Sensing device for non-volatile memory

    公开(公告)号:US12027214B2

    公开(公告)日:2024-07-02

    申请号:US17949255

    申请日:2022-09-21

    发明人: Che-Wei Chang

    摘要: A sensing device for a non-volatile memory includes a reference circuit, two switches, a sensing circuit and a judging circuit. The reference circuit is connected to a first node. A first terminal of the first switch is connected with the first node and a control terminal of the first switch receives an inverted reset pulse. A first terminal of the second switch is connected with the first node, a second terminal of the second switch receives a ground voltage, and a control terminal of the second switch receives a reset pulse. The sensing circuit is connected between the second terminal of the first switch and a second node. The sensing circuit generates a first sensed current. The judging circuit is connected to the second node. The judging circuit receives the first sensed current and generates an output data according to the first sensed current.

    THREE-DIMENSIONAL NOR ARRAY AND METHOD OF MAKING THE SAME

    公开(公告)号:US20240206171A1

    公开(公告)日:2024-06-20

    申请号:US18352025

    申请日:2023-07-13

    摘要: A semiconductor structure includes a vertical stack of repetition units, where each instance of the repetition unit extends along a first horizontal direction and includes a first electrically conductive strip, a first memory film located over the first electrically conductive strip, discrete semiconductor channels that are laterally spaced apart from each other along the first horizontal direction and located above the first memory film, a second memory film located above the discrete semiconductor channels, a second electrically conductive strip located above the second memory film, and an insulating strip located above the first electrically conductive strip. Source/drain openings are arranged along the first horizontal direction, interlaced with the discrete semiconductor channels, and vertically extending through the vertical stack of repetition units, and source/drain pillar structures are located in respective source/drain openings, and vertically extending through the vertical stack of repetition units.

    THREE-DIMENSIONAL NOR ARRAY AND METHOD OF MAKING THE SAME

    公开(公告)号:US20240206169A1

    公开(公告)日:2024-06-20

    申请号:US18351992

    申请日:2023-07-13

    摘要: A semiconductor structure includes a vertical stack of repetition units, where each instance of the repetition unit extends along a first horizontal direction and includes a first electrically conductive strip, a first memory film located over the first electrically conductive strip, discrete semiconductor channels that are laterally spaced apart from each other along the first horizontal direction and located above the first memory film, a second memory film located above the discrete semiconductor channels, a second electrically conductive strip located above the second memory film, and an insulating strip located above the first electrically conductive strip. Source/drain openings are arranged along the first horizontal direction, interlaced with the discrete semiconductor channels, and vertically extending through the vertical stack of repetition units, and source/drain pillar structures are located in respective source/drain openings, and vertically extending through the vertical stack of repetition units.

    Memory device supporting interleaved operations and memory system including the same

    公开(公告)号:US12014781B2

    公开(公告)日:2024-06-18

    申请号:US17507326

    申请日:2021-10-21

    申请人: SK hynix Inc.

    摘要: A memory system includes a first memory die including multiple planes each including a plurality of memory cells and a controller configured to perform data communication with the first memory die through a first channel, and transfer at least two commands from among commands for an erase operation, a read operation, a program operation, and a check operation to the first memory die. After transferring an erase command to a plane among the multiple planes, the controller transfers a read command, a program command, or a check command to another plane among the multiple planes while the first memory die performs an erase operation corresponding to the erase command in the plane.

    MEMORY PROGRAM-VERIFY WITH ADAPTIVE SENSE TIME BASED ON ROW LOCATION

    公开(公告)号:US20240194277A1

    公开(公告)日:2024-06-13

    申请号:US18360306

    申请日:2023-07-27

    IPC分类号: G11C16/34 G11C16/08 G11C16/26

    摘要: Technology is disclosed herein for a memory system that includes control circuits that are configured to connect to a three-dimensional memory structure. The memory structure includes NAND strings arranged in a plurality of rows, a plurality of bit lines connected to the NAND strings and a plurality of word lines, each word line coupled to the plurality of rows of NAND strings. The control circuits are configured to, in a program-verify operation, sense memory cells of a first row of NAND strings coupled to the selected word line for a first sense time and sense memory cells of a second row of NAND strings coupled to the selected word line for a second sense time while applying a program-verify voltage to the selected word line.