Abstract:
A non-volatile semiconductor memory device with good write/erase characteristics is provided. A selection gate is formed on a p-type well of a semiconductor substrate via a gate insulator, and a memory gate is formed on the p-type well via a laminated film composed of a silicon oxide film, a silicon nitride film, and a silicon oxide film. The memory gate is adjacent to the selection gate via the laminated film. In the regions on the both sides of the selection gate and the memory gate in the p-type well, n-type impurity diffusion layers serving as the source and drain are formed. The region controlled by the selection gate and the region controlled by the memory gate located in the channel region between said impurity diffusion layers have the different charge densities of the impurity from each other.
Abstract:
An operation scheme for operating stably a semiconductor nonvolatile memory device is provided. When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes. Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.
Abstract:
A MONOS nonvolatile memory of a split gate structure, wherein writing and erasing are performed by hot electrons and hot holes respectively, is prone to cause electrons not to be erased and to remain in an Si nitride film on a select gate electrode sidewall and that results in the deterioration of rewriting durability. When long time erasing is applied as a measure to solve the problem, drawbacks appear, such as the increase of a circuit area caused by the increase of the erasing current and the deterioration of retention characteristics. In the present invention, an Si nitride film is formed by the reactive plasma sputter deposition method that enables oriented deposition and the Si nitride film on a select gate electrode sidewall is removed at the time when a top Si oxide film is formed.
Abstract:
A nonvolatile semiconductor memory device of a split gate structure having a gate of low resistance suitable to the arrangement of a memory cell array is provided. When being formed of a side wall spacer, a memory gate is formed of polycrystal silicon and then replaced with nickel silicide. Thus, its resistance can be lowered with no effect on the silicidation to the selection gate or the diffusion layer.
Abstract:
The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence of scratches. Further, flatness of the surface of a dressing tool can be guaranteed because of sizing cutting-in; even if a thick grindstone of a few centimeters is used, the flatness can be maintained to the end; and processing with less in-face unevenness can be always carried out. Therefore, the life of the dressing tool can be greatly extended. Further, the present sizing-dressing is carried out jointly with processing of a wafer to thereby enable improvement of throughput of the apparatus as well as maintenance of a processing rate. The present apparatus and method are effective for planarization of various substrate surfaces having irregularities.
Abstract:
A method for fabricating a semiconductor device includes grindstone surface activation treatment by means of a brush or ultrasonic wave carried out when a concave/convex pattern of a semiconductor wafer is planarized by polishing a semiconductor wafer held by a wafer holder by using a grindstone constituted of abrasive grains and material for holding the abrasive grains onto which the semiconductor wafer is pressed with relative motion. The semiconductor wafer is processed with high removal rate and the polishing thickness is controlled accurately.
Abstract:
According to one embodiment, a method for producing a magnetic head includes depositing a first film above a substrate, etching a pattern into the first film, depositing a second film on the etched portion of the first film, and depositing a third film above the first and second film to form a multilayer magnetic film, wherein the second film is embedded between the first and third film in a portion of the first film that is removed. In another embodiment, a differential magnetic read head includes a magnetic multilayer film comprising a stack of a first magnetic sensor film and a second magnetic sensor film which are not magnetically connected and a hard magnetic film provided on both sides in a track width direction of the magnetic multilayer film for controlling a magnetic domain of the magnetic multilayer film. The hard magnetic film is a laminated structure as described above.
Abstract:
In one embodiment, a differential-type magnetic read head includes a differential-type magneto-resistive-effect film formed on a substrate, and a pair of electrodes for applying current in a direction perpendicular to a film plane of the film. The film includes a first and second stacked film, each having a pinned layer, an intermediate layer, and a free layer, with the second stacked film being formed on the first stacked film. A side face in a track width direction of the film is shaped to have an inflection point at an intermediate position in a thickness direction of the film, and the side face is shaped to be approximately vertical to the substrate in an upward direction of the substrate from the inflection point. Also, the side face is shaped to be gradually increased in track width as approaching the substrate in a downward direction of the substrate from the inflection point.
Abstract:
A magnetic head, according to one embodiment, includes a sensor film, a sensor cap film provided above the sensor film, a pair of shields including an upper magnetic shield and a lower magnetic shield which serve as electrodes that pass current in a film thickness direction of the sensor film, a track insulating film contacting both sides of the sensor film in the track width direction, a graded domain control film arranged on both sides in the track width direction of the sensor film adjacent the track insulating film, and an element height direction insulating film positioned on an opposite side of the sensor film relative to an air-bearing surface, wherein an edge position of the element height direction insulating film adjacent the sensor film on the air-bearing surface side is substantially the same as an edge position of the sensor cap film in the element height direction.
Abstract:
According to one embodiment, a method for producing a magnetic head includes depositing a first film above a substrate, etching a pattern into the first film, depositing a second film on the etched portion of the first film, and depositing a third film above the first and second film to form a multilayer magnetic film, wherein the second film is embedded between the first and third film in a portion of the first film that is removed. In another embodiment, a differential magnetic read head includes a magnetic multilayer film comprising a stack of a first magnetic sensor film and a second magnetic sensor film which are not magnetically connected and a hard magnetic film provided on both sides in a track width direction of the magnetic multilayer film for controlling a magnetic domain of the magnetic multilayer film. The hard magnetic film is a laminated structure as described above.