公开(公告)号：US06967548B2

公开(公告)日：2005-11-22

申请号：US10912413

申请日：2004-08-04

申请人： Qing Ma ,  Valluri Rao ,  John Heck ,  Li-Peng Wang ,  Dong Shim ,  Quan Tran

发明人： Qing Ma ,  Valluri Rao ,  John Heck ,  Li-Peng Wang ,  Dong Shim ,  Quan Tran

IPC分类号： H01H59/00 ,  H01P1/10

CPC分类号： H01H59/0009 ,  H01H2001/0078 ,  H01H2059/0036

摘要： This application discloses a microelectromechanical (MEMS) switch apparatus comprising an anchor attached to a substrate and an electrically conductive beam attached to the anchor and in electrical contact therewith. The beam comprises a tapered portion having a proximal end and a distal end, the proximal end being attached to the anchor, an actuation portion attached to the distal end of the tapered portion, a tip attached to the actuation portion, the tip having a contact dimple thereon. The switch apparatus also includes an actuation electrode attached to the substrate and positioned between the actuation portion and the substrate. Additional embodiments are also described and claimed.

公开(公告)号：US06940363B2

公开(公告)日：2005-09-06

申请号：US10322290

申请日：2002-12-17

申请人： Eliav Zipper ,  Qing Ma

发明人： Eliav Zipper ,  Qing Ma

IPC分类号： H01H1/00 ,  H01H9/54 ,  H01H59/00 ,  H01P1/10 ,  B81B7/04

CPC分类号： H01H9/542 ,  H01H1/0036 ,  H01H9/541 ,  H01H59/0009

摘要： In a switching scheme mechanical MEMs switches are connected in parallel with solid state switches. This parallel MEMS/solid-state switch arrangement takes advantage of the fast switching speeds of the solid state switches as well advantage of the improved insertion loss and isolation characteristics of the MEMS switches. The solid-state switches only need to be energized during a ramp up/down period associated with the slower MEMs switch thus conserving power. As an additional advantage, using a solid-state switch in parallel with MEMs switches improves the transient spectrum of the system during switching operations.

摘要翻译： 在开关方案中，机械式MEMs开关与固态开关并联连接。 这种并联的MEMS /固态开关装置利用固态开关的快速开关速度以及MEMS开关的改进的插入损耗和隔离特性的优点。 固态开关只需要在与较慢的MEMs开关相关联的斜坡上升/下降周期期间被通电，从而节省功率。 作为额外的优点，与MEMs开关并联的固态开关可以改善开关操作期间系统的瞬态频谱。

公开(公告)号：US20050093652A1

公开(公告)日：2005-05-05

申请号：US10698889

申请日：2003-10-31

申请人： Qing Ma ,  Dong Shim

发明人： Qing Ma ,  Dong Shim

IPC分类号： H03H9/00 ,  H03H9/58

CPC分类号： H03H9/0095

摘要： The disclosure describes an apparatus comprising a film bulk acoustic resonator (FBAR) filter having an input and an output, and an impedance matching unit coupled to one of the input and the output of the FBAR filter. Also described is a process comprising providing a film bulk acoustic resonator (FBAR) filter, the FBAR filter having an input impedance and an output impedance, matching the impedance of an input circuit to the input impedance of the FBAR filter, and matching the output impedance of the FBAR filter to the impedance of an output circuit. Other embodiments are described and claimed.

摘要翻译： 本公开描述了一种包括具有输入和输出的膜体声波谐振器（FBAR）滤波器和耦合到FBAR滤波器的输入和输出之一的阻抗匹配单元的装置。 还描述了一种方法，其包括提供薄膜体声波谐振器（FBAR）滤波器，FBAR滤波器具有输入阻抗和输出阻抗，匹配输入电路的阻抗与FBAR滤波器的输入阻抗，并匹配输出阻抗 的FBAR滤波器到输出电路的阻抗。 描述和要求保护其他实施例。

公开(公告)号：US06880235B2

公开(公告)日：2005-04-19

申请号：US10342778

申请日：2003-01-15

申请人： Qing Ma

发明人： Qing Ma

IPC分类号： B81B3/00 ,  H01H1/20 ,  H01H59/00 ,  H01H11/00 ,  H01H11/02 ,  H01H11/04 ,  H01H65/00

CPC分类号： B81B3/007 ,  B81B2201/014 ,  B81B2201/0271 ,  B81B2203/0118 ,  B81B2203/0353 ,  B81B2203/04 ,  B81C2201/056 ,  H01H1/20 ,  H01H59/0009 ,  H01H2001/0084 ,  H01H2059/0036 ,  H01H2059/0063 ,  Y10T29/49002 ,  Y10T29/49016 ,  Y10T29/49082 ,  Y10T29/49105 ,  Y10T29/49128 ,  Y10T29/49147

摘要： A microelectromechanical system (MEMS) switch having a high-resonance-frequency beam is disclosed. The MEMS switch includes first and second spaced apart electrical contacts, and an actuating electrode. The beam is adapted to establish contact between the electrodes via electrostatic deflection of the beam as induced by the actuating electrode. The beam may have a cantilever or bridge structure, and may be hollow or otherwise shaped to have a high resonant frequency. Methods of forming the high-speed MEMS switch are also disclosed.

摘要翻译： 公开了一种具有高共振频率波束的微机电系统（MEMS）开关。 MEMS开关包括第一和第二间隔开的电触头和致动电极。 光束适于通过由致动电极引起的光束的静电偏转来建立电极之间的接触。 梁可以具有悬臂或桥结构，并且可以是中空的或以其它方式成形为具有高共振频率。 还公开了形成高速MEMS开关的方法。

公开(公告)号：US20050062120A1

公开(公告)日：2005-03-24

申请号：US10980516

申请日：2004-11-03

申请人： Qing Ma ,  Valluri Rao ,  John Heck ,  Daniel Wong ,  Michele Berry

发明人： Qing Ma ,  Valluri Rao ,  John Heck ,  Daniel Wong ,  Michele Berry

IPC分类号： B81B7/00 ,  H01L23/10 ,  H01L21/00 ,  G02B26/00 ,  H01L27/14 ,  H01L29/82

CPC分类号： B81B7/0006 ,  H01L23/10 ,  H01L2224/05567 ,  H01L2224/05568 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/00

摘要： A MEMS device may be formed in a hermetic cavity by sealing a pair of semiconductor structures to one another, enclosing the MEMS device. The two structures may be coupled using surface mount techniques as one example, so that the temperatures utilized may be compatible with many MEMS applications. Electrical interconnection layers in one or the other of these structures may be utilized to allow electrical interconnections from the exterior world to the MEMS components within the cavity.

公开(公告)号：US06861783B2

公开(公告)日：2005-03-01

申请号：US10716750

申请日：2003-11-19

申请人： Li-Peng Wang ,  Qing Ma ,  Valluri Rao

发明人： Li-Peng Wang ,  Qing Ma ,  Valluri Rao

IPC分类号： H03H3/02 ,  H03H9/17 ,  H01L41/08

CPC分类号： H03H9/174 ,  H03H3/02 ,  H03H2003/023 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49156

摘要： A film bulk acoustic resonator is formed on a substrate. The film bulk acoustic resonator includes a layer of piezoelectric material having a first surface proximate the substrate, and a second surface distal from the substrate. The first conductive layer deposited on the first surface of the piezoelectric material includes a first portion having a surface on a different plane than a surface associated with a second portion.

公开(公告)号：US20050035420A1

公开(公告)日：2005-02-17

申请号：US10939286

申请日：2004-09-10

申请人： Qing Ma ,  Li-Peng Wang ,  Valluri Rao

发明人： Qing Ma ,  Li-Peng Wang ,  Valluri Rao

IPC分类号： H03H3/02 ,  H03H9/17 ,  H01L21/00 ,  H01L21/4763 ,  H01L27/14 ,  H03H9/00

CPC分类号： H03H9/174 ,  H03H3/02 ,  H03H2003/023 ,  Y10T29/42

摘要： A film bulk acoustic resonator may be formed with a piezoelectric film having improved quality. The piezoelectric film may be deposited directly onto a single crystal silicon substrate. That substrate may be removed and selectively replaced with a lower electrode to form the film bulk acoustic resonator.

公开(公告)号：US06808955B2

公开(公告)日：2004-10-26

申请号：US10005667

申请日：2001-11-02

申请人： Qing Ma

发明人： Qing Ma

IPC分类号： H01L2166

CPC分类号： B81C1/0023 ,  B81C2201/019 ,  B81C2203/019 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/0508 ,  H01L2224/05568 ,  H01L2224/16145 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A method of fabricating an integrated circuit that includes a microelectromechanical (MEMS) device. The method includes forming a MEMS device on a substrate and forming an integrated circuit. The method further includes coupling the substrate to the integrated circuit to form a sealed cavity that includes the MEMS device. The substrate and the integrated circuit are coupled together in a controlled environment to establish a controlled environment within the cavity where the MEMS device is located.

摘要翻译： 一种制造包括微机电（MEMS）器件的集成电路的方法。 该方法包括在衬底上形成MEMS器件并形成集成电路。 该方法还包括将衬底耦合到集成电路以形成包括MEMS器件的密封腔。 衬底和集成电路在受控的环境中耦合在一起，以在MEMS器件所在的空腔内建立受控的环境。

公开(公告)号：US06784524B2

公开(公告)日：2004-08-31

申请号：US10349812

申请日：2003-01-22

申请人： Qing Ma

发明人： Qing Ma

IPC分类号： H01L2330

CPC分类号： H01L23/16 ,  H01L21/563 ,  H01L23/3121 ,  H01L24/19 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/20 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/92144 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/3025 ,  H01L2924/00

摘要： A stress shield made of a material having a CTE similar to that of the material used in the fabrication of a microelectronic die, including but not limited silicon, molybdenum, and aluminum nitride, which abuts at least one corner and/or edge of the microelectronic die. When the stress shield is positioned to abut the microelectronic die corners and/or edges, the mechanical stresses on the microelectronic die are greatly reduced or substantially eliminated.

公开(公告)号：US06753747B2

公开(公告)日：2004-06-22

申请号：US10113718

申请日：2002-04-01

申请人： Qing Ma

发明人： Qing Ma

IPC分类号： H01H5122

CPC分类号： H01H59/0009 ,  H01H2001/0052

摘要： An integrated microspring switch may be provided for relatively high frequency switching applications. A spring arm may be formed over a microspring dimple, which may be hemispherical and hollow in one embodiment. When the spring arm contacts the dimple, the spring dimple may resiliently deflect away or collapse, increasing the contact area between the spring arm and the dimple.

摘要翻译： 可以提供用于相对高频切换应用的集成微动开关。 弹性臂可以形成在微小凹坑上，在一个实施例中可以是半球形和中空的。 当弹簧臂接触凹坑时，弹簧凹坑可以弹性偏转或折叠，增加弹簧臂和凹坑之间的接触面积。