Fan unit
    74.
    发明授权
    Fan unit 有权
    风扇单元

    公开(公告)号:US08747056B2

    公开(公告)日:2014-06-10

    申请号:US12775784

    申请日:2010-05-07

    IPC分类号: F01D17/00

    CPC分类号: G06F1/20 Y10T137/86139

    摘要: A fan unit includes a housing having an air inlet and an air outlet; a first fan and second fan mounted in the air inlet and the air outlet respectively and arranged in tandem so as to generate an air flow; a first valve mounted adjacent to the air inlet for allowing air to flow into the housing and preventing air from flowing out of the housing; and a second valve mounted adjacent to the air outlet for allowing air to flow out of the housing and preventing air from flowing into the housing.

    摘要翻译: 风扇单元包括具有空气入口和空气出口的壳体; 第一风扇和第二风扇分别安装在空气入口和空气出口中,并排配置成一起产生气流; 邻近所述空气入口安装的第一阀,用于允许空气流入所述壳体并防止空气流出所述壳体; 以及安装在所述空气出口附近的第二阀,用于允许空气流出所述壳体并防止空气流入所述壳体。

    DOOR LOCKING DEVICE
    76.
    发明申请
    DOOR LOCKING DEVICE 有权
    门锁装置

    公开(公告)号:US20140053618A1

    公开(公告)日:2014-02-27

    申请号:US14113721

    申请日:2012-04-13

    IPC分类号: E05B65/12 E05B49/00

    摘要: A door locking device which is reduced in size relative to a conventional device includes a key operation transmission link, which transmits a key operation force relative to a key cylinder to a relay lever corresponding to “a lock switch member”, and which is arranged to rotate about a common rotation axis shared with the relay lever. In addition, a rotation space for first and second movable contact portions fits within a circular-shaped area around the common rotation axis because a first fan-shaped protruding portion including the first movable contact portion for transmitting a force to the key operation transmission link and the relay lever and a second fan-shaped protruding portion including the second movable contact portion for transmitting the force to the key operation transmission link and the relay lever are arranged around the common rotation axis.

    摘要翻译: 一种相对于传统装置尺寸减小的门锁装置包括一个钥匙操作传动链节,其将相对于钥匙筒的钥匙操作力传递到对应于“锁定开关件”的继电器杆, 围绕与继电器杆共用的共同旋转轴旋转。 此外,由于第一扇形突起部分包括用于向键操作传输链路传递力的第一可动接触部分和第二可动接触部分的旋转空间,所以第一和第二可动接触部分的旋转空间适合围绕公共旋转轴线的圆形区域, 继电器杆和包括用于将力传递到键操作传递连杆和继电器杆的第二可动接触部分的第二扇形突出部分布置在共同旋转轴线周围。

    MULTILAYER FILM, MAGNETIC HEAD, MAGNETIC HEAD DEVICE, MAGNETIC RECORDING/REPRODUCING APPARATUS AND METHOD FOR MANUFACTURING MULTILAYER FILM
    77.
    发明申请
    MULTILAYER FILM, MAGNETIC HEAD, MAGNETIC HEAD DEVICE, MAGNETIC RECORDING/REPRODUCING APPARATUS AND METHOD FOR MANUFACTURING MULTILAYER FILM 有权
    多层膜,磁头,磁头装置,磁记录/再现装置和制造多层膜的方法

    公开(公告)号:US20140016233A1

    公开(公告)日:2014-01-16

    申请号:US13548715

    申请日:2012-07-13

    IPC分类号: G11B5/48 C25D5/18 G11B5/33

    摘要: In the present invention, magnetic and non-magnetic films are formed as a compound of Fe, Ni and P to provide a multilayer film in which such magnetic and non-magnetic films are alternately stacked.The multilayer film includes a magnetic film and a non-magnetic film. The magnetic film and the non-magnetic film are alternately stacked. The magnetic film contains Fe, Ni and P but has Fe as a main component. The magnetic film contains Fe, Ni and P but has Fe or Ni as a main component. The non-magnetic film contains Fe, Ni and P but has Ni as a main component.

    摘要翻译: 在本发明中,作为Fe,Ni和P的化合物形成磁性和非磁性膜,以提供交替堆叠这种磁性和非磁性膜的多层膜。 多层膜包括磁性膜和非磁性膜。 磁性膜和非磁性膜交替堆叠。 磁性膜含有Fe,Ni和P,但以Fe为主要成分。 磁性膜含有Fe,Ni和P,但以Fe或Ni为主要成分。 非磁性膜含有Fe,Ni和P,但以Ni为主要成分。

    Bonding material, bonded portion and circuit board
    80.
    发明授权
    Bonding material, bonded portion and circuit board 有权
    接合材料,接合部分和电路板

    公开(公告)号:US08293370B2

    公开(公告)日:2012-10-23

    申请号:US12376370

    申请日:2007-08-03

    IPC分类号: B32B15/04 C22C12/00

    摘要: Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material.

    摘要翻译: 公开了一种焊接材料,其能够在安装电子部件时实现较低的安装温度。 还公开了焊膏和导电粘合剂。 具体公开了具有由Sn,Bi和In构成的基本组成的焊料。 该焊料材料还可含有选自Cu,Ge和Ni中的至少一种金属。 可以通过将助焊剂成分混合到焊料材料中来获得能够实现低温安装的焊膏。 可以通过将树脂成分混合到焊料材料中来获得能够实现低温安装的导电粘合剂。