Nitride compound semiconductor light emitting element and its
manufacturing method
    71.
    发明授权
    Nitride compound semiconductor light emitting element and its manufacturing method 失效
    氮化物半导体发光元件及其制造方法

    公开(公告)号:US5981977A

    公开(公告)日:1999-11-09

    申请号:US110834

    申请日:1998-07-06

    摘要: A nitride compound semiconductor light emitting element comprises a substrate, a nitride compound semiconductor n-type layer, a mask layer having a predetermined opening, a nitride compound semiconductor buffer layer epitaxially grown on said n-type layer exclusively at said opening. The buffer layer has a recess on its top face so that a thickness of said buffer layer is thinner above a central portion of the opening and thicker above edge portions of the opening. A nitride compound semiconductor active layer is selectively formed on the recess of the buffer layer to be thicker at the central portion of the recess and thinner at the edges of the recess. A nitride compound semiconductor burying layer overlays the mask layer and the active layer to cover the active layer. By selectively growing the buffer layer and the active layer in the opening of the mask layer formed on the substrate and by growing additional layers to bury the entire structure and to flatten the surface, a planar-type, stripe-buried structure is realized. The active layer has a distribution of refractive index due to the distribution of thickness resulting from the selective growth and can confine light with high efficiency. Additionally, by using an insulation film, highly efficient confinement of current is realized to provide a light emitting element for a shorter wavelength with a high luminous intensity and a low oscillation threshold value.

    摘要翻译: 氮化物半导体发光元件包括衬底,氮化物化合物半导体n型层,具有预定开口的掩模层,仅在所述开口处在所述n型层上外延生长的氮化物化合物半导体缓冲层。 缓冲层在其顶面上具有凹部,使得所述缓冲层的厚度在开口的中心部分上方更薄,并且在开口的边缘部分较厚。 在缓冲层的凹部上选择性地形成氮化物化合物半导体活性层,使其在凹部的中央部较厚,在凹部的边缘处变薄。 氮化物化合物半导体掩埋层覆盖掩模层和有源层以覆盖有源层。 通过在衬底上形成的掩模层的开口中选择性地生长缓冲层和活性层,并且通过生长附加层以埋入整个结构并使表面变平,实现了平面型条纹埋层结构。 活性层由于选择性生长导致的厚度分布而具有折射率分布,并且可以高效地限制光。 此外,通过使用绝缘膜,实现电流的高效限制,以提供具有高发光强度和低振荡阈值的较短波长的发光元件。

    Nitride semiconductor device
    74.
    发明授权
    Nitride semiconductor device 有权
    氮化物半导体器件

    公开(公告)号:US08247794B2

    公开(公告)日:2012-08-21

    申请号:US12952758

    申请日:2010-11-23

    申请人: Hideto Sugawara

    发明人: Hideto Sugawara

    IPC分类号: H01L29/06

    摘要: According to one embodiment, a nitride semiconductor device includes a substrate, an Alx1Ga1-x1N first buried layer, an InyAlzGa1-y-zN buried layer and an Alx2Ga1-x2N second buried layer. The substrate has protrusions formed in an in-plane direction on a first major surface, and a depression between adjacent ones of the protrusions. The first buried layer is formed on the depression and one of the protrusions. The InyAlzGa1-y-zN buried layer is formed on the first buried layer. The second buried layer is formed on the InyAlzGa1-y-zN buried layer. A portion of the first buried layer formed on the depression and a portion of the first buried layer formed on the one of the protrusions are not connected to each other. A portion of the InyAlzGa1-y-zN buried layer formed above the depression and a portion of the InyAlzGa1-y-zN buried layer formed above the one of the protrusions are connected to each other.

    摘要翻译: 根据一个实施例,氮化物半导体器件包括衬底,Al x Ga 1-x N 1第一掩埋层,In y Al z Ga 1-y-z N埋层和Al x Ga 1-x 2 N第二掩埋层。 基板具有在第一主表面上沿面内方向形成的突起,以及相邻突起之间的凹陷。 第一掩埋层形成在凹部和突起之一中。 InyAlzGa1-y-zN掩埋层形成在第一掩埋层上。 在InyAlzGa1-y-zN掩埋层上形成第二掩埋层。 形成在凹部上的第一掩埋层的一部分和形成在一个突起上的第一掩埋层的一部分没有彼此连接。 形成在凹部上方的InyAlzGa1-y-zN掩埋层的一部分和形成在上述一个突起上的InyAlzGa1-y-zN掩埋层的一部分彼此连接。

    Semiconductor light emitting device
    77.
    发明申请
    Semiconductor light emitting device 审中-公开
    半导体发光器件

    公开(公告)号:US20070086496A1

    公开(公告)日:2007-04-19

    申请号:US11357408

    申请日:2006-02-21

    IPC分类号: H01S5/00

    摘要: A semiconductor light emitting device comprises: a first cladding layer made of nitride semiconductor of a first conductivity type; an active layer provided on the first cladding layer, the active layer including a first barrier layer made of nitride semiconductor, a second barrier layer made of nitride semiconductor, and a well layer made of nitride semiconductor, the well layer being provided between the first barrier layer and the second barrier layer; and a second cladding layer provided on the active layer, the second cladding layer being made of nitride semiconductor of a second conductivity type. The first and second barrier layers and the well layer contain indium. At least one of the first barrier layer and the second barrier layer has a thickness of 30 nm or more.

    摘要翻译: 一种半导体发光器件包括:由第一导电类型的氮化物半导体制成的第一覆层; 设置在所述第一包层上的有源层,所述有源层包括由氮化物半导体制成的第一势垒层,由氮化物半导体制成的第二阻挡层,以及由氮化物半导体制成的阱层,所述阱层设置在所述第一栅极 层和第二阻挡层; 以及设置在所述有源层上的第二覆层,所述第二覆层由第二导电类型的氮化物半导体制成。 第一和第二阻挡层和阱层含有铟。 第一阻挡层和第二阻挡层中的至少一个具有30nm以上的厚度。

    Nitride based semiconductor light-emitting device
    78.
    发明授权
    Nitride based semiconductor light-emitting device 有权
    氮化物基半导体发光器件

    公开(公告)号:US07180088B2

    公开(公告)日:2007-02-20

    申请号:US10731336

    申请日:2003-12-09

    申请人: Hideto Sugawara

    发明人: Hideto Sugawara

    IPC分类号: H01L29/06

    摘要: Nitride based semiconductor light-emitting devices are provided with a sufficiently low contact resistance p-type electrode. The nitride based semiconductor light-emitting devices include a p-type GaN contact layer, protrusions with fine recesses (uneven portions) formed on a surface of the p-type GaN contact layer, and a p-type electrode formed on the uneven portions.

    摘要翻译: 基于氮化物的半导体发光器件具有足够低的接触电阻p型电极。 氮化物类半导体发光器件包括p型GaN接触层,形成在p型GaN接触层的表面上的具有细小凹部(不平坦部分)的突起和形成在不平坦部分上的p型电极。