公开(公告)号：US20100176004A1

公开(公告)日：2010-07-15

申请号：US12602703

申请日：2008-06-03

申请人： Reinhard Schneider ,  Henry Kunze ,  Ferdinand Wiener

发明人： Reinhard Schneider ,  Henry Kunze ,  Ferdinand Wiener

IPC分类号： C02F1/461 ,  C25D21/10

CPC分类号： C25D5/08 ,  C25D5/04 ,  C25D17/001 ,  C25D21/10 ,  H05K3/241 ,  H05K2203/0746 ,  H05K2203/1509

摘要： An apparatus for the electrolytic treatment of the product L using a treatment agent is used to make the treatment of a plate-shaped product more uniform. This apparatus includes: devices for retaining 40, 42 the product L in the apparatus, one or a plurality of flow devices 10, which each include at least one nozzle 15 and are disposed situated opposite the product L, one or a plurality of counter electrodes 30, which are inert relative to the treatment agent and are disposed parallel to at least one treatment surface, means for generating a relative movement 44 between the product L, on the side, and the flow devices 10 and/or the counter electrodes 30, on the other side, in at least one direction parallel to a treatment surface. The product L can be immersed into the treatment agent during the treatment.

摘要翻译： 使用用于使用处理剂电解处理产品L的装置来使板状产品的处理更均匀。 该装置包括：用于将产品L保持在设备中的装置，一个或多个流动装置10，每个流动装置10包括至少一个喷嘴15并且设置成与产品L相对设置，一个或多个对置电极 30，其相对于处理剂是惰性的并且平行于至少一个处理表面设置，用于在产品L和侧流体装置10和/或对电极30之间产生相对运动的装置44， 在另一侧，在平行于处理表面的至少一个方向上。 产品L可以在处理过程中浸入处理剂中。

公开(公告)号：US07449089B2

公开(公告)日：2008-11-11

申请号：US10502187

申请日：2003-03-17

申请人： Egon Hübel

发明人： Egon Hübel

IPC分类号： C25D17/10 ,  C25D21/10

CPC分类号： H05K3/241 ,  C25D17/004 ,  C25D17/10 ,  C25D17/28 ,  C25D21/12

摘要： To avoid voids in the metal layer in holes of printed circuit boards, a conveyorized plating line and a method for electrolytically metal plated printed circuit boards are proposed which provide measures for reducing an electric voltage that builds up between adjacent printed circuit boards being conveyed through the line.

摘要翻译： 为了避免印刷电路板的孔中的金属层中的空隙，提出了一种输送电镀线和一种电解金属电镀印刷电路板的方法，其提供了降低在相邻的印刷电路板之间形成的电压的措施， 线。

公开(公告)号：US20080274375A1

公开(公告)日：2008-11-06

申请号：US11744829

申请日：2007-05-04

申请人： Fuk Chiu Ng ,  Shu Chung Li

发明人： Fuk Chiu Ng ,  Shu Chung Li

IPC分类号： C25D11/12 ,  B32B15/00 ,  C25D11/18 ,  C25D21/10

CPC分类号： C25D11/08 ,  C25D11/024 ,  Y10T428/12 ,  Y10T428/12993

摘要： This invention encompasses methods of producing a colored oxide layer on an aluminum material by anodizing the aluminum material in an electrolyte comprising water, sulfuric acid and oxalic acid. The anodizing step comprises passing at least two sequential current densities through the electrolyte. Methods of making and using article with a colored oxide layer on an aluminum material make by the methods disclosed herein are also disclosed.

摘要翻译： 本发明包括通过在包含水，硫酸和草酸的电解质中阳极氧化铝材料来在铝材料上生产着色氧化物层的方法。 阳极氧化步骤包括使至少两个顺序的电流密度通过电解质。 还公开了通过本文公开的方法制造和使用在铝材料上具有着色氧化物层的制品的方法。

公开(公告)号：US20080271995A1

公开(公告)日：2008-11-06

申请号：US11744046

申请日：2007-05-03

申请人： Sergey Savastiouk ,  Valentin Kosenko ,  Alexander J. Berger

发明人： Sergey Savastiouk ,  Valentin Kosenko ,  Alexander J. Berger

IPC分类号： C25D21/10 ,  C25D17/00 ,  C25D21/12

CPC分类号： C25D5/08 ,  C25D5/18 ,  C25D5/20 ,  C25D21/10 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76877 ,  H01L21/76898 ,  H05K3/421 ,  H05K3/423 ,  H05K2201/09563 ,  H05K2203/0285 ,  H05K2203/0292 ,  H05K2203/1492

摘要： In a reverse pulse plating of a substrate (110), the electrolytic solution is agitated with a greater power on forward pulses (210) than on reverse pulses (220). An ultrasound agitation source (170) can be positioned at the bottom of the substrate (110) if the anode (134) is at the top. The ultrasound source may contact the substrate's bottom. Other features are also provided.

摘要翻译： 在基板（110）的反向脉冲电镀中，电解液以比反向脉冲（220）上的正向脉冲（210）更大的功率被搅动。 如果阳极（134）在顶部，超声搅拌源（170）可以位于基底（110）的底部。 超声波源可以接触基底的底部。 还提供其他功能。

公开(公告)号：US20080116077A1

公开(公告)日：2008-05-22

申请号：US11602736

申请日：2006-11-21

申请人： Prasit Sricharoenchaikit

发明人： Prasit Sricharoenchaikit

IPC分类号： C25D5/10 ,  C25D17/00 ,  C25D3/02 ,  C25D21/10

CPC分类号： C25D21/10 ,  C25D3/60 ,  C25D17/10 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05184 ,  H01L2224/05568 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10336 ,  H01L2924/14 ,  H05K3/3473 ,  H01L2924/00014

摘要： The present invention relates to a system single-metal plating, a system for binary-metal plating, and a system for solder-bump plating. The solder-bump plating system comprises a single-metal plating system for plating a preconditioned substrate to form a single-metal plated substrate; and a binary-metal plating system for plating the single-metal plated substrate. In a preferred implementation, the solder-bump plating system of the present invention is configured to single-metal plate a preconditioned substrate using a first plating solution to provide a single-plated substrate; to single-metal plate the single-plated substrate using a second plating solution to provide a double-plated substrate; and to binary-metal plate the double-plated substrate using a third plating solution to provide a solder-bump plated substrate. A novel apparatus for use in plating a substrate comprises an electrically conductive holder comprising a handle portion having at least one electrical contact and a holder portion having at least one flexible electrical contact.

摘要翻译： 本发明涉及一种单金属电镀系统，一种二元金属电镀系统和一种用于焊料凸块电镀的系统。 焊料凸块电镀系统包括用于电镀预处理衬底以形成单金属镀覆衬底的单金属电镀系统; 以及用于电镀单金属电镀基板的二元金属电镀系统。 在优选的实施方式中，本发明的焊料凸块电镀系统使用第一电镀液将单金属板配置为预处理基板，以提供单电镀基板; 使用第二电镀液将单电镀基板单金属板，以提供双电镀基板; 并且使用第三电镀液对双金属基板进行二元金属镀，以提供焊料凸块镀覆的基板。 用于电镀衬底的新型设备包括导电保持器，其包括具有至少一个电触头的手柄部分和具有至少一个柔性电触头的保持器部分。

公开(公告)号：US06955747B2

公开(公告)日：2005-10-18

申请号：US10253249

申请日：2002-09-23

申请人： Robert M. Browne ,  Donald G. Allen ,  Hank Reinstein ,  Todd Thomas

发明人： Robert M. Browne ,  Donald G. Allen ,  Hank Reinstein ,  Todd Thomas

IPC分类号： C25D7/12 ,  C25D21/10 ,  H01L21/288 ,  C25D17/02

CPC分类号： H01L21/2885 ,  C25D17/001 ,  C25D21/10

摘要： The present invention overcomes the drawbacks and limitations described above by providing a paddle assembly having a paddle that moves in a bidirectional fashion for agitating solution in a container of a plating cell. A follower is coupled to the paddle. The follower engages a rotatable cam and is propelled along the cam as the cam rotates. A drive mechanism rotates the cam.

摘要翻译： 本发明克服了上述缺陷和限制，提供了一种具有桨叶的桨叶组件，叶片以双向方式移动，用于搅拌电镀槽的容器中的溶液。 跟随器耦合到桨。 随动件接合可旋转的凸轮，并随着凸轮旋转而沿着凸轮推进。 驱动机构使凸轮旋转。

公开(公告)号：US06923898B2

公开(公告)日：2005-08-02

申请号：US10028359

申请日：2001-12-28

申请人： Kohshi Yoshimura ,  Takeshi Nishiuchi ,  Fumiaki Kikui ,  Masahiro Asano ,  Takahiro Isozaki

发明人： Kohshi Yoshimura ,  Takeshi Nishiuchi ,  Fumiaki Kikui ,  Masahiro Asano ,  Takahiro Isozaki

IPC分类号： C25D7/00 ,  C25D3/00 ,  C25D7/04 ,  C25D17/12 ,  C25D17/16 ,  C25D21/00 ,  C25D21/10 ,  H01F7/02 ,  H01F41/02 ,  H02K1/17 ,  H02K1/27 ,  H02K15/03 ,  C25D5/02 ,  C25D5/00 ,  H01F7/06

CPC分类号： H01F41/026 ,  C25D7/04 ,  C25D17/12 ,  Y10T29/49075

摘要： An electroplating device including an anode inserted through and disposed in a hole provided in a work and communicating with the outside, and a member for rotating the work about its center axis and supplying a plating electric current to the work. Alternatively, a separate member may supply the plating electric current to the work. A plating solution in the hole in the work may be allowed to flow. Thus, a uniform plated film can be formed on both of the outer and inner surfaces of the work having the communicating with the outside such as a ring-shaped work, of which a ring-shaped bonded magnet is representative, by using the electroplating device.

摘要翻译： 一种电镀装置，包括插入并设置在设置在工件中并与外部连通的孔中的阳极以及用于使工件围绕其中心轴线旋转并向工件供应电镀电流的构件。 或者，单独的构件可以向工件提供电镀电流。 可以允许工作孔中的电镀液流动。 因此，通过使用电镀装置，可以在具有与外部连通的工件的外表面和内表面上形成均匀的镀膜，例如环形粘合磁体代表的环形工件 。

公开(公告)号：US20050160977A1

公开(公告)日：2005-07-28

申请号：US10971530

申请日：2004-10-22

申请人： Arthur Keigler ,  John Harrell ,  Zhenqiu Liu ,  Qunwei Wu

发明人： Arthur Keigler ,  John Harrell ,  Zhenqiu Liu ,  Qunwei Wu

IPC分类号： B23K15/00 ,  C25D5/18 ,  C25D5/22 ,  C25D7/12 ,  C25D17/00 ,  C25D21/10 ,  C25D21/12 ,  H01L21/00

CPC分类号： C25D17/001 ,  C25D5/003 ,  C25D7/123 ,  C25D17/005 ,  C25D17/06 ,  C25D21/10 ,  C25D21/12 ,  H01L21/67023 ,  H01L21/67126

摘要： A method and apparatus for retaining a workpiece against a workpiece holder are described. A flexible member can be used to provide a substantially uniform force to securely retain the workpiece, which can allow the workpiece to be consistently positioned in a process module. In one detailed embodiment, a barrier to fluid entry is formed between the workpiece and a ring for retaining the workpiece against a workpiece holder. This provides a reliable seal during fluid processing to prevent fluid from reaching the underside of a workpiece. In various embodiments, the workpiece holder can be used to align a workpiece in a process module or to hold one or more workpieces in a configuration that allows for higher throughput.

公开(公告)号：US06916413B2

公开(公告)日：2005-07-12

申请号：US10318779

申请日：2002-12-13

申请人： John Michael Lowe

发明人： John Michael Lowe

IPC分类号： C25D5/02 ,  C25D5/08 ,  C25D7/12 ,  C25D17/00 ,  C25D21/10 ,  C25D21/12

CPC分类号： C25D5/08 ,  C25D5/02 ,  C25D17/008 ,  C25D17/12 ,  C25D21/12

摘要： Electroplating station S has a head 1 with anode 2, to one side of which there is located an electrically neutral wall 3. The width of anode 2 is provided to accommodate the width of web 6. Serrations 9 are provided on the anode 2, especially in the area of top surface 8. A passageway 4 for electrolyte 5 is between anode 2 and wall 3. Mesh 11 is located at a throat section 12 of passageway 4 shortly before the start of the guide 7. In addition, mesh 13 is located further upstream in passageway 4 as an alternative and/or as an addition to mesh 11. Guide 7 of wall 3, serrations 9, and meshes 11 and 13 enhance and maximize the production of stream-wise vortices. These vortices cause a substantial increase in the ion flow, which overcomes boundary layers and results in additional deposition of copper onto the web 6.

摘要翻译： 电镀站S具有带有阳极2的头部1，其一侧位于电中性壁3上。 提供阳极2的宽度以适应幅材6的宽度。 在阳极2上设置有锯齿9，特别是在顶面8的区域。 用于电解质5的通道4在阳极2和壁3之间。 网格11在引导件7的开始之前不久，位于通道4的喉部12处。 此外，网状物13位于通道4的更上游，作为网状物11的替代和/或添加。 壁3的引导件7，锯齿9和网格11和13增强了流动涡流的产生和最大化。 这些涡流引起离子流的显着增加，其克服了边界层并导致铜附加到幅材6上。

公开(公告)号：US06911137B2

公开(公告)日：2005-06-28

申请号：US10258443

申请日：2001-04-26

申请人： Dammes Hans Van Der Weijde

发明人： Dammes Hans Van Der Weijde

IPC分类号： C25D5/08 ,  C25D7/06 ,  C25D17/00 ,  C25D21/10 ,  C25D21/12 ,  C25D5/34

CPC分类号： C25D7/0685 ,  C25D5/08

摘要： Method for the electrolytic coating of a metal strip, in which the strip forms a cathode and is moved in its longitudinal direction relative to an anode, an electrolyte flowing at least between the strip and the anode, characterized in that the flow of the electrolyte is influenced by holding a body between the strip and the anode. A device for the electrolytic coating of a metal strip is also enclosed.

摘要翻译： 金属带的电解涂覆方法，其中所述条形成阴极并相对于阳极在其纵向方向上移动，至少在所述带和阳极之间流动的电解质，其特征在于，所述电解质的流动为 通过在带和阳极之间保持一个体来影响。 还封闭了用于金属带的电解涂层的装置。