公开(公告)号：US08440315B2

公开(公告)日：2013-05-14

申请号：US13486284

申请日：2012-06-01

申请人： Thomas Edward Carney ,  Jeffrey Michael Bartolin ,  Meredith L. Dunbar ,  Scott John Herrmann

发明人： Thomas Edward Carney ,  Jeffrey Michael Bartolin ,  Meredith L. Dunbar ,  Scott John Herrmann

IPC分类号： B32B27/28 ,  B32B27/38 ,  B32B5/16

CPC分类号： H01B3/306 ,  B32B5/16 ,  C08G73/105 ,  C08G73/1075 ,  C08J5/18 ,  C08J2379/08 ,  C09J7/25 ,  C09J163/00 ,  C09J2463/00 ,  C09J2479/086 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/26 ,  Y10T428/2982 ,  Y10T428/31515 ,  Y10T428/31721

摘要： The present disclosure is directed to a base film having a thickness from 8 to 152 microns, a 60 degree gloss value from 2 to 35, an optical density greater than or equal to 2 and a dielectric strength greater than 1400 V/mil. The base film comprises a chemically converted (partially or wholly aromatic) polyimide in an amount from 71 to 96 weight percent of the base film. The base film further comprises a pigment and a matting agent. The matting agent is present in an amount from 1.6 to 10 weight percent of the base film, has a median particle size from 1.3 to 10 microns, and has a density from 2 to 4.5 g/cc. The pigment is present in an amount from 2 to 9 weight percent of the base film. The present disclosure is also directed to coverlay films comprising the base film in combination with an adhesive layer.

摘要翻译： 本公开涉及厚度为8至152微米，60度光泽值为2至35，光密度大于或等于2且介电强度大于1400V / mil的基膜。 该基膜包含基础膜的71至96重量％的化学转化（部分或全部芳族）聚酰亚胺。 基膜还包含颜料和消光剂。 消光剂的存在量为基膜的1.6至10重量％，中值粒径为1.3至10微米，密度为2至4.5g / cc。 颜料的存在量为基膜的2至9重量％。 本公开还涉及包括基膜与粘合剂层组合的覆盖膜。

公开(公告)号：US20130011687A1

公开(公告)日：2013-01-10

申请号：US13522546

申请日：2011-01-13

申请人： Teruo Matsutani ,  Yasutaka Kondo ,  Shogo Fujimoto ,  Shinji Matsukubo ,  Hisayasu Kaneshiro

发明人： Teruo Matsutani ,  Yasutaka Kondo ,  Shogo Fujimoto ,  Shinji Matsukubo ,  Hisayasu Kaneshiro

IPC分类号： B32B15/08 ,  B32B27/06

CPC分类号： H05K1/036 ,  B32B15/08 ,  B32B27/08 ,  B32B27/281 ,  B32B2457/08 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08L79/08 ,  H05K1/0346 ,  H05K2201/0129 ,  H05K2201/0154 ,  Y10T428/31681 ,  Y10T428/31721

摘要： Provided are a multilayer polyimide film that hardly suffers from the peeling of the layers from each other or the clouding of a space between the layers (turning white in color) during heating at a high temperature and a flexible metal-clad laminate using such a multilayer polyimide film. This object can be attained by a multilayer polyimide film having a thermoplastic polyimide layer on at least one side of a nonthermoplastic polyimide layer, wherein at least 60% of the total number of moles of an acid dianhydride monomer and a diamine monomer that constitute the thermoplastic polyimide is the same type of monomer as at least one type of acid dianhydride monomer and at least one type of diamine monomer that constitute the nonthermoplastic polyimide.

摘要翻译： 提供了一种多层聚酰亚胺膜，其难以在高温加热期间彼此剥离或层之间的空间（白色变白）和使用这种多层的柔性覆金属层压板的混浊 聚酰亚胺薄膜。 该目的可以通过在非热塑性聚酰亚胺层的至少一侧上具有热塑性聚酰亚胺层的多层聚酰亚胺膜来实现，其中构成热塑性树脂的酸二酐单体和二胺单体的总摩尔数的至少60％ 聚酰亚胺是与至少一种类型的酸二酐单体和构成非热塑性聚酰亚胺的至少一种二胺单体相同类型的单体。

公开(公告)号：US08349971B2

公开(公告)日：2013-01-08

申请号：US12665197

申请日：2007-06-18

申请人： Hiroshi Itatani

发明人： Hiroshi Itatani

IPC分类号： C08G73/10

CPC分类号： C08G73/101 ,  C08G73/1007 ,  C08G73/1028 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08L79/08 ,  C08L2205/02 ,  C08L2666/20

摘要： The present invention provides a process for preparing a solvent-soluble polyimide copolymer synthesized from a 6,6-imide segment having an imide oligomer with PMDA at both ends produced by adding 4 molar equivalents of pyromellitic dianhydride (PMDA) and 2 molar equivalents of diaminotoluene (DAT) to an imide oligomer produced by heating 1 molar equivalent of biphenyltetracarboxylic dianhydride (BPDA) and 2 molar equivalents of diaminodiphenyl ether (DADE) at 160-200° C. in the presence of a catalyst in an organic polar solvent.

摘要翻译： 本发明提供了一种制备溶剂可溶性聚酰亚胺共聚物的方法，所述聚酰亚胺共聚物是通过加入4摩尔当量的1,2,4,5-苯四酸二酐（PMDA）和2摩尔当量的二氨基甲苯 （DAT）加成到在160-200℃下在催化剂存在下在有机极性溶剂中加热1摩尔当量的联苯四羧酸二酐（BPDA）和2摩尔当量的二氨基二苯醚（DADE）而制备的酰亚胺低聚物。

公开(公告)号：US20120308835A1

公开(公告)日：2012-12-06

申请号：US13150946

申请日：2011-06-01

申请人： Wenbin Hong ,  Tantiboro Ouattara ,  Heping Wang ,  Kang Le Wang

发明人： Wenbin Hong ,  Tantiboro Ouattara ,  Heping Wang ,  Kang Le Wang

IPC分类号： B32B17/10 ,  C08L27/12 ,  C08K5/3415 ,  C08K5/1535 ,  B29C47/02 ,  C08K5/41 ,  B32B27/06 ,  B05D5/06 ,  B05D3/02 ,  B05D3/12 ,  C08F214/18 ,  C08K5/20

CPC分类号： B32B17/064 ,  B29C47/0004 ,  B29C47/0021 ,  B29C47/004 ,  B29C47/02 ,  B32B2262/101 ,  C08G73/1039 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C09D179/08 ,  Y10T428/31623 ,  Y10T428/31721

摘要： The present invention provides new polyimide materials suitable for use in optically transparent fiber composites, ribbon composites, and optical communications applications. The polyimide compounds include monomeric repeat units comprising a fluorinated moiety and a fluorene cardo structure. The polyimides exhibit good optical transparency and have a low absolute thermo-optic coefficient (|dn/dT|).

摘要翻译： 本发明提供适用于光学透明纤维复合材料，带状复合材料和光学通信应用的新型聚酰亚胺材料。 聚酰亚胺化合物包括包含氟化部分和芴卡诺结构的单体重复单元。 聚酰亚胺显示出良好的光学透明度，并且具有低的绝对热光系数（| dn / dT |）。

公开(公告)号：US20120292086A1

公开(公告)日：2012-11-22

申请号：US13510665

申请日：2010-11-19

申请人： Brian C. Auman ,  Meredtih L. Dunbar ,  Tao He ,  Kostantinos Kourtakis

发明人： Brian C. Auman ,  Meredtih L. Dunbar ,  Tao He ,  Kostantinos Kourtakis

IPC分类号： H05K1/00

CPC分类号： H01L23/482 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08J5/18 ,  C08J2379/08 ,  C08K7/00 ,  C08K7/02 ,  C08K7/04 ,  C08K7/08 ,  C08K2201/016 ,  C08L79/08 ,  H01L23/293 ,  H01L23/295 ,  H01L24/12 ,  H01L2224/0231 ,  H01L2224/02319 ,  H01L2224/0233 ,  H01L2224/02335 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12032 ,  H01L2924/14 ,  H05K1/0346 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/259 ,  H01L2924/00

摘要： An interposer film for IC packaging is disclosed. The interposer film comprises a substrate that supports a plurality of electrically conductive domains. The substrate is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.

摘要翻译： 公开了一种用于IC封装的插入膜。 插入膜包括支撑多个导电畴的基板。 基板由聚酰亚胺和亚微米填料组成。 聚酰亚胺衍生自至少一种芳族二酸酐组分，其选自刚性链二酸酐，非刚性二醇二酸酐及其组合，以及至少一种芳族二胺组分，其选自刚性链二胺，非刚性棒二胺及其组合。 二酐与二胺的摩尔比为48-52：52-48，X：Y的比例为20-80：80-20，其中X为刚性链二酸酐和刚性二胺的摩尔百分数，Y为摩尔比 百分比的非刚性棒二酸酐和非刚性棒二胺。 亚微米填料在至少一个维度上小于550纳米; 长宽比大于3：1; 小于所有尺寸的薄膜的厚度。

公开(公告)号：US20120252968A1

公开(公告)日：2012-10-04

申请号：US13286715

申请日：2011-11-01

申请人： Christopher J. Wohl ,  John W. Connell ,  Emilie J. Siochi ,  Joseph G. Smith

发明人： Christopher J. Wohl ,  John W. Connell ,  Emilie J. Siochi ,  Joseph G. Smith

IPC分类号： C09D167/00 ,  B05D3/00 ,  C07D305/08 ,  B05D7/24 ,  C08G63/682 ,  C08L67/00

CPC分类号： C07D305/08 ,  C08G65/18 ,  C08G65/322 ,  C08G65/33389 ,  C08G73/1042 ,  C08G73/105 ,  C09D179/08

摘要： Copoly(imide oxetane) materials are disclosed that can exhibit a low surface energy while possessing the mechanical, thermal, chemical and optical properties associated with polyimides. The copoly(imide oxetane)s are prepared using a minor amount of fluorinated oxetane-derived oligomer with sufficient fluorine-containing segments of the copoly(imide oxetane)s that migrate to the exterior surface of the polymeric material to yield low surface energies. Thus the coatings and articles of manufacture made with the copoly(imide oxetane)s of this invention are characterized as having an anisotropic fluorine composition. The low surface energies can be achieved with very low content of fluorinated oxetane-derived oligomer. The copolymers of this invention can enhance the viability of polyimides for many applications and may be acceptable where homopolyimide materials have been unacceptable.

摘要翻译： 公开了共聚（酰亚胺氧杂环丁烷）材料，其具有低表面能，同时具有与聚酰亚胺相关的机械，热学，化学和光学性能。 使用少量的具有足够的共聚（酰亚胺氧杂环丁烷）的含氟链段的氟化氧杂环丁烷衍生的低聚物制备共聚（酰亚胺氧杂环丁烷），其迁移到聚合物材料的外表面以产生低的表面能。 因此，用本发明的共聚（酰亚胺氧杂环丁烷）制备的涂料和制品被表征为具有各向异性氟组合物。 低表面能可以用非常低含量的氟化氧乙烷衍生的低聚物来实现。 本发明的共聚物可以增强聚酰亚胺在许多应用中的存活力，并且在均聚酰亚胺材料已经不可接受的情况下可以是可接受的。

公开(公告)号：US08273456B2

公开(公告)日：2012-09-25

申请号：US12444192

申请日：2007-10-03

申请人： Masahito Ohkido ,  Wataru Ueno ,  Jitsuo Oishi ,  Shuta Kihara

发明人： Masahito Ohkido ,  Wataru Ueno ,  Jitsuo Oishi ,  Shuta Kihara

IPC分类号： B32B27/00

CPC分类号： C08L79/08 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1075 ,  C08G73/1082 ,  C08K5/3415 ,  Y10T428/31504

摘要： It relates to a highly heat resistant thermosetting polyimide resin composition that is cured at a temperature of 150° C. or less, and provides a cured product that generates a less amount of decomposed gas even under heating to 250° C., and has flexibility and adhesiveness.A two-component thermosetting polyimide resin composition containing a liquid A containing a polyimide (a) having a main chain constituted by a repeating unit having a polyoxyalkylenediamine structure with amino groups on both ends thereof, and a liquid B containing a bismaleimide compound, and a cured product of a thermosetting polyimide resin composition obtained by mixing these two liquids and curing the mixture under heating.

摘要翻译： 本发明涉及在150℃以下的温度下固化的耐热性高的热固性聚酰亚胺树脂组合物，并且即使在加热至250℃时也提供产生少量分解气体的固化产物，并且具有柔软性 和粘合性。 一种双组分热固性聚酰亚胺树脂组合物，其含有含有聚酰亚胺（a）的液体A，所述聚酰亚胺（a）具有由两端具有氨基的聚氧化烯二胺结构的重复单元构成的主链和含有双马来酰亚胺化合物的液体B， 通过混合这两种液体并在加热下固化该混合物得到的热固性聚酰亚胺树脂组合物的固化产物。

公开(公告)号：US20120231264A1

公开(公告)日：2012-09-13

申请号：US13510662

申请日：2010-11-19

申请人： Brian C. Auman ,  Meredith L. Dunbar ,  Tao He ,  Kostantinos Kourtakis

发明人： Brian C. Auman ,  Meredith L. Dunbar ,  Tao He ,  Kostantinos Kourtakis

IPC分类号： B32B5/16 ,  C09J7/02 ,  B32B27/08 ,  B82Y30/00

CPC分类号： H01L23/482 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08J5/18 ,  C08J2379/08 ,  C08K7/00 ,  C08K7/02 ,  C08K7/04 ,  C08K7/08 ,  C08K2201/016 ,  C08L79/08 ,  H01L23/293 ,  H01L23/295 ,  H01L24/12 ,  H01L2224/0231 ,  H01L2224/02319 ,  H01L2224/0233 ,  H01L2224/02335 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12032 ,  H01L2924/14 ,  H05K1/0346 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/259 ,  H01L2924/00

摘要： The present disclosure is directed to a wire wrap composition having a polyimide layer and a bonding layer. The polyimide layer is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.

摘要翻译： 本公开涉及具有聚酰亚胺层和粘合层的线缠绕组合物。 聚酰亚胺层由聚酰亚胺和亚微米填料构成。 聚酰亚胺衍生自至少一种芳族二酸酐组分，其选自刚性链二酸酐，非刚性二醇二酸酐及其组合，以及至少一种芳族二胺组分，其选自刚性链二胺，非刚性棒二胺及其组合。 二酐与二胺的摩尔比为48-52：52-48，X：Y的比例为20-80：80-20，其中X为刚性链二酸酐和刚性二胺的摩尔百分数，Y为摩尔比 百分比的非刚性棒二酸酐和非刚性棒二胺。 亚微米填料在至少一个维度上小于550纳米; 长宽比大于3：1; 小于所有尺寸的薄膜的厚度。

公开(公告)号：US20120231263A1

公开(公告)日：2012-09-13

申请号：US13510659

申请日：2010-11-19

申请人： Brian C. Auman ,  Meredith L. Dunbar ,  Tao He ,  Kostantinos Kourtakis

发明人： Brian C. Auman ,  Meredith L. Dunbar ,  Tao He ,  Kostantinos Kourtakis

IPC分类号： B32B5/16

CPC分类号： H01L23/482 ,  C08G73/1042 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08J5/18 ,  C08J2379/08 ,  C08K7/00 ,  C08K7/02 ,  C08K7/04 ,  C08K7/08 ,  C08K2201/016 ,  C08L79/08 ,  H01L23/293 ,  H01L23/295 ,  H01L24/12 ,  H01L2224/0231 ,  H01L2224/02319 ,  H01L2224/0233 ,  H01L2224/02335 ,  H01L2224/0236 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12032 ,  H01L2924/14 ,  H05K1/0346 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/259 ,  H01L2924/00

摘要： The present disclosure is directed to a coverlay comprising a polyimide film and an adhesive layer. The polyimide film is composed of a polyimide and a sub-micron filler. The polyimide is derived from at least one aromatic dianhydride component selected from rigid rod dianhydride, non-rigid rod dianhydride and combinations thereof, and at least one aromatic diamine component selected from rigid rod diamine, non-rigid rod diamine and combinations thereof. The mole ratio of dianhydride to diamine is 48-52:52-48 and the ratio of X:Y is 20-80:80-20 where X is the mole percent of rigid rod dianhydride and rigid rod diamine, and Y is the mole percent of non-rigid rod dianhydride and non-rigid rod diamine. The sub-micron filler is less than 550 nanometers in at least one dimension; has an aspect ratio greater than 3:1; is less than the thickness of the film in all dimensions.

摘要翻译： 本公开涉及包括聚酰亚胺膜和粘合剂层的覆盖物。 聚酰亚胺膜由聚酰亚胺和亚微米填料构成。 聚酰亚胺衍生自至少一种芳族二酸酐组分，其选自刚性链二酸酐，非刚性二醇二酸酐及其组合，以及至少一种芳族二胺组分，其选自刚性链二胺，非刚性棒二胺及其组合。 二酐与二胺的摩尔比为48-52：52-48，X：Y的比例为20-80：80-20，其中X为刚性链二酸酐和刚性二胺的摩尔百分数，Y为摩尔比 百分比的非刚性棒二酸酐和非刚性棒二胺。 亚微米填料在至少一个维度上小于550纳米; 长宽比大于3：1; 小于所有尺寸的薄膜的厚度。

公开(公告)号：US08093349B2

公开(公告)日：2012-01-10

申请号：US12375211

申请日：2007-07-25

申请人： Kikuo Ataka ,  Tetsurou Tsuji

发明人： Kikuo Ataka ,  Tetsurou Tsuji

IPC分类号： C08G73/10 ,  C23C18/16

CPC分类号： C08G73/101 ,  C08G73/1007 ,  C08G73/1014 ,  C08G73/1017 ,  C08G73/1039 ,  C08G73/1046 ,  C08G73/105 ,  C08G73/1067 ,  C08G73/1071 ,  C08L79/08 ,  C23C18/30 ,  C23C18/31 ,  H05K1/0346 ,  H05K3/181 ,  H05K2201/0154 ,  Y10T428/31681

摘要： A terminally-modified polybranched polyimide which can be efficiently complexed with an inorganic material is obtained by reacting a component (a): tetracarboxylic dianhydride; a component (b): as an amine component, a mixture of a triamine and a diamine (which may be composed of a triamine only); and a component (c): as a terminal component, a compound selected from general formulae (1-1) to (1-4). H2N—X—R1  (1-1) (In the formula, X represents a single bond or an alkylene group having 1 to 3 carbon atoms, and R1 represents a nitrogen-containing heterocyclic group). H2N—X—R1  (1-2) (In the formula, X is as defined above, and R1 represents a sulfur-containing heterocyclic group or an aryl group having a thiol or thioether group in the molecule.) (In the formula, R represents a nitrogen-containing heterocyclic group.) (In the formula, R represents a monovalent residue.)

摘要翻译： 通过使成分（a）：四羧酸二酐反应，得到与无机材料有效配合的末端改性的聚支链聚酰亚胺。 组分（b）：作为胺组分，三胺和二胺的混合物（其可以仅由三胺组成）; 和组分（c）：作为终端组分，选自通式（1-1）至（1-4）的化合物。 H2N-X-R1（1-1）（式中，X表示单键或碳原子数1〜3的亚烷基，R1表示含氮杂环基）。 H 2 N-X-R 1（1-2）（式中X如上所述，R 1表示含硫杂环基或分子中具有硫醇或硫醚基的芳基）（式中， R表示含氮杂环基。）（式中，R表示1价残基。）