基板基底并且可相对于基板基底至少部分地偏转。 该弯曲结构基于主要III族元素的氮化物和至少两个给弯曲结构施加电压或施加电压的电流的电源触点而具有半导体化合物。 至少两个电源触点分别设置在弯曲结构上和/或与后者集成在一起的彼此间隔开。

公开(公告)号：US20080314723A1

公开(公告)日：2008-12-25

申请号：US11767413

申请日：2007-06-22

Applicant: Lianjun Liu

Inventor： Lianjun Liu

IPC: B81B5/00 ,  B81C1/00 ,  H01H11/00 ,  H01H11/04 ,  H01H3/04

CPC classification number: H01H1/0036 ,  B81B2201/016 ,  B81C1/00103 ,  H01H1/06 ,  H01H1/20 ,  H01H11/04 ,  Y10T29/49105 ,  Y10T29/49174

Abstract: A device 20 includes a substrate 22 coupled with a substrate 24 such that a volume 32 is formed between the substrates 22, 24. Contact posts 48, 50 on the substrate 22 and a cantilever beam structure 36 on the substrate 24 are located within the volume 32. The cantilever beam structure has a conductive trace 38 that is selectively contactable with the contact posts 48, 50 to yield a microelectromechanical (MEMS) switch within the volume 32. Fabrication methodology for making the contact posts 48, 50 entails forming post protrusions 68, 70 on the substrate 22 and shaping post protrusions 68, 70 so that they acquire a rounded shape. Input and output signal lines 42, 44 are constructed such that respective portions of input and output signal lines 42, 44 overly corresponding post protrusions 68, 70 and take on the shape of post protrusions 68, 70.

Abstract translation: 器件20包括与衬底24耦合的衬底22，使得在衬底22,24之间形成体积32.衬底22上的接触柱48,50和衬底24上的悬臂梁结构36位于体积 悬臂梁结构具有能够与接触柱48,50选择性地接触的导电迹线38，以在体积32内产生微机电（MEMS）开关。用于制造接触柱48,50的制造方法需要形成后突起68 ，70在基板22上，并且成形柱突起68,70，使得它们获得圆形。 输入和输出信号线42,44被构造成使得输入和输出信号线42,44的相应部分过度对应的柱形突起68,70并且呈立柱形突起68,70的形状。

公开(公告)号：US07420444B2

公开(公告)日：2008-09-02

申请号：US11385700

申请日：2006-03-22

Applicant: Jun-o Kim ,  Sang-wook Kwon ,  Che-heung Kim ,  Jong-seok Kim ,  Hee-moon Jeong ,  Young-tack Hong ,  Sang-hun Lee

Inventor： Jun-o Kim ,  Sang-wook Kwon ,  Che-heung Kim ,  Jong-seok Kim ,  Hee-moon Jeong ,  Young-tack Hong ,  Sang-hun Lee

IPC: H01P1/10

CPC classification number: H01P1/127 ,  B81B3/0013 ,  B81B2201/016 ,  H01H59/0009

Abstract: An RF MEMS switch having asymmetrical spring rigidity. The RF MEMS switch has supporting members spaced apart in a certain interval on a substrate, a membrane being a motion member suspended by plural spring members extended on both sides of the membrane, and a bottom electrode being a contact surface on an upper surface of the substrate facing a bottom surface of the membrane, wherein the plural spring members placed on opposite sides of the membrane have asymmetrical rigidity, and a portion of the membrane on a side of stronger spring rigidity is first separated from the contact surface when the RF MEMS switch is turned off. The present invention has an advantage of easy separation of the switch from the contact surface, when the switch is turned off, due to the different rigidity of the springs located on the sides of the membrane.

Abstract translation: 具有不对称弹簧刚度的RF MEMS开关。 RF MEMS开关具有在基板上以一定间隔隔开的支撑构件，膜是由在膜的两侧延伸的多个弹簧构件悬挂的运动构件，底电极是位于膜的上表面上的接触表面 衬底面向膜的底表面，其中放置在膜的相对侧上的多个弹簧构件具有不对称的刚性，并且当RF MEMS开关在膜的另一侧具有更强的弹簧刚度的一部分首先与接触表面分离 已关闭 本发明的优点在于，当开关断开时，由于位于膜侧面的弹簧的刚度不同，开关与接触表面容易分离。

公开(公告)号：US07356913B2

公开(公告)日：2008-04-15

申请号：US10949800

申请日：2004-09-24

Applicant: Yves Fouillet

Inventor： Yves Fouillet

IPC: H01H11/00 ,  H01H65/00

CPC classification number: H01H1/0036 ,  B81B3/0024 ,  B81B2201/016 ,  B81B2201/032 ,  H01G5/16 ,  H01H2001/0042 ,  H01H2037/008 ,  Y10T29/42 ,  Y10T29/49105 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/49155

Abstract: A process for making microswitches or microvalves, composed of a substrate and used for shifting between a first state of functioning and a second state of functioning by means of a bimetal-effect thermal sensor. The sensor includes a deformable element attached, at opposite ends, to the substrate so that there is a natural deflection without stress with respect to a surface of the substrate opposite it, this natural deflection determining the first state of functioning, the second state of functioning being caused by the thermal sensor which, under the influence of temperature variation, induces a deformation of the deformable element which diminishes the deflection by subjecting it to a compressive force which shifts it in a direction opposite to its natural deflection by buckling.

Abstract translation: 一种制造微型开关或微型阀的方法，由基板组成，用于通过双金属效应热传感器在第一功能状态和第二功能状态之间移动。 该传感器包括一可变形元件，该可变形元件在相对端附接到基底，使得相对于与其相反的基底的表面存在无应力的自然变形，该自然偏转确定第一功能状态，第二功能状态 由热传感器引起，其在温度变化的影响下引起可变形元件的变形，该变形元件通过使其具有通过弯曲而在与其自然偏转相反的方向上移动它的压缩力而减小偏转。