公开(公告)号：US10285282B2

公开(公告)日：2019-05-07

申请号：US15886071

申请日：2018-02-01

Applicant: International Business Machines Corporation

Inventor： Joseph Kuczynski ,  Timothy Tofil ,  Jeffrey N. Judd ,  Matthew Doyle ,  Scott D. Strand

IPC: H01K3/10 ,  H05K3/38 ,  H01L21/02 ,  H05K3/42

Abstract: A triggering condition is applied to a conductive polymer positioned in a drilled hole in a printed circuit board. The applied triggering condition causes the polymer to vertically expand within the drilled hole such that the expanded polymer creates an electrically conductive path between contact pads located in different layers of the printed circuit board.

公开(公告)号：US20190021172A1

公开(公告)日：2019-01-17

申请号：US15650227

申请日：2017-07-14

Applicant: International Business Machines Corporation

Inventor： Joseph Kuczynski ,  Timothy Tofil ,  Jeffrey N. Judd ,  Matthew Doyle ,  Scott D. Strand

IPC: H05K3/38 ,  H05K3/42 ,  H01L21/02

CPC classification number: H05K3/386 ,  H01L21/02118 ,  H05K1/0251 ,  H05K1/0292 ,  H05K1/0298 ,  H05K3/4069 ,  H05K3/429 ,  H05K2201/0329 ,  Y10T29/49165

Abstract: A triggering condition is applied to a conductive polymer positioned in a drilled hole in a printed circuit board. The applied triggering condition causes the polymer to vertically expand within the drilled hole such that the expanded polymer creates an electrically conductive path between contact pads located in different layers of the printed circuit board.

公开(公告)号：US12258020B2

公开(公告)日：2025-03-25

申请号：US17444916

申请日：2021-08-12

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Matthew Doyle ,  John R. Dangler ,  Layne A. Berge ,  Jason J. Bjorgaard ,  Matthew A. Walther ,  Kyle Schoneck ,  Thomas W. Liang

IPC: B60W30/18 ,  B60W10/06 ,  B60W10/18 ,  B60W40/06

Abstract: A system and method for slowing a vehicle. Road conditions around the vehicle are monitored, and determined if those road conditions are hazardous. An engine control unit is informed of the hazardous road conditions and alters the operation of the engine control unit in response to the hazardous road conditions. When an operator of the vehicle desires to slow the vehicle down, an indication is received indicating the intent to slow the vehicle down. The vehicle is then slowed based upon the altered operation of the engine control unit by applying a vacuum to increase a manifold vacuum of the engine.

公开(公告)号：US12207392B2

公开(公告)日：2025-01-21

申请号：US17933693

申请日：2022-09-20

Applicant: International Business Machines Corporation

Inventor： Matthew Doyle ,  David Clifford Long ,  Matteo Cocchini ,  Russell A. Budd ,  James Busby ,  Roger S. Krabbenhoft ,  Arthur J. Higby

IPC: H05K1/02 ,  H01P3/08 ,  H01P11/00

Abstract: An electronic component includes a first trace configured to transmit a first signal and a second trace configured to transmit a second signal. The electronic component further includes a layer of conductive material separated from the first and second traces by a layer of insulative material. The electronic component further includes a first vertical wall formed in direct contact with the layer of conductive material. The electronic component further includes a second vertical wall formed in direct contact with the layer of conductive material. The second vertical wall is separated from the first vertical wall by a void, and the void extends between the first trace and the second trace.

公开(公告)号：US12174241B2

公开(公告)日：2024-12-24

申请号：US18147878

申请日：2022-12-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Matthew Doyle ,  Jeffrey N. Judd ,  Mark J. Jeanson ,  Timothy J. Tofil ,  Matthew S. Kelly ,  Henry Michael Newshutz

IPC: G01R31/28 ,  G01R1/18 ,  G01R33/07

Abstract: An apparatus for tin whisker isolation and detection includes a substrate having a plurality of pads for connecting to an electronic component placed on the substrate, and a shield placed on a surface of the substrate. The shield includes a plurality of cavities aligned over the plurality of pads. A plurality of sensing components each associated with one of the plurality of cavities are configured for sensing an electrically conductive growth from a corresponding pad of the plurality of pads. A plurality of circuit connections are each configured to connect one of the sensing components to detection circuitry. The detection circuitry is configured to receive one or more sensing signals from one or more of the sensing components and detect an electrically conductive growth from the corresponding pad based on the one or more sensing signals.

公开(公告)号：US12148276B2

公开(公告)日：2024-11-19

申请号：US17840662

申请日：2022-06-15

Applicant: International Business Machines Corporation

Inventor： Matthew Doyle ,  Jeffrey N. Judd ,  Timothy J. Tofil ,  Matteo Cocchini ,  Stuart Brett Benefield ,  Samuel R. Connor ,  Andrew Corbett

IPC: G08B13/16 ,  G06F18/2113

Abstract: According to one embodiment of the present invention, a computer-implemented method for autocorrelation based security monitoring and detection is disclosed. The computer-implemented method includes determining that input signal data transmitted to a white noise generator autocorrelates with itself at one or more time lags. The computer-implemented method further includes, responsive to determining that the input signal data transmitted to the white noise generator autocorrelates with itself at one or more time lags, determining whether an autocorrelation in the input signal data transmitted to the white noise generator matches one or more predetermined input signal data patterns associated with a known event or individual.

公开(公告)号：US11864327B2

公开(公告)日：2024-01-02

申请号：US17006305

申请日：2020-08-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Gerald Bartley ,  Darryl Becker ,  Matthew Doyle ,  Mark Jeanson

IPC: H01F27/28 ,  H05K3/30 ,  H01F41/04 ,  H01F17/00 ,  G03F7/00 ,  G02B6/46 ,  H01B1/02 ,  H01F27/06 ,  H01G2/06 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  G03F1/62

CPC classification number: H05K3/301 ,  G02B6/46 ,  G03F7/70733 ,  H01B1/02 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/06 ,  H01F27/2804 ,  H01F41/042 ,  H01F41/046 ,  H01G2/06 ,  H05K1/115 ,  H05K1/184 ,  H05K3/4038 ,  G03F1/62 ,  H01F2017/002 ,  H01F2017/004 ,  H01F2027/065

Abstract: An inductor structure is provided that is positioned within a via of a printed circuit board. The inductor structure includes a via extending through a printed circuit board. The inductor structure includes at least one coil of an electrically conductive material beginning at a first opening to the via continuously present on a sidewall of the via encircling a center of the via extending to a second opening of the via opposite the first opening of the via. It further includes at least electrode present in contact with an end of the coil at said first or second opening.

公开(公告)号：US20230410617A1

公开(公告)日：2023-12-21

申请号：US17840662

申请日：2022-06-15

Applicant: International Business Machines Corporation

Inventor： Matthew Doyle ,  Jeffrey N. Judd ,  Timothy J. Tofil ,  Matteo Cocchini ,  Stuart Brett Benefield ,  Samuel R. Connor ,  Andrew Corbett

IPC: G08B13/16 ,  G06K9/62

CPC classification number: G08B13/1672 ,  G06K9/623

Abstract: According to one embodiment of the present invention, a computer-implemented method for autocorrelation based security monitoring and detection is disclosed. The computer-implemented method includes determining that input signal data transmitted to a white noise generator autocorrelates with itself at one or more time lags. The computer-implemented method further includes, responsive to determining that the input signal data transmitted to the white noise generator autocorrelates with itself at one or more time lags, determining whether an autocorrelation in the input signal data transmitted to the white noise generator matches one or more predetermined input signal data patterns associated with a known event or individual.

公开(公告)号：US20230228824A1

公开(公告)日：2023-07-20

申请号：US18188963

申请日：2023-03-23

Applicant: International Business Machines Corporation

Inventor： Matthew Doyle ,  James Busby ,  Edward N. Cohen ,  John R. Dangler ,  Gerald Bartley ,  Michael Fisher ,  Arthur Higby ,  David Clifford Long ,  Mark J. Jeanson ,  Darryl Becker

IPC: G01R31/52 ,  H05K1/02 ,  G06F30/30 ,  H05K7/20 ,  H05K3/00 ,  G01K15/00 ,  H02H7/20

CPC classification number: G01R31/52 ,  G01K15/007 ,  G06F30/30 ,  H02H7/20 ,  H05K1/0201 ,  H05K1/0277 ,  H05K3/0005 ,  H05K7/20209 ,  H05K2201/012

Abstract: An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

公开(公告)号：US20230207523A1

公开(公告)日：2023-06-29

申请号：US17564170

申请日：2021-12-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Timothy J. Chainer ,  Mark D. Schultz ,  Russell A. Budd ,  Todd Edward Takken ,  Matthew Doyle

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L25/0655 ,  H01L24/24 ,  H01L23/49822 ,  H01L2224/24137 ,  H01L2224/2512

Abstract: An integrated circuit package provides a high bandwidth interconnect between wafers using a very high density interconnect using a silicon bridge or a multi-layer flex between wafers. In some embodiments, more than one wafer may be mounted and connected with a rigid silicon bridge onto a common substrate. This common substrate can be matched, with respect to their coefficients of thermal expansion (CTE), to the silicon wafer. The CTE matched substrate can reduce the thermal mechanical stress on the wafers and the rigid silicon bridge interconnect. In some embodiments, a thinned silicon bridge is utilized to interconnect wafers which are mounted on separate glass substrates. The thinned bridge would allow for mechanical compliance between the wafers. In some embodiments, the wafers can be mounted onto separate glass substrates and attached with a fine pitch multi-layer flex structure which provides compliance between the wafers.