公开(公告)号：US6017438A

公开(公告)日：2000-01-25

申请号：US938555

申请日：1997-09-26

申请人： Yoshinari Takayama ,  Toshiki Naito ,  Kazuo Ouchi

发明人： Yoshinari Takayama ,  Toshiki Naito ,  Kazuo Ouchi

IPC分类号： C25D5/02 ,  C25D5/08 ,  H01L21/60

CPC分类号： C25D5/08 ,  C25D5/026 ,  H01L24/11 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14

摘要： A method for producing a circuit substrate having a bump contact point, comprising the steps of (a) disposing a positive electrode in a plating solution stored in a storage tank, (b) exposing a conductive circuit formed on an insulating substrate, above the surface of the plating solution, (c) disposing a jet stream opening below the surface of the plating solution, and (d) spouting out the plating solution from the jet stream opening toward the negative electrode for electroplating using said conductive circuit as a negative electrode, to form the bump contact point on the surface of the negative electrode, and a jet stream type plating apparatus used therefor. According to the present invention, mixing of air bubbles in the plating solution can be inhibited, which in turn enables suppression of oxidative decomposition of the brightener components. As a consequence, the bump contact point can have a mushroom shape, and variation in the height of the bump contact points can be minimized. In addition, slip of the vertex of the bump contact point and loss of bump contact points can be avoided.

摘要翻译： 一种具有凸点接触点的电路基板的制造方法，其特征在于，包括以下步骤：（a）将正极放置在储存在储罐中的电镀溶液中，（b）将形成在绝缘基板上的导电电路露出， ，（c）设置在电镀液表面下方开口的射流，（d）使用所述导电电路作为负极，从喷射流开口朝向负极喷射电镀溶液， 以形成负极表面上的凸点接触点，以及用于其的射流式电镀装置。 根据本发明，能够抑制电镀溶液中的气泡的混合，从而能够抑制增白剂成分的氧化分解。 结果，凸块接触点可以具有蘑菇形状，并且可以使凸块接触点的高度的变化最小化。 此外，可以避免凸块接触点的顶点滑动和凸点接触点的损失。

公开(公告)号：US06222272B1

公开(公告)日：2001-04-24

申请号：US09173683

申请日：1998-10-16

申请人： Yoshinari Takayama ,  Kazuo Ouchi ,  Atsushi Hino

发明人： Yoshinari Takayama ,  Kazuo Ouchi ,  Atsushi Hino

IPC分类号： H01L2941

CPC分类号： H01L23/4985 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16237 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/423 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/09745 ,  H05K2203/0369 ,  H05K2203/095 ,  H05K2203/1572 ,  H01L2924/00 ,  H01L2224/05599

摘要： In a film carrier with a conductive circuit formed, an opening is formed in a particular position relative to where the conductive path is to be formed. The opening is a through-hole, filled with a conductive material to form a conductive path. The conductive circuit has a concave face, provided according to certain formulae. The film carrier can cope with a fine-pitched and highly dense mounting, while prohibiting pulling out of the conductive path by an external force. The film carrier does not suffer from fallout of the conductive path, and has increased electrical connection reliability.

摘要翻译： 在形成有导电电路的薄膜载体中，相对于要形成导电路径的特定位置形成开口。 开口是通孔，填充有导电材料以形成导电路径。 导电电路具有根据某些公式提供的凹面。 薄膜载体可以处理细调和高度密集的安装，同时禁止通过外力从导电路径拉出。 电影载体不会受到导电路径的影响，并且具有增加的电连接可靠性。

公开(公告)号：US5877559A

公开(公告)日：1999-03-02

申请号：US689234

申请日：1996-08-06

申请人： Yoshinari Takayama ,  Kazuo Ouchi ,  Atsushi Hino

发明人： Yoshinari Takayama ,  Kazuo Ouchi ,  Atsushi Hino

IPC分类号： H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H01L23/48

CPC分类号： H05K3/4007 ,  H01L23/49811 ,  H01L23/4985 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/09745 ,  H05K2203/0369 ,  H05K2203/095 ,  H05K2203/1572 ,  H05K3/0035 ,  H05K3/0055 ,  H05K3/423

摘要： In a film carrier with a conductive circuit formed, an opening is formed in a particular position relative to where the conductive path is to be formed. The opening is a through-hole, filled with a conductive material to form a conductive path. The conductive circuit has a concave face, provided according to certain formulae. The film carrier can cope with a fine-pitched and highly dense mounting, while prohibiting pulling out of the conductive path by an external force. The film carrier does not suffer from fallout of the conductive path, and has increased electrical connection reliability.

摘要翻译： 在形成有导电电路的薄膜载体中，相对于要形成导电路径的特定位置形成开口。 开口是通孔，填充有导电材料以形成导电路径。 导电电路具有根据某些公式提供的凹面。 薄膜载体可以处理细调和高度密集的安装，同时禁止通过外力从导电路径拉出。 电影载体不会受到导电路径的影响，并且具有增加的电连接可靠性。

公开(公告)号：US5136359A

公开(公告)日：1992-08-04

申请号：US629897

申请日：1990-12-19

申请人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

发明人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

IPC分类号： H01B5/16 ,  H01L23/48 ,  H01L29/40 ,  H01L49/00 ,  H01R9/00

CPC分类号： H01R12/714

摘要： An anisotropic conductive film is disclosed, comprising an insulating film having fine through-holes independently piercing the film in the thickness direction, each of the through-holes being filled with a metallic substance in such a manner that at least one end of each through-hole has a bump-like projection of said metallic substance having a bottom area larger than the opening of the through-hole. The metallic substance serving as a conducting path is prevented from falling off, and sufficient conductivity can be thus assured.

公开(公告)号：US6011310A

公开(公告)日：2000-01-04

申请号：US722321

申请日：1996-09-27

申请人： Toshiki Naito ,  Kazuo Ouchi

发明人： Toshiki Naito ,  Kazuo Ouchi

IPC分类号： H01L21/60 ,  H01L23/498 ,  H01L23/50 ,  H05K3/40 ,  H05K3/42 ,  H01L23/48 ,  H01L23/053 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/81 ,  H01L23/4985 ,  H05K3/4007 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1572 ,  H05K3/423

摘要： Disclosed are a film carrier comprising an insulating layer having laid therein an electrically conductive circuit such that the circuit is not exposed on the surface thereof, wherein conductive passages from the conductive circuit to one surface of the insulating layer are formed in the insulating layer and via holes from said conductive circuit to the other surface of the insulating layer are formed and a semiconductor device prepared by mounting a semiconductor element on the insulating layer of the film carrier. The film carrier can sufficiently correspond to pitch-fining and high-density mounting of a semiconductor element wiring, can surely perform the connecting operation of inner lead bonding and outer lead bonding and gives the mounting area of as small as possible.

摘要翻译： 公开了一种薄膜载体，其包括绝缘层，其中放置有导电电路，使得该电路不在其表面上露出，其中从导电电路到绝缘层的一个表面的导电通道形成在绝缘层中，并且经由 形成从所述导电电路到绝缘层的另一表面的孔，以及通过将半导体元件安装在膜载体的绝缘层上而制备的半导体器件。 薄膜载体可以充分地对应于半导体元件布线的节距精细和高密度安装，可以可靠地执行内引线接合和外引线接合的连接操作，并且使安装面积尽可能小。

公开(公告)号：US5188702A

公开(公告)日：1993-02-23

申请号：US872504

申请日：1992-04-23

申请人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

发明人： Yoshinari Takayama ,  Amane Mochizuki ,  Atsushi Hino ,  Kazuo Ouchi ,  Masakazu Sugimoto

IPC分类号： B29C37/00 ,  B44C1/22 ,  C23F1/00 ,  C23F4/02

CPC分类号： H01R12/714

摘要： An anisotropic conductive film is disclosed, comprising an insulating film having fine through-holes independently piercing the film in the thickness direction, each of the through-holes being filled with a metallic substance in such a manner that at least one end of each through-hole has a bump-like projection of said metallic substance having a bottom area larger than the opening of the through-hole. The metallic substance serving as a conducting path is prevented from falling off, and sufficient conductivity can be thus assured.

摘要翻译： 公开了一种各向异性导电膜，其包括具有在厚度方向上独立地穿透膜的细孔的绝缘膜，每个通孔以金属物质填充，使得每个通孔的至少一端， 所述金属物质具有比通孔开口大的底面积的凸起状突起。 作为导电路径的金属物质被防止脱落，从而可以确保足够的导电性。

公开(公告)号：US5072289A

公开(公告)日：1991-12-10

申请号：US433108

申请日：1989-11-08

申请人： Masakazu Sugimoto ,  Kazuo Ouchi ,  Mikio Aizawa ,  Atsushi Hino ,  Kazuto Shinozaki ,  Tetsuya Terada ,  Takanori Miyoshi ,  Munekazu Tanaka ,  Shoji Morita ,  Amane Mochizuki ,  Yoshinari Takayama

发明人： Masakazu Sugimoto ,  Kazuo Ouchi ,  Mikio Aizawa ,  Atsushi Hino ,  Kazuto Shinozaki ,  Tetsuya Terada ,  Takanori Miyoshi ,  Munekazu Tanaka ,  Shoji Morita ,  Amane Mochizuki ,  Yoshinari Takayama

IPC分类号： H01L21/48 ,  H01L23/498 ,  H05K1/00 ,  H05K1/11 ,  H05K3/36 ,  H05K3/42

CPC分类号： H05K1/113 ,  H01L21/486 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/3025 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0394 ,  H05K2201/09563 ,  H05K2201/0979 ,  H05K3/363 ,  H05K3/423

摘要： A wiring substrate, a film carrier, a semiconductor device made by using the film carrier, and a mounting structure comprising the semiconductor device are disclosed.The wiring substrate comprises:a conductor pattern which has a bonding pad and is formed on the rear surface of an insulating support;at least one of minute through-holes which are provided in a region of the insulating support where the bonding pad is in contact therewith, or which are provided a region of the insulating support where the bonding pad is in contact therewith and in the vicinity of the region, the through-holes running in the direction of the thickness of the insulating support;a conductive passage which is made of a metal material and which is formed in the through-holes that are provided in a region of the insulating support where the bonding pad is in contact therewith; anda bump-like metal protrusion which is formed on the conductive passage and which is protruded from the front surface of the insulating support.

公开(公告)号：US5374469A

公开(公告)日：1994-12-20

申请号：US945929

申请日：1992-09-17

申请人： Atsushi Hino ,  Amane Mochizuki ,  Kazuo Ouchi ,  Shoji Morita ,  Toshiki Naito ,  Kazumi Higashi ,  Masako Maeda ,  Masayuki Kaneto ,  Munekazu Tanaka ,  Masakazu Sugimoto

发明人： Atsushi Hino ,  Amane Mochizuki ,  Kazuo Ouchi ,  Shoji Morita ,  Toshiki Naito ,  Kazumi Higashi ,  Masako Maeda ,  Masayuki Kaneto ,  Munekazu Tanaka ,  Masakazu Sugimoto

IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/20 ,  H05K3/28 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  B32B9/00

CPC分类号： H05K3/4635 ,  H05K1/036 ,  H05K3/205 ,  H05K3/281 ,  H05K3/4007 ,  H05K3/421 ,  H05K3/4617 ,  H05K3/4632 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H05K1/0346 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/068 ,  H05K2201/09481 ,  H05K2201/10378 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0376 ,  H05K2203/063 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/107 ,  H05K2203/1572 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4647 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24942 ,  Y10T428/31721

摘要： A flexible printed substrate imparted with an adhesive property for loading on an external substrate, a double printed substrate having formed on both surfaces thereof a metal layer or a wiring circuit, and a multilayer substrate having a multilayer structure are disclosed. The flexible printed substrate comprises an insulating resin layer comprising a low-linear expansion polyimide resin layer and a thermoplastic polyimide resin layer, and a metal layer or a wiring circuit formed on the low-linear expansion polyimide resin layer of the insulating resin layer, wherein a mixed region of the polyimide resin components is formed in the interface between the low-linear expansion polyimide resin layer and the thermoplastic polyimide resin layer.

摘要翻译： 公开了一种赋予外部基板的粘合性的柔性印刷基板，在其两面形成金属层或布线电路的双面印刷基板以及具有多层结构的多层基板。 柔性印刷基板包括绝缘树脂层，其包含低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层，以及形成在绝缘树脂层的低线性膨胀聚酰亚胺树脂层上的金属层或布线电路，其中 在低线膨胀聚酰亚胺树脂层和热塑性聚酰亚胺树脂层之间的界面形成聚酰亚胺树脂成分的混合区域。

公开(公告)号：US06379159B1

公开(公告)日：2002-04-30

申请号：US09541898

申请日：2000-04-03

申请人： Kazunori Mune ,  Kazuo Ouchi ,  Satoshi Tanigawa ,  Hirofumi Fujii

发明人： Kazunori Mune ,  Kazuo Ouchi ,  Satoshi Tanigawa ,  Hirofumi Fujii

IPC分类号： H05G336

CPC分类号： H01L21/486 ,  H01L23/49827 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/205 ,  H05K3/423 ,  H05K2201/09354 ,  H05K2201/10378 ,  H05K2203/0733 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05611 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655

摘要： In a method for manufacturing an interposer for CSP and its intermediate body, a first insulating layer is formed on a cathode substrate. An opening is formed at a position in the insulating layer where a contact is to be formed so that the surface of the substrate is exposed to the inner bottom of the opening. The opening is filled with metal by the electroplating using the cathode substrate as a cathode to form a conductive path. A circuit pattern which is contact with the conductive path is formed on the insulating layer. The cathode substrate is removed partially or entirely so that the end surface of the conductive path is exposed to form a contact. This permits a variation of the heights of a plurality of contacts to be reduced.

摘要翻译： 在制造CSP及其中间体用插入体的方法中，在阴极基板上形成第一绝缘层。 在要形成接触的绝缘层中的一个位置处形成开口，使得基板的表面暴露于开口的内底部。 通过使用阴极基板作为阴极的电镀，用金属填充开口以形成导电路径。 在绝缘层上形成与导电路径接触的电路图案。 部分或全部去除阴极基板，使得导电路径的端面暴露以形成接触。 这允许减少多个触点的高度的变化。

公开(公告)号：US5575662A

公开(公告)日：1996-11-19

申请号：US288913

申请日：1994-08-11

申请人： Yasuhiko Yamamoto ,  Isao Ohki ,  Junji Yoshida ,  Hideo Yamashita ,  Kazuo Ouchi ,  Masayuki Kaneto

发明人： Yasuhiko Yamamoto ,  Isao Ohki ,  Junji Yoshida ,  Hideo Yamashita ,  Kazuo Ouchi ,  Masayuki Kaneto

IPC分类号： G01R1/073 ,  H01L21/60 ,  H01R4/00 ,  H01R4/04 ,  H01R12/62 ,  H01R13/24 ,  H01R43/00 ,  H05K3/36 ,  H01R9/09

CPC分类号： H01R13/2414 ,  H01L24/81 ,  H01R12/62 ,  H01R13/2464 ,  H05K3/365 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/3511 ,  H01R4/04 ,  Y10T29/49155

摘要： A connecting method comprising laminating a flexible circuit substrate having a plurality of bump contacts with a contact object having a plurality of portions to be contacted such that the respective bump contacts face to the portions to be contacted at a joined surface, correspondingly each other to form a laminate, and applying pressure to the entire surface of the laminate in a compressing direction with pressurizing means provided so as to pinch the laminate in a laminating direction to contact the plural bump contacts mounted on the flexible circuit substrate with the plural portions to be contacted corresponding thereto mounted on the contact object, respectively.

摘要翻译： 一种连接方法，包括将具有多个凸起触点的柔性电路基板与具有多个待接触部分的接触物层叠，使得各个凸点接触面相对于在接合表面处被接触的部分，彼此相对地形成 层压体，并且在压缩方向上对层压体的整个表面施加压力，加压装置设置成在层压方向上夹紧层叠体，以使多个接触的柔性电路基板上的多个凸起触点接触 相应地分别安装在接触物体上。