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90 条记录 (耗时 0.031 秒)

    3D POWER MODULE PACKAGE
    71.
    发明申请
    3D POWER MODULE PACKAGE 有权
    3D电源模块封装

    公开(公告)号：US20120162931A1

    公开(公告)日：2012-06-28

    申请号：US13177270

    申请日：2011-07-06

    申请人： Tae Hoon Kim ,  Jae Cheon Doh ,  Seog Moon Choi

    发明人： Tae Hoon Kim ,  Jae Cheon Doh ,  Seog Moon Choi

    IPC分类号： H05K7/00

    CPC分类号： H01L23/3121 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49575 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Disclosed herein is a 3D power module package, including: a power converting unit packaged to include a heat radiating substrate, a power device connected to the heat radiating substrate, and a lead frame; a controlling unit packaged to include a controlling unit substrate and IC and controlling devices mounted on an upper portion of the controlling unit substrate; and an electrical connecting unit electrically connecting the packaged power converting unit and the packaged controlling unit.

    摘要翻译： 本文公开了一种3D功率模块封装，包括：封装成包括散热基板的功率转换单元，连接到散热基板的功率器件和引线框架; 控制单元，其被封装成包括控制单元基板和IC以及安装在所述控制单元基板的上部的控制装置; 以及电连接单元，电连接所述封装的电力转换单元和所述封装的控制单元。

    LED package and fabricating method thereof
    72.
    发明授权
    LED package and fabricating method thereof 有权
    LED封装及其制造方法

    公开(公告)号：US08012778B2

    公开(公告)日：2011-09-06

    申请号：US12259576

    申请日：2008-10-28

    申请人： Yong Suk Kim ,  Young Soo Oh ,  Hyoung Ho Kim ,  Taek Jung Lee ,  Seog Moon Choi

    发明人： Yong Suk Kim ,  Young Soo Oh ,  Hyoung Ho Kim ,  Taek Jung Lee ,  Seog Moon Choi

    IPC分类号： H01L21/00

    CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/16225

    摘要： The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.

    摘要翻译： 本发明提供一种LED封装，其能够有效地从LED封装中散发从LED芯片发出的热量及其制造方法。 为此，在基板的下侧表面上形成至少一个凹槽以封装LED芯片，并且凹槽填充有碳纳米管材料。 在LED封装中，准备在底面上具有至少一个沟槽的衬底。 多个电极形成在基板的顶表面上。 此外，至少将一个LED芯片安装在基板上，以使两个端子电连接到上电极。 此外，碳纳米管填料填充在基板的槽中。

    RADIATING PACKAGE MODULE FOR EXOTHERMIC ELEMENT
    73.
    发明申请
    RADIATING PACKAGE MODULE FOR EXOTHERMIC ELEMENT 审中-公开
    放射元件放射性包装模块

    公开(公告)号：US20110042042A1

    公开(公告)日：2011-02-24

    申请号：US12581129

    申请日：2009-10-17

    申请人： Jong Man KIM ,  Seog Moon Choi ,  Sang Hyun Shin ,  Jin Su Kim

    发明人： Jong Man KIM ,  Seog Moon Choi ,  Sang Hyun Shin ,  Jin Su Kim

    IPC分类号： F28D15/04 ,  F28F7/00 ,  F28F13/18

    CPC分类号： F28F1/08 ,  F21V29/51 ,  F21Y2115/10 ,  F21Y2115/30 ,  F28D15/0275 ,  F28F2275/025 ,  F28F2275/14 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Disclosed herein is a radiating package module for an exothermic element. The radiating package module includes a heat conducting plate which has a groove of an internal thread shape, with the exothermic element being mounted on a surface of the heat conducting plate. A heat pipe is inserted into the groove in a screw-type coupling manner and has a coupling part of an external thread shape. An adhesive is applied between the groove and the coupling part. A cooling unit is coupled to an end of the heat pipe. The radiating package module maintains the reliability with which the radiating package radiates heat and improves structural reliability.

    摘要翻译： 本文公开了用于放热元件的辐射封装模块。 辐射封装模块包括具有内螺纹形状的槽的导热板，放热元件安装在导热板的表面上。 热管以螺旋式联接的方式插入凹槽中并具有外螺纹形状的联接部分。 在凹槽和耦合部分之间施加粘合剂。 冷却单元联接到热管的一端。 辐射封装模块保持辐射封装散热的可靠性，提高结构可靠性。

    LED package and fabricating method thereof
    77.
    发明授权
    LED package and fabricating method thereof 有权
    LED封装及其制造方法

    公开(公告)号：US07453093B2

    公开(公告)日：2008-11-18

    申请号：US11489578

    申请日：2006-07-20

    申请人： Yong Suk Kim ,  Young Soo Oh ,  Hyoung Ho Kim ,  Taek Jung Lee ,  Seog Moon Choi

    发明人： Yong Suk Kim ,  Young Soo Oh ,  Hyoung Ho Kim ,  Taek Jung Lee ,  Seog Moon Choi

    IPC分类号： H01L27/15 ,  H01L23/34

    CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/16225

    摘要： The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.

    摘要翻译： 本发明提供一种LED封装，其能够有效地从LED封装中散发从LED芯片发出的热量及其制造方法。 为此，在基板的下侧表面上形成至少一个凹槽以封装LED芯片，并且凹槽填充有碳纳米管材料。 在LED封装中，准备在底面上具有至少一个沟槽的衬底。 多个电极形成在基板的顶表面上。 此外，至少将一个LED芯片安装在基板上，以使两个端子电连接到上电极。 此外，碳纳米管填料填充在基板的槽中。

    Method of fabricating light emitting diode package
    78.
    发明授权
    Method of fabricating light emitting diode package 有权
    制造发光二极管封装的方法

    公开(公告)号：US07371603B2

    公开(公告)日：2008-05-13

    申请号：US11439189

    申请日：2006-05-24

    申请人： Yong Suk Kim ,  Seog Moon Choi ,  Hyoung Ho Kim ,  Yong Sik Kim

    发明人： Yong Suk Kim ,  Seog Moon Choi ,  Hyoung Ho Kim ,  Yong Sik Kim

    IPC分类号： H01L21/00 ,  H01L21/50 ,  H01L21/48 ,  H01L21/44

    CPC分类号： H01L33/52 ,  H01L2224/48091 ,  H01L2224/48227 ,  Y10S438/974 ,  H01L2924/00014

    摘要： The invention relates to an LED package and proposes a method of fabricating an LED package including steps of providing a package substrate having a mounting area of an LED and a metal pattern to be connected with the LED, and plasma-treating the package substrate to reform at least a predetermined surface area of the package substrate where a resin-molded part will be formed. The method also includes mounting the LED on the mounting area on the substrate package and electrically connecting the LED with the metal pattern, and forming the resin-molded part in the mounting area of the LED to seal the LED package.

    摘要翻译： 本发明涉及一种LED封装，并提出一种制造LED封装的方法，包括以下步骤：提供具有与LED连接的LED的安装区域和与LED连接的金属图案的封装基板，以及等离子体处理封装基板以改造 至少形成将形成树脂成型部件的封装基板的预定表面积。 该方法还包括将LED安装在基板封装上的安装区域上，并将LED与金属图案电连接，并在LED的安装区域中形成树脂模制部件以密封LED封装。

    Semiconductor package
    79.
    发明授权
    Semiconductor package 有权
    半导体封装

    公开(公告)号：US08823153B2

    公开(公告)日：2014-09-02

    申请号：US13584743

    申请日：2012-08-13

    申请人： Tae Hoon Kim ,  Seog Moon Choi

    发明人： Tae Hoon Kim ,  Seog Moon Choi

    IPC分类号： H01L23/48

    CPC分类号： H01L23/3107 ,  H01L21/563 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49575 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Disclosed herein is a semiconductor package. The semiconductor package includes: semiconductor elements, a first heat dissipation substrate formed under the semiconductor elements, a first lead frame electrically connecting the lower portions of the semiconductor elements to an upper portion of the first heat dissipation substrate, a second heat dissipation substrate formed over the semiconductor elements, and a second lead frame having a protrusion formed to be protruded from a lower surface thereof and electrically connecting the upper portions of the semiconductor elements to a lower portion of the second heat dissipation substrate.

    摘要翻译： 这里公开了半导体封装。 半导体封装包括：半导体元件，形成在半导体元件下的第一散热基板，将半导体元件的下部电连接到第一散热基板的上部的第一引线框架，形成在第一散热基板上的第二散热基板 所述半导体元件和具有突起的第二引线框架，所述突起形成为从其下表面突出并将所述半导体元件的上部电连接到所述第二散热基板的下部。