公开(公告)号：US12268063B2

公开(公告)日：2025-04-01

申请号：US17485184

申请日：2021-09-24

Applicant: BOE Technology Group Co., Ltd.

Inventor： Fengjuan Liu ,  Ke Wang ,  Wei Liu ,  Tianmin Zhou

IPC: H10K59/131 ,  H10K50/80 ,  H10K59/126 ,  H10K102/00

Abstract: A displaying substrate and a displaying device. The displaying substrate comprises a flexible base plate; a first auxiliary electrode arranged on one side of the flexible base plate, the first auxiliary electrode being connected with a first power cord; a pixel unit arranged on a side of the flexible base plate away from a first metal layer, the pixel unit comprising: thin-film transistors arranged on the side of the flexible base plate away from the first metal layer, an insulation layer and a second auxiliary electrode, the second auxiliary electrode being connected with a second power cord, wherein the plurality of thin-film transistors comprise a drive transistor, the drive transistor has a source connected with the first auxiliary electrode and a drain connected with a first electrode of a light emitting device, a second electrode of the light emitting device is connected with the second auxiliary electrode.

公开(公告)号：US12199227B2

公开(公告)日：2025-01-14

申请号：US17260778

申请日：2020-04-10

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhanfeng Cao ,  Ke Wang ,  Jianguo Wang ,  Guocai Zhang ,  Guangcai Yuan ,  Xue Dong

IPC: H01L33/62 ,  H01L33/12

Abstract: The present disclosure provides a driving substrate, a method for preparing the same, and a display device. The driving substrate includes: a base substrate; a stress buffer layer located on the base substrate; a plurality of first wirings located on a surface of the stress buffer layer away from the base substrate; a first insulating layer located on a surface of the first wiring away from the base substrate; a plurality of second wiring structures located on a surface of the first insulating layer away from the base substrate; a second insulating layer located on a surface of the second wiring structure away from the base substrate; an electronic element located on a surface of the second insulating layer away from the base substrate.

公开(公告)号：US12057536B2

公开(公告)日：2024-08-06

申请号：US16957766

申请日：2019-08-30

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Ke Wang ,  Zhanfeng Cao

IPC: H01L33/62 ,  H01L25/075 ,  H01L23/00

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L24/32 ,  H01L2224/32245 ,  H01L2924/12041 ,  H01L2933/0066

Abstract: The present disclosure relates to a backplane, a backlight source, a display device, and a manufacturing method of the backplane. The backplane includes: a substrate; a plurality of barriers disposed on a surface of the substrate; and a first metal layer disposed on the surface of the substrate and including a plurality of metal patterns spaced apart by the plurality of barriers, wherein the barrier and the metal pattern are connected by a concave-convex mating structure.

公开(公告)号：US12057520B2

公开(公告)日：2024-08-06

申请号：US16918753

申请日：2020-07-01

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Yingwei Liu ,  Zhiwei Liang ,  Ke Wang ,  Zhanfeng Cao ,  Shuang Liang

IPC: H01L33/00 ,  H01L27/15 ,  H01L33/48 ,  H01L33/56

CPC classification number: H01L33/0093 ,  H01L27/156 ,  H01L33/486 ,  H01L33/56 ,  H01L2933/005

Abstract: A method for manufacturing a display substrate includes: fabricating a first functional structure on a first side of a common substrate, and fabricating a second functional structure on a second side of the common substrate; fabricating a via hole in an edge region of the common substrate; and fabricating a conductive connection portion in the via hole, a first end of the conductive connection portion on the first side extending out of the via hole and coupled to a first functional pattern in the first functional structure, and a second end of the conductive connection portion on the second side extending out of the via hole and coupled to a second functional pattern in the second functional structure. The method provided in embodiments of the present disclosure is applied to the manufacturing of a display substrate.

公开(公告)号：US20240260185A1

公开(公告)日：2024-08-01

申请号：US18017902

申请日：2022-02-24

Applicant: BOE Technology Group Co., Ltd.

Inventor： Jiaxiang Zhang ,  Nianqi Yao ,  Ke Wang

IPC: H05K1/11 ,  H01L21/48 ,  H01L23/498 ,  H01L25/075 ,  H01L25/16 ,  H01L27/12 ,  H05K1/09 ,  H05K1/18 ,  H05K3/06

CPC classification number: H05K1/111 ,  H01L21/4846 ,  H01L23/49838 ,  H01L27/124 ,  H05K3/067 ,  H01L23/49866 ,  H01L25/0753 ,  H01L25/167 ,  H05K1/09 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2201/10151

Abstract: A circuit board and a method for manufacturing the circuit board, a functional backplate, a backlight module, a display apparatus, and a display panel are provided. The circuit board includes: a base substrate; a wire arranged on the base substrate, where the wire includes a first conductive layer; and at least one insulating layer arranged on a side of the first conductive layer away from the base substrate, where the at least one insulating layer covers the first conductive layer. The first conductive layer includes a first stacked structure on a side away from the base substrate and a second stacked structure proximate to the base substrate, and the first stacked structure includes at least an etch stop layer covering the second stacked structure.

公开(公告)号：US11990481B2

公开(公告)日：2024-05-21

申请号：US17418945

申请日：2020-09-18

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhanfeng Cao ,  Ke Wang ,  Zhiwei Liang ,  Jianguo Wang ,  Guocai Zhang ,  Xinhong Lu ,  Qi Qi

IPC: H01L27/12 ,  G02F1/13357 ,  H01L25/075 ,  H01L27/15 ,  H01L33/62

CPC classification number: H01L27/124 ,  G02F1/133603 ,  H01L25/0753 ,  H01L27/127 ,  H01L27/156 ,  H01L33/62 ,  H01L2933/0066

Abstract: The present disclosure provides an array substrate and a manufacturing method thereof, a display panel and a backlight module. The manufacturing method of the array substrate includes: providing a base substrate; forming a metal wiring layer on a side of the base substrate, the metal wiring layer including a first copper metal layer; forming a planarization layer on a side of the metal wiring layer away from the base substrate; forming a drive lead layer on a side of the planarization layer away from the base substrate, the drive lead layer being electrically connected to the metal wiring layer, the drive lead layer including a second copper metal layer with a thickness larger than that of the first copper metal layer; forming a functional device layer on a side of the drive lead layer away from the base substrate.

公开(公告)号：US11764343B2

公开(公告)日：2023-09-19

申请号：US16982217

申请日：2019-12-19

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhiwei Liang ,  Yingwei Liu ,  Zhijun Lv ,  Ke Wang ,  Zhanfeng Cao ,  Hsuanwei Mai ,  Guangcai Yuan ,  Muxin Di

IPC: H01L33/62 ,  H01L23/00 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L24/03 ,  H01L24/05 ,  H01L25/0753 ,  H01L2224/0219 ,  H01L2224/02166 ,  H01L2224/02185 ,  H01L2224/03013 ,  H01L2224/03462 ,  H01L2224/03614 ,  H01L2224/03622 ,  H01L2224/0401 ,  H01L2224/05017 ,  H01L2224/0518 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2933/0066

Abstract: A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.

公开(公告)号：US11380662B2

公开(公告)日：2022-07-05

申请号：US16973162

申请日：2020-03-05

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Ke Wang

IPC: H01L25/16 ,  H01L27/12 ,  H01L33/62 ,  G02F1/1335 ,  G02F1/13357

Abstract: The present disclosure provides a manufacturing method of a display backplane which includes a base substrate having first, second and third portions. The manufacturing method includes: forming a flexible layer extending from the first portion to and covering the second and third portions; forming a pixel driving circuit on the first portion and a backlight circuit on the third portion, wherein a part of a film layer of the pixel driving circuit extends from the first portion to and covers the second and third portions; removing a film layer on a side of the flexible layer away from the base substrate and on the second portion; separating the flexible layer from the second and third portions; removing the second and third portions; and bending a film layer separated from the third portion to a side of the first portion away from the flexible layer.

公开(公告)号：US20220199650A1

公开(公告)日：2022-06-23

申请号：US17057546

申请日：2020-03-24

Applicant: BOE Technology Group Co., Ltd.

Inventor： Ke Wang ,  Muxin Di ,  Zhiwei Liang ,  Guoqiang Wang ,  Renquan Gu ,  Xiaoxin Song ,  Xiaoyan Zhu ,  Yingwei Liu ,  Zhanfeng Cao

IPC: H01L27/12

Abstract: An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.

公开(公告)号：US20220190263A1

公开(公告)日：2022-06-16

申请号：US17279782

申请日：2020-06-02

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Shengguang Ban ,  Zhanfeng Cao ,  Ke Wang ,  Pinfan Wang

IPC: H01L51/00

Abstract: A display panel is provided. The display panel may include a flexible substrate (100) including a display region (20) and a dummy region (22). The dummy region (22) may be at periphery of the display region (20). The display region (20) may include a plurality of display islands (26), a plurality of first openings (28) surrounding each of the plurality of display islands (26), a plurality of first bridges (30) connecting the plurality of display islands (26), and a plurality of display units on the plurality of display islands (26), respectively. The dummy region (22) may include a plurality of dummy islands, a plurality of dummy openings surrounding each of the plurality of dummy islands, and a plurality of dummy bridges connecting the plurality of dummy islands. The dummy region (22) may not include display units.