VERTICAL MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME
    73.
    发明申请
    VERTICAL MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME 有权
    垂直存储器件及其制造方法

    公开(公告)号:US20120098048A1

    公开(公告)日:2012-04-26

    申请号:US13221380

    申请日:2011-08-30

    CPC classification number: H01L27/11582 H01L29/7926

    Abstract: A vertical memory device includes a channel, a ground selection line (GSL), word lines and a string selection line (SSL). The channel extends in a first direction substantially perpendicular to a top surface of a substrate, and a thickness of the channel is different according to height. The GSL, the word lines and the SSL are sequentially formed on a sidewall of the channel in the first direction and spaced apart from each other.

    Abstract translation: 垂直存储器件包括通道,接地选择线(GSL),字线和字符串选择线(SSL)。 通道沿基本上垂直于基板的顶表面的第一方向延伸,并且通道的厚度根据高度而不同。 GSL,字线和SSL顺序地形成在通道的第一方向的侧壁上并且彼此间隔开。

    METHOD FOR FORMING SEMICONDUCTOR DEVICE HAVING METALLIZATION COMPRISING SELECT LINES, BIT LINES AND WORD LINES
    74.
    发明申请
    METHOD FOR FORMING SEMICONDUCTOR DEVICE HAVING METALLIZATION COMPRISING SELECT LINES, BIT LINES AND WORD LINES 有权
    形成包含选择线,位线和字线的金属化的半导体器件的方法

    公开(公告)号:US20120009767A1

    公开(公告)日:2012-01-12

    申请号:US13236000

    申请日:2011-09-19

    Abstract: A semiconductor device includes a semiconductor substrate including a first region having a cell region and a second region having a peripheral circuit region, first transistors on the semiconductor substrate, a first protective layer covering the first transistors, a first insulation layer on the first protective layer, a semiconductor pattern on the first insulation layer in the first region, second transistors on the semiconductor pattern, a second protective layer covering the second transistors, the second protective layer having a thickness greater than that of the first protective layer, and a second insulation layer on the second protective layer and the first insulation layer of the second region.

    Abstract translation: 半导体器件包括:半导体衬底,包括具有单元区域的第一区域和具有外围电路区域的第二区域;半导体衬底上的第一晶体管;覆盖第一晶体管的第一保护层;第一保护层上的第一绝缘层; ,第一区域中的第一绝缘层上的半导体图案,半导体图案上的第二晶体管,覆盖第二晶体管的第二保护层,第二保护层的厚度大于第一保护层的厚度,第二绝缘层 在第二保护层和第二区域的第一绝缘层上。

    Methods of forming SRAM devices having buried layer patterns
    75.
    发明授权
    Methods of forming SRAM devices having buried layer patterns 有权
    形成具有埋层图案的SRAM器件的方法

    公开(公告)号:US08048727B2

    公开(公告)日:2011-11-01

    申请号:US12687545

    申请日:2010-01-14

    CPC classification number: H01L27/11 H01L27/0688 H01L27/105 H01L27/1116

    Abstract: An SRAM device includes a substrate having at least one cell active region in a cell array region and a plurality of peripheral active regions in a peripheral circuit region, a plurality of stacked cell gate patterns in the cell array region, and a plurality of peripheral gate patterns disposed on the peripheral active regions in the peripheral circuit region. Metal silicide layers are disposed on at least one portion of the peripheral gate patterns and on the semiconductor substrate near the peripheral gate patterns, and buried layer patterns are disposed on the peripheral gate patterns and on at least a portion of the metal silicide layers and the portions of the semiconductor substrate near the peripheral gate patterns. An etch stop layer and a protective interlayer-insulating layer are disposed around the peripheral gate patterns and on the cell array region. Methods of forming an SRAM device are also disclosed.

    Abstract translation: SRAM器件包括:在单元阵列区域中具有至少一个单元有源区和外围电路区中的多个外围有源区,单元阵列区中的多个堆叠单元栅极图案和多个外围栅极的基板 设置在外围电路区域的外围有源区上的图案。 金属硅化物层设置在外围栅极图案的至少一部分上以及半导体衬底附近的外围栅极图案上,并且掩埋层图案设置在外围栅极图案和金属硅化物层的至少一部分上,并且 半导体衬底在周边栅极图案附近的部分。 蚀刻停止层和保护性层间绝缘层设置在周围栅极图案和电池阵列区域周围。 还公开了形成SRAM器件的方法。

    MULTI-LAYER MEMORY DEVICES
    76.
    发明申请
    MULTI-LAYER MEMORY DEVICES 有权
    多层存储器件

    公开(公告)号:US20110163411A1

    公开(公告)日:2011-07-07

    申请号:US13049495

    申请日:2011-03-16

    Abstract: A nonvolatile memory device includes a semiconductor substrate having a first well region of a first conductivity type, and at least one semiconductor layer formed on the semiconductor substrate. A first cell array is formed on the semiconductor substrate, and a second cell array formed on the semiconductor layer. The semiconductor layer includes a second well region of the first conductivity type having a doping concentration greater than a doping concentration of the first well region of the first conductivity type. As the doping concentration of the second well region is increased, a resistance difference may be reduced between the first and second well regions.

    Abstract translation: 非易失性存储器件包括具有第一导电类型的第一阱区和形成在半导体衬底上的至少一个半导体层的半导体衬底。 第一单元阵列形成在半导体衬底上,第二单元阵列形成在半导体层上。 半导体层包括第一导电类型的第二阱区,其具有大于第一导电类型的第一阱区的掺杂浓度的掺杂浓度。 随着第二阱区域的掺杂浓度增加,可以在第一和第二阱区域之间减小电阻差。

    One transistor DRAM device and method of forming the same
    79.
    发明授权
    One transistor DRAM device and method of forming the same 有权
    一种晶体管DRAM器件及其形成方法

    公开(公告)号:US07795651B2

    公开(公告)日:2010-09-14

    申请号:US12024459

    申请日:2008-02-01

    Abstract: A one transistor DRAM device includes: a substrate with an insulating layer, a first semiconductor layer provided on the insulating layer and including a first source region and a first region which are in contact with the insulating layer and a first floating body between the first source region and the first drain region, a first gate pattern to cover the first floating body, a first interlayer dielectric to cover the first gate pattern, a second semiconductor layer provided on the first interlayer dielectric and including a second source region and a second drain region which are in contact with the first interlayer dielectric and a second floating body between the second source region and the second drain region, and a second gate pattern to cover the second floating body.

    Abstract translation: 一个晶体管DRAM器件包括:具有绝缘层的衬底,设置在绝缘层上的第一半导体层,包括与绝缘层接触的第一源极区域和第一区域以及第一源极 区域和第一漏极区域,覆盖第一浮动体的第一栅极图案,覆盖第一栅极图案的第一层间电介质,设置在第一层间电介质上并包括第二源极区域和第二漏极区域的第二半导体层 其与第一层间电介质接触,第二浮动体与第二源极区和第二漏极区之间接触,第二栅极图案覆盖第二浮体。

    METHODS OF FORMING NAND-TYPE NONVOLATILE MEMORY DEVICES
    80.
    发明申请
    METHODS OF FORMING NAND-TYPE NONVOLATILE MEMORY DEVICES 有权
    形成NAND型非易失性存储器件的方法

    公开(公告)号:US20090233405A1

    公开(公告)日:2009-09-17

    申请号:US12474896

    申请日:2009-05-29

    CPC classification number: H01L27/11524 H01L27/0688 H01L27/11551

    Abstract: Methods of forming a NAND-type nonvolatile memory device include: forming first common drains and first common sources alternatively in an active region which is defined in a semiconductor substrate and extends one direction, forming a first insulating layer covering an entire surface of the semiconductor substrate, patterning the first insulating layer to form seed contact holes which are arranged at regular distance and expose the active region, forming a seed contact structure filling each of the seed contact holes and a semiconductor layer disposed on the first insulating layer and contacting the seed contact structures, patterning the semiconductor layer to form a semiconductor pattern which extends in the one direction and is disposed over the active region, forming second common drains and second common sources disposed alternatively in the semiconductor pattern in the one direction, forming a second insulating layer covering an entire surface of the semiconductor substrate, forming a source line pattern continuously penetrating the second insulating layer, the semiconductor pattern and the first insulating layer, the source line pattern being connected with the first and second common sources, wherein a grain boundary of the semiconductor layer is positioned at a center between the one pair of seed contact structures adjacent to each other, and is positioned over the first common drain or the first common source.

    Abstract translation: 形成NAND型非易失性存储器件的方法包括:在半导体衬底中限定的有源区域中交替形成第一公共漏极和第一公共源,并延伸一个方向,形成覆盖半导体衬底的整个表面的第一绝缘层 图案化第一绝缘层以形成以规则距离布置的暴露有源区域的种子接触孔,形成填充每个种子接触孔的种子接触结构以及设置在第一绝缘层上并接触种子接触的半导体层 结构,图案化所述半导体层以形成在所述一个方向上延伸并设置在所述有源区上方的半导体图案,形成沿所述一个方向交替设置在所述半导体图案中的第二公共漏极和第二公共源,形成第二绝缘层覆盖层 半导体衬底的整个表面 使源极线图案连续地穿过第二绝缘层,半导体图案和第一绝缘层,源极线图案与第一和第二共用源连接,其中半导体层的晶界位于第二绝缘层之间的中心 一对种子接触结构彼此相邻,并且位于第一公共漏极或第一公共源的上方。

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