Abstract:
Reflectionless low-pass, high-pass, band-pass, band-stop, all-pass, all-stop, and multi-band filters, as well as a method for designing such filters is disclosed, along with a method of enhancing the performance of such filters through the use of unmatched sub-networks to realize an optimal frequency response, such as the Chebyshev equal-ripple response. These filters preferably function by absorbing the stop-band portion of the spectrum rather than reflecting it back to the source, which has significant advantages in many different applications. The unmatched sub-networks preferably offer additional degrees of freedom by which element values can be assigned to realize improved cutoff sharpness, stop-band rejection, or other measures of performance.
Abstract:
A method for implementing a TM dielectric resonator is provided, which includes: a dielectric resonant column component with a metal connecting plate is machined; a metal cavity with an opening at one end is machined; the metal connection plate of the dielectric resonant column component is fastened to the inner wall of the metal cavity by a screw; the opening of the metal cavity is covered with a prefabricated cover plate; and a prefabricated tuning screw is screwed from the cover plate into the metal cavity.
Abstract:
Methods and apparatus, including computer program products, are provided for tunable filters and/or front-ends. In one aspect there is provided an apparatus. The apparatus may a first band filter; a second tunable band filter; and a radio frequency switch coupled to at least the first band filter and the second tunable band filter, wherein the radio frequency switch is configured to switch between at least the first band filter and the second tunable band filter. Related apparatus, systems, methods, and articles are also described.
Abstract:
A signal transmission apparatus includes: a first lead frame; a second lead frame spaced from the first lead frame; a primary semiconductor chip electrically connected to the first lead frame; a secondary semiconductor chip electrically connected to the second lead frame; and a signal isolator through which a signal is isolatedly transmitted from the primary semiconductor chip to the secondary semiconductor chip, the signal isolator having a first main surface that is bonded to both the first lead frame and the second lead frame.
Abstract:
A flip-chip employing an integrated cavity filter is disclosed comprising an integrated circuit (IC) chip comprising a semiconductor die and a plurality of conductive bumps. The plurality of conductive bumps is interconnected to at least one metal layer of the semiconductor die to provide a conductive “fence” that defines an interior resonator cavity for providing an integrated cavity filter in the flip-chip. The interior resonator cavity is configured to receive an input RF signal from an input transmission line through an input signal transmission aperture provided in an internal layer in the semiconductor die. The interior resonator cavity resonates the input RF signal to generate the output RF signal comprising a filtered RF signal of the input RF signal, and couples the output RF signal on an output signal transmission line in the flip-chip through an output transmission aperture provided in the aperture layer.
Abstract:
In an end surface 32b of the second transmission line forming body 32 forming a second waveguide 30, the height of a central region 33 which includes an opening of the second transmission line 30b is a reference plane. A depressed portion 32e that is depressed to a depth greater than the length of a thread portion of a screw 205 from the reference plane is provided in a region outside the central region 33 and includes a screw hole forming position. A screw hole 32d for fixing an external circuit 200 to be connected is provided at the screw hole forming position in the depressed portion 32e. The height of a region, which is excluding the depressed portion 32e and is further away from the central region 33 than the screw hole forming position, is equal to the reference plane.
Abstract:
A flat cable high-frequency filter includes a dielectric substrate extending in a transmission direction of a high-frequency signal. The dielectric substrate includes dielectric layers stacked on each other. Elongated conductor patterns are provided on a flat surface of one dielectric layer which faces another dielectric layer. The conductor patterns are as wide as possible in the dielectric substrate in accordance with a desired inductance. A capacitive coupling conductor pattern opposes one conductor pattern by a predetermined area with a dielectric layer therebetween. By using a connecting conductor, the capacitive coupling conductor pattern is connected to the conductor pattern which does not oppose the capacitive coupling conductor pattern.
Abstract:
A flat cable high-frequency filter includes a dielectric substrate extending in a transmission direction of a high-frequency signal. The dielectric substrate includes dielectric layers stacked on each other. Elongated conductor patterns are provided on a flat surface of one dielectric layer which faces another dielectric layer. The conductor patterns are as wide as possible in the dielectric substrate in accordance with a desired inductance. A capacitive coupling conductor pattern opposes one conductor pattern by a predetermined area with a dielectric layer therebetween. By using a connecting conductor, the capacitive coupling conductor pattern is connected to the conductor pattern which does not oppose the capacitive coupling conductor pattern.