-
公开(公告)号：US07546003B2
公开(公告)日：2009-06-09
申请号：US11984733
申请日：2007-11-21
CPC分类号： G11B5/4826 , G02B6/1221 , G02B6/43 , G11B5/4833 , G11B5/4853 , G11B5/486 , G11B2005/0021 , H05K1/0274 , H05K1/056 , Y10T29/49124
摘要： A suspension board with circuit includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, an insulating cover layer formed on the insulating base layer so as to cover the conductive pattern, and an optical waveguide.
摘要翻译： 具有电路的悬挂板包括金属支撑板，形成在金属支撑板上的绝缘基底层，形成在绝缘基底层上的导电图案，形成在绝缘基底层上以覆盖导电图案的绝缘覆盖层， 和光波导。
-
公开(公告)号：US20090025963A1
公开(公告)日：2009-01-29
申请号：US12068501
申请日：2008-02-07
IPC分类号： H05K1/03
CPC分类号： H05K1/0269 , H05K1/111 , H05K3/303 , H05K3/3452 , H05K2201/094 , H05K2201/09781 , H05K2201/09918 , H05K2203/163 , H05K2203/166 , Y02P70/611 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155
摘要： A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.
摘要翻译： 一种能够在确保高生产率和成本降低的同时，在端子部与外部端子之间的连接方面提高可靠性的布线电路板及其制造方法。 在包括与电子部件21的外部端子22连接的端子部分6的导电图案3和标准标记8之间以确定由于形成绝缘覆盖层4而形成的抑制部分23的存在或不存在以禁止连接 在绝缘基底层2上同时形成端子部分6和外部端子22之间，覆盖导电图案3的绝缘覆盖层4和端子部分6和标准标记8暴露的开口7形成 。 此后，参照从绝缘覆盖层4的开口部7露出的基准标记8来确定抑制部23的有无。
-
公开(公告)号：US20090025212A1
公开(公告)日：2009-01-29
申请号：US12068502
申请日：2008-02-07
IPC分类号： H05K3/30
CPC分类号： H05K1/0269 , H05K1/111 , H05K3/303 , H05K3/3452 , H05K2201/094 , H05K2201/09781 , H05K2201/09918 , H05K2203/163 , H05K2203/166 , Y02P70/611 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155
摘要： A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.
-
公开(公告)号：US20090008137A1
公开(公告)日：2009-01-08
申请号：US12216511
申请日：2008-07-07
申请人： Takahiko Yokai , Toshiki Naito
发明人： Takahiko Yokai , Toshiki Naito
CPC分类号： H05K1/05 , H05K1/056 , H05K3/44 , H05K2201/09745 , H05K2201/10416 , H05K2203/0323 , H05K2203/0369 , H05K2203/0723 , Y10T29/49124
摘要： A wired circuit board includes a metal supporting board having a depressed portion, a conductive portion embedded in the depressed portion and formed of a material having a higher conductivity than that of the metal supporting board, an insulating layer formed on the metal supporting board so as to cover the conductive portion, and a plurality of wired formed on the insulating layer in mutually spaced-apart relation so as to oppose to the conductive portion.
摘要翻译： 布线电路板包括具有凹陷部分的金属支撑板，嵌入在凹陷部分中的导电部分，并且由具有比金属支撑板导电性高的材料形成的导电部分形成在金属支撑板上的绝缘层， 覆盖导电部分，并且以互相间隔的关系形成在绝缘层上以与导电部分相对的多个布线。
-
75.发明授权Wired circuit forming board, wired circuit board, and thin metal layer forming method 有权有线电路板，布线电路板和薄金属层成型方法公开(公告)号：US07417316B2
公开(公告)日：2008-08-26
申请号：US11147345
申请日：2005-06-08
申请人： Toshiki Naito , Hiroshi Yamazaki
发明人： Toshiki Naito , Hiroshi Yamazaki
CPC分类号： C23C14/562 , C23C14/16 , H01L2924/0002 , H05K3/108 , H05K3/388 , H05K2201/0338 , H01L2924/00
摘要： A wired circuit forming board that can provide improved adhesion between an insulating layer and a conductive pattern and can also prevent delamination in a thin metal layer, a wired circuit board for which the same wired circuit forming board is used, and a thin metal layer forming method for forming the thin metal layer. The thin metal layer 2 is formed on the insulating base layer 1 by sputtering the first metal 35 and the second metal 36 in such a condition that a first metal diffusing region 37 for the first metal 35 to be diffused and a second metal diffusing region 38 for the second metal 36 to be diffused are overlapped with each other. This can allow formation of (i) a first unevenly-distributed metal portion 4 in which the first metal 35 is unevenly distributed and which is adjacent to the insulating base layer 1, (ii) a second unevenly-distributed metal portion 5 in which the second metal 36 is unevenly distributed and which is adjacent to the conductive pattern 6, and (iii) a metal coexisting portion 3 which is interposed between the first unevenly-distributed metal portion 4 and the second unevenly-distributed metal portion 5 and in which the first metal 35 and the second metal 36 are coexistent with each other in such a relation as to be continuously present in the thin metal layer 2 without defining any boundaries therebetween.
摘要翻译： 一种布线电路形成板，其能够提供绝缘层和导电图案之间的改善的粘附性，并且还可以防止薄金属层中的分层，使用相同布线电路形成板的布线电路板和形成金属层的薄金属层 用于形成薄金属层的方法。 薄金属层2通过溅射第一金属35和第二金属36而形成在绝缘基底层1上，使得要扩散的第一金属35的第一金属扩散区37和第二金属扩散区38 因为要扩散的第二金属36彼此重叠。 这可以形成（i）第一不均匀分布的金属部分4，其中第一金属35不均匀地分布并且与绝缘基底层1相邻，（ii）第二不均匀分布的金属部分5，其中 第二金属36不均匀分布并且与导电图案6相邻，以及（iii）介于第一不均匀分布的金属部分4和第二不均匀分布的金属部分5之间的金属共存部分3，其中 第一金属35和第二金属36彼此共存，从而连续地存在于薄金属层2中而不在其间限定任何边界。
-
公开(公告)号：US07396635B2
公开(公告)日：2008-07-08
申请号：US11236823
申请日：2005-09-28
申请人： Toshiki Naito
发明人： Toshiki Naito
IPC分类号： G03F7/00
CPC分类号： H05K3/28 , H05K1/0393 , H05K3/0023 , H05K3/007 , H05K3/0082 , H05K3/0097 , H05K3/108 , H05K2201/0108 , H05K2201/09736 , H05K2203/0156 , H05K2203/0191 , H05K2203/1383
摘要： A producing method of a wired circuit board that can prevent meandering of the elongate base material conveyed with the rolls and also prevent entry of air bubbles in between a light-transparency protecting film and a photosensitive solder resist layer when the light-transparency protecting film is laminated on the photosensitive solder resist layer. After a conductive pattern 3 is formed on the front side of the elongate base material 1 by the additive process, a narrow stiffener sheet 7 smaller in width than the elongate base material 1 is provided on the back side of the elongate base material 1. Then, after the photosensitive solder resist layer 10 is formed on the front side of the elongate base material 1 to cover the conductive pattern 3, the light-transparency protecting film 11 is laminated on the front side of the photosensitive solder resist layer 10. Thereafter, the photosensitive solder resist layer 10 is exposed to light through the light-transparency protecting film 11. Then, after the light-transparency protecting film 11 is stripped off from the photosensitive solder resist layer 10, the photosensitive solder resist layer 10 was developed and then cured by heating. Thereafter, the narrow stiffener sheet 7 is stripped off from the elongate base material. The flexible wired circuit board is produced in the manner described above.
摘要翻译： 一种布线电路板的制造方法，其可以防止由辊传送的细长基材的曲折，并且当透光保护膜为光透射保护膜时防止透光保护膜和光敏抗蚀剂层之间的气泡进入 层压在光敏抗蚀剂层上。 在通过添加工艺在细长基材1的前侧上形成导电图案3之后，在细长基材1的背面设置有宽度小于细长基材1的窄加强板7。 然后，在细长基材1的前侧形成感光性阻焊层10以覆盖导电图案3之后，在感光性阻焊层10的前侧层叠透光保护膜11。 此后，光敏抗蚀剂层10通过透光保护膜11曝光。 然后，在从光敏抗蚀剂层10剥离光透射保护膜11之后，将感光性阻焊层10显影，然后通过加热固化。 此后，从细长的基材剥离窄的加强板7。 柔性布线电路板以上述方式制造。
-
公开(公告)号：US20060076242A1
公开(公告)日：2006-04-13
申请号：US11236823
申请日：2005-09-28
申请人： Toshiki Naito
发明人： Toshiki Naito
IPC分类号： C25D5/02
CPC分类号： H05K3/28 , H05K1/0393 , H05K3/0023 , H05K3/007 , H05K3/0082 , H05K3/0097 , H05K3/108 , H05K2201/0108 , H05K2201/09736 , H05K2203/0156 , H05K2203/0191 , H05K2203/1383
摘要： A producing method of a wired circuit board that can prevent meandering of the elongate base material conveyed with the rolls and also prevent entry of air bubbles in between a light-transparency protecting film and a photosensitive solder resist layer when the light-transparency protecting film is laminated on the photosensitive solder resist layer. After a conductive pattern 3 is formed on the front side of the elongate base material 1 by the additive process, a narrow stiffener sheet 7 smaller in width than the elongate base material 1 is provided on the back side of the elongate base material 1. Then, after the photosensitive solder resist layer 10 is formed on the front side of the elongate base material 1 to cover the conductive pattern 3, the light-transparency protecting film 11 is laminated on the front side of the photosensitive solder resist layer 10. Thereafter, the photosensitive solder resist layer 10 is exposed to light through the light-transparency protecting film 11. Then, after the light-transparency protecting film 11 is stripped off from the photosensitive solder resist layer 10, the photosensitive solder resist layer 10 was developed and then cured by heating. Thereafter, the narrow stiffener sheet 7 is stripped off from the elongate base material. The flexible wired circuit board is produced in the manner described above.
摘要翻译： 一种布线电路板的制造方法，其可以防止由辊传送的细长基材的曲折，并且当透光保护膜为光透射保护膜时防止透光保护膜和光敏抗蚀剂层之间的气泡进入 层压在光敏抗蚀剂层上。 在通过添加工艺在细长基材1的前侧上形成导电图案3之后，在细长基材1的背面设置有宽度小于细长基材1的窄加强板7。 然后，在细长基材1的前侧形成感光性阻焊层10以覆盖导电图案3之后，在感光性阻焊层10的前侧层叠透光保护膜11。 此后，光敏抗蚀剂层10通过透光保护膜11曝光。 然后，在从光敏抗蚀剂层10剥离光透射保护膜11之后，将感光性阻焊层10显影，然后通过加热固化。 此后，从细长的基材剥离窄的加强板7。 柔性布线电路板以上述方式制造。
-
公开(公告)号：US20050191473A1
公开(公告)日：2005-09-01
申请号：US11064833
申请日：2005-02-25
申请人： Naoto Iwasaki , Toshiki Naito
发明人： Naoto Iwasaki , Toshiki Naito
IPC分类号： H05K1/09 , B32B3/00 , C25D3/48 , C25D5/34 , H05K1/02 , H05K1/11 , H05K3/24 , H05K3/28 , H05K3/32
CPC分类号： H05K3/244 , C25D3/48 , C25D5/34 , H05K3/28 , H05K2203/072 , H05K2203/0723 , Y10T428/24917
摘要： In order to provide a wired circuit board capable of enhancing the connection reliability and reducing the cost, in a wired circuit board including an insulating base layer, a conductor layer formed on the insulating base layer, and an insulating cover layer formed on the conductor layer and having an opening through which the conductor layer is exposed, an electrode is formed on the surface of the conductor layer exposed through the opening by forming a nickel plating layer by electroless nickel plating, and then forming a gold plating layer on the nickel plating layer by electrolytic gold plating.
摘要翻译： 为了提供能够提高连接可靠性并降低成本的布线电路板，在包括绝缘基底层的布线电路板，形成在绝缘基底层上的导体层和形成在导体层上的绝缘覆盖层 并且具有导体层露出的开口，通过通过无电镀镍形成镀镍层，在通过开口露出的导体层的表面上形成电极，然后在镀镍层上形成镀金层 通过电解镀金。
-
公开(公告)号：US20050053868A1
公开(公告)日：2005-03-10
申请号：US10934703
申请日：2004-09-07
申请人： Toshiki Naito
发明人： Toshiki Naito
CPC分类号： H05K3/0082 , H05K3/0023 , H05K3/28 , H05K2201/0108 , H05K2203/0191 , H05K2203/1545 , Y10S430/162 , Y10T156/1089 , Y10T156/1092 , Y10T156/1093 , Y10T156/1095 , Y10T156/1097 , Y10T156/1098
摘要： The invention provides a process for producing a wiring circuit board, which comprises the steps of: (A) forming a conductor layer of a predetermined pattern on an insulating layer; (B) forming a photosensitive solder resist layer on the insulating layer and the patterned conductor layer formed on the insulating layer; (C) disposing a transparent protective film on the photosensitive solder resist layer; and (D) exposing the photosensitive solder resist layer to a light through the transparent protective film.
摘要翻译： 本发明提供一种制造布线电路板的方法，包括以下步骤：（A）在绝缘层上形成预定图案的导体层; （B）在绝缘层上形成感光性阻焊层和形成在绝缘层上的图案化导体层; （C）在感光性阻焊层上设置透明保护膜; 和（D）将光敏抗蚀剂层曝光通过透明保护膜。
-
80.发明授权Method for producing circuit substrate having bump contact point and jet stream type plating apparatus used therefor 失效一种具有凸点接触点的电路基板的制造方法以及用于其的喷流式电镀装置
公开(公告)号：US6017438A
公开(公告)日：2000-01-25
申请号：US938555
申请日：1997-09-26
申请人： Yoshinari Takayama , Toshiki Naito , Kazuo Ouchi
发明人： Yoshinari Takayama , Toshiki Naito , Kazuo Ouchi
CPC分类号： C25D5/08 , C25D5/026 , H01L24/11 , H01L2224/13099 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01016 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01041 , H01L2924/01044 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14
摘要： A method for producing a circuit substrate having a bump contact point, comprising the steps of (a) disposing a positive electrode in a plating solution stored in a storage tank, (b) exposing a conductive circuit formed on an insulating substrate, above the surface of the plating solution, (c) disposing a jet stream opening below the surface of the plating solution, and (d) spouting out the plating solution from the jet stream opening toward the negative electrode for electroplating using said conductive circuit as a negative electrode, to form the bump contact point on the surface of the negative electrode, and a jet stream type plating apparatus used therefor. According to the present invention, mixing of air bubbles in the plating solution can be inhibited, which in turn enables suppression of oxidative decomposition of the brightener components. As a consequence, the bump contact point can have a mushroom shape, and variation in the height of the bump contact points can be minimized. In addition, slip of the vertex of the bump contact point and loss of bump contact points can be avoided.
摘要翻译： 一种具有凸点接触点的电路基板的制造方法，其特征在于，包括以下步骤：（a）将正极放置在储存在储罐中的电镀溶液中，（b）将形成在绝缘基板上的导电电路露出， ，（c）设置在电镀液表面下方开口的射流，（d）使用所述导电电路作为负极，从喷射流开口朝向负极喷射电镀溶液， 以形成负极表面上的凸点接触点，以及用于其的射流式电镀装置。 根据本发明，能够抑制电镀溶液中的气泡的混合，从而能够抑制增白剂成分的氧化分解。 结果，凸块接触点可以具有蘑菇形状，并且可以使凸块接触点的高度的变化最小化。 此外，可以避免凸块接触点的顶点滑动和凸点接触点的损失。
-
-
-
-
-
-
-
-
-
搜索结果
95 条记录 (耗时 0.032 秒)
