Method and apparatus for detecting endpoint during plasma etching of thin films
    71.
    发明授权
    Method and apparatus for detecting endpoint during plasma etching of thin films 有权
    用于在薄膜等离子体蚀刻期间检测端点的方法和装置

    公开(公告)号:US06908846B2

    公开(公告)日:2005-06-21

    申请号:US10401114

    申请日:2003-03-27

    摘要: A method for controlling a plasma etch process while etching a layer stack having a first layer disposed above an end-point generating layer is disclosed. The method includes etching through the first layer and at least partially through the end-point generating layer while monitoring an absorption rate of a light beam traversing an interior portion of the plasma processing chamber, wherein the end-point generating layer is selected from a material that produces a detectable change in the absorption rate when etched. The end-point generating layer is characterized by at least one of a first characteristic and a second characteristic. The first characteristic is an insufficient thickness to function as an etch stop layer, and the second characteristic is an insufficient selectivity to etchants employed to etch through the first layer to function as the etch stop layer. The method additionally includes generating an end-point signal upon detecting the detectable change.

    摘要翻译: 公开了一种用于在蚀刻具有设置在端点产生层上方的第一层的层堆叠的同时控制等离子体蚀刻工艺的方法。 该方法包括:在监测穿过等离子体处理室的内部部分的光束的吸收率的同时,蚀刻穿过第一层并且至少部分地穿过端点产生层,其中端点产生层选自材料 其在蚀刻时产生可检测的吸收速率变化。 端点产生层的特征在于第一特征和第二特性中的至少一个。 第一特征是不足以用作蚀刻停止层的厚度,并且第二特性对于用于蚀刻通过第一层以用作蚀刻停止层的蚀刻剂的选择性不足。 该方法还包括在检测到可检测变化时产生端点信号。

    Controlling ion energy distribution in plasma processing systems

    公开(公告)号:US09887069B2

    公开(公告)日:2018-02-06

    申请号:US12634959

    申请日:2009-12-10

    IPC分类号: H01J37/32

    CPC分类号: H01J37/32623 H01J37/32091

    摘要: A plasma processing system for processing at least a substrate with plasma. The plasma processing chamber is capable of controlling ion energy distribution. The plasma processing system may include a first electrode. The plasma processing system also includes a second electrode that is different from the first electrode and is configured for bearing the substrate. The plasma processing system may also include a signal source coupled with the first electrode. The signal source may provide a non-sinusoidal signal through the first electrode to control ion energy distribution at the substrate when the substrate is processed in the plasma processing system, wherein the non-sinusoidal signal is periodic.

    Multi-Section Fishing Device
    73.
    发明申请

    公开(公告)号:US20170273287A1

    公开(公告)日:2017-09-28

    申请号:US15499273

    申请日:2017-04-27

    申请人: Eric Hudson

    发明人: Eric Hudson Van Lee

    IPC分类号: A01K85/18

    CPC分类号: A01K85/18 A01K85/00 A01K91/06

    摘要: A device for use during fishing configured to be connected to the user's fishing line to attract fish. The device is shaped to be moved through the water and generally include a head and a tail. A channel extends through at least a portion of the device and is sized to receive the fishing line. The device is constructed from multiple sections. The sections are selectively positionable between a closed configuration with the sections connected together to connect the device to the fishing line, and an open configuration with the sections being separated to remove the device from the fishing line.

    Apparatuses, systems and methods for rapid cleaning of plasma confinement rings with minimal erosion of other chamber parts
    75.
    发明授权
    Apparatuses, systems and methods for rapid cleaning of plasma confinement rings with minimal erosion of other chamber parts 有权
    用于快速清洗等离子体限制环的设备,系统和方法,其他腔室部件的侵蚀最小

    公开(公告)号:US08956461B2

    公开(公告)日:2015-02-17

    申请号:US12970908

    申请日:2010-12-16

    IPC分类号: B08B6/00 H01J37/32 B08B7/00

    摘要: An apparatus used for rapid removal of polymer films from plasma confinement rings while minimizing erosion of other plasma etch chamber components is disclosed. The apparatus includes a center assembly, an electrode plate, a confinement ring stack, a first plasma source, and a second plasma source. The electrode plate is affixed to a surface of the center assembly with a channel defined along the external circumference therein. A first plasma source is disposed within the channel and along the external circumference of the center assembly, wherein the first plasma source is configured to direct a plasma to the inner circumferential surface of the confinement ring stack. A second plasma source located away from the first plasma source is configured to perform processing operations on a substrate within the etch chamber.

    摘要翻译: 公开了一种用于从等离子体限制环快速除去聚合物膜同时最小化其它等离子体蚀刻室部件的侵蚀的装置。 该装置包括中心组件,电极板,约束环叠层,第一等离子体源和第二等离子体源。 电极板被固定到中心组件的表面,其中沿着外圆周限定了通道。 第一等离子体源设置在通道内并且沿着中心组件的外圆周,其中第一等离子体源被配置为将等离子体引导到限制环堆叠的内圆周表面。 位于远离第一等离子体源的第二等离子体源被配置为在蚀刻室内的衬底上执行处理操作。

    Electronic knob for tuning radial etch non-uniformity at VHF frequencies
    76.
    发明授权
    Electronic knob for tuning radial etch non-uniformity at VHF frequencies 有权
    用于调谐VHF频率的径向蚀刻不均匀的电子旋钮

    公开(公告)号:US08932429B2

    公开(公告)日:2015-01-13

    申请号:US13594768

    申请日:2012-08-24

    IPC分类号: C23F1/00 H01L21/306 C23C16/00

    摘要: System and methods for plasma processing of a wafer include a chamber with an electrode having a support surface and an outer edge region defined thereon. A radio frequency power is communicated to the electrode via a conductive delivery connection and returned through a conductive return connection. A capacitance is applied to a first end that causes appropriate capacitive adjustment and opposite impedance adjustment at a second end of the conductive delivery connection that is coupled to a dielectric surround structure that surrounds the electrode. The dielectric surround structure presents the opposite impedance adjustment near an outer edge of the electrode, such that increasing the capacitance at the first end causes a corresponding increase of impedance at the second end and a corresponding increase in voltage distribution near the outer edge region of the electrode that decreases toward a center of the support surface of the electrode.

    摘要翻译: 用于等离子体处理晶片的系统和方法包括具有电极的室,其具有支撑表面和限定在其上的外边缘区域。 射频功率通过导电输送连接传送到电极,并通过导电返回连接返回。 电容被施加到第一端,其导致适当的电容调整,并且在导电输送连接的第二端处相反阻抗调节,该第二端耦合到围绕电极的电介质环绕结构。 电介质环绕结构在电极的外边缘附近呈现相反的阻抗调节,使得增加第一端处的电容导致在第二端处的阻抗相应增加,并且在外部边缘区域附近的电压分布相应增加 电极朝向电极的支撑表面的中心减小。

    Apparatus for determining the endpoint of a cleaning or conditioning process in a plasma processing system
    77.
    发明授权
    Apparatus for determining the endpoint of a cleaning or conditioning process in a plasma processing system 失效
    用于确定等离子体处理系统中的清洁或调节过程的终点的装置

    公开(公告)号:US08518209B2

    公开(公告)日:2013-08-27

    申请号:US12504833

    申请日:2009-07-17

    CPC分类号: H01J37/32963 H01J37/32935

    摘要: An apparatus for determining an endpoint of a process by measuring a thickness of a layer is provided. The layer is disposed on the surface by a prior process. The apparatus includes means for providing a sensor that is coplanar with the surface, wherein the sensor is configured to measure the thickness. The apparatus also includes means for exposing the plasma chamber to a plasma, wherein the thickness is changed by the exposing, and means for determining the thickness as a function of time. The apparatus further includes means for ascertaining a steady state condition in the thickness, the steady state condition being characterized by a substantially stable measurement of the thickness, a start of the steady state condition representing the endpoint.

    摘要翻译: 提供了一种通过测量层的厚度来确定工艺的端点的装置。 该层通过先前的工艺设置在表面上。 该装置包括用于提供与表面共面的传感器的装置,其中传感器被配置成测量厚度。 该装置还包括用于将等离子体室暴露于等离子体的装置,其中通过曝光改变厚度,以及用于确定作为时间的函数的厚度的装置。 该装置还包括用于确定厚度中的稳态条件的装置,稳态条件的特征在于厚度的基本上稳定的测量,表示端点的稳态条件的开始。

    TRIODE REACTOR DESIGN WITH MULTIPLE RADIOFREQUENCY POWERS
    78.
    发明申请
    TRIODE REACTOR DESIGN WITH MULTIPLE RADIOFREQUENCY POWERS 有权
    三重反应器设计与多种无线电功能

    公开(公告)号:US20130126475A1

    公开(公告)日:2013-05-23

    申请号:US13301725

    申请日:2011-11-21

    IPC分类号: C23F1/00 H05H1/24 C23F1/08

    CPC分类号: H01J37/32091 H01J37/32165

    摘要: Methods, systems, and computer programs are presented for semiconductor manufacturing are provided. One wafer processing apparatus includes: a top electrode; a bottom electrode; a first radio frequency (RF) power source; a second RF power source; a third RF power source; a fourth RF power source; and a switch. The first, second, and third power sources are coupled to the bottom electrode. Further, the switch is operable to be in one of a first position or a second position, where the first position causes the top electrode to be connected to ground, and the second position causes the top electrode to be connected to the fourth RF power source.

    摘要翻译: 提供了半导体制造方法,系统和计算机程序。 一个晶片处理装置包括:顶部电极; 底部电极; 第一射频(RF)电源; 第二RF电源; 第三射频电源; 第四RF电源; 和开关。 第一,第二和第三电源耦合到底部电极。 此外,开关可操作为处于第一位置或第二位置之一,其中第一位置使顶部电极连接到地,而第二位置使顶部电极连接到第四RF电源 。

    Hybrid RF capacitively and inductively coupled plasma source using multifrequency RF powers and methods of use thereof
    79.
    发明授权
    Hybrid RF capacitively and inductively coupled plasma source using multifrequency RF powers and methods of use thereof 有权
    使用多频RF功率的混合RF电容和电感耦合等离子体源及其使用方法

    公开(公告)号:US08222157B2

    公开(公告)日:2012-07-17

    申请号:US12945314

    申请日:2010-11-12

    IPC分类号: H01L21/461

    摘要: A device for inductively confining capacitively coupled RF plasma formed in a plasma processing apparatus. The apparatus includes an upper electrode and a lower electrode that is adapted to support a substrate and to generate the plasma between the substrate and the upper electrode. The device includes a dielectric support ring that concentrically surrounds the upper electrode and a plurality of coil units mounted on the dielectric support ring. Each coil unit includes a ferromagnetic core positioned along a radial direction of the dielectric support ring and at least one coil wound around each ferromagnetic core. The coil units generate, upon receiving RF power from an RF power source, electric and magnetic fields that reduce the number of charged particles of the plasma diffusing away from the plasma.

    摘要翻译: 用于感应地限制在等离子体处理装置中形成的电容耦合RF等离子体等离子体的装置。 该装置包括上电极和下电极,其适于支撑衬底并在衬底和上电极之间产生等离子体。 该装置包括同心地围绕上电极的电介质支撑环和安装在电介质支撑环上的多个线圈单元。 每个线圈单元包括沿着电介质支撑环的径向定位的铁磁芯和缠绕在每个铁磁芯周围的至少一个线圈。 线圈单元在从RF电源接收到RF功率时产生电场和磁场,其减少等离子体的带电粒子的数量远离等离子体扩散。

    Modulated multi-frequency processing method
    80.
    发明授权
    Modulated multi-frequency processing method 有权
    调制多频处理方法

    公开(公告)号:US08154209B2

    公开(公告)日:2012-04-10

    申请号:US12621590

    申请日:2009-11-19

    IPC分类号: H05B31/26

    摘要: A method is provided for operating a processing system having a space therein arranged to receive a gas and an electromagnetic field generating portion operable to generate an electromagnetic field within the space. The method includes providing a gas into the space, and operating the electromagnetic field generating portion with a driving potential to generate an electromagnetic field within the space to transform at least a portion of the gas into plasma. The driving potential as a function of time is based on a first potential function portion and a second potential function portion. The first potential function portion comprises a first continuous periodic portion having a first amplitude and a first frequency. The second potential function portion comprises a second periodic portion having an maximum amplitude portion, and minimum amplitude portion and a duty cycle. The maximum amplitude portion is a higher amplitude than the minimum amplitude portion. The duty cycle is the ratio of a duration of the maximum amplitude portion to the sum of the duration of the maximum amplitude portion and the duration of the minimum amplitude portion. The second periodic portion additionally has a second frequency during the maximum amplitude portion. An amplitude modulation of the second periodic portion is phase locked to the first continuous periodic portion.

    摘要翻译: 提供了一种操作处理系统的方法,该处理系统具有布置成接收气体的空间和可操作以在该空间内产生电磁场的电磁场产生部分。 所述方法包括向所述空间提供气体,以及利用驱动电位操作所述电磁场产生部分,以在所述空间内产生电磁场,以将所述气体的至少一部分转化为等离子体。 作为时间的函数的驱动电位基于第一潜在功能部分和第二电位功能部分。 第一潜在功能部分包括具有第一幅度和第一频率的第一连续周期部分。 第二电位功能部分包括具有最大振幅部分和最小振幅部分和占空比的第二周期部分。 最大幅度部分比最小振幅部分的幅度更大。 占空比是最大幅度部分的持续时间与最大振幅部分的持续时间和最小振幅部分的持续时间之和的比率。 第二周期部分在最大振幅部分期间另外具有第二频率。 第二周期部分的幅度调制被锁相到第一连续周期部分。