摘要:
A method of fabricating a MOS transistor having a thinned channel region is described. The channel region is etched following removal of a dummy gate. The source and drain regions have relatively low resistance with the process.
摘要:
A multi-gate transistor and a method of forming a multi-gate transistor, the multi-gate transistor including a fin having an upper portion and a lower portion. The upper portion having a first band gap and the lower portion having a second band gap with the first band gap and the second band gap designed to inhibit current flow from the upper portion to the lower portion. The multi-gate transistor further including a gate structure having sidewalls electrically coupled with said upper portion and said lower portion and a substrate positioned below the fin.
摘要:
Embodiments of the invention include apparatuses and methods relating to directed carbon nanotube growth using a patterned layer. In some embodiments, the patterned layer includes an inhibitor material that directs the growth of carbon nanotubes.
摘要:
A transistor structure and a system including the transistor structure. The transistor structure comprises: a substrate including a first layer comprising a first crystalline material; a tensile strained channel formed on a surface of the first layer and comprising a second crystalline material having a lattice spacing that is smaller than a lattice spacing of the first crystalline material; a metal gate on the substrate; a pair of sidewall spacers on opposite sides of the metal gate; and a source region and a drain region on opposite sides of the metal gate adjacent a corresponding one of the sidewall spacers.
摘要:
Independent n-tips for multi-gate transistors are generally described. In one example, an apparatus includes a semiconductor fin, one or more multi-gate pull down (PD) devices coupled with the semiconductor fin, the one or more PD devices having an n-tip dopant concentration in the semiconductor fin material adjacent to the one or more PD devices, and one or more multi-gate pass gate (PG) devices coupled with the semiconductor fin, the one or more PG devices having an n-tip dopant concentration in the semiconductor fin material adjacent to the one or more PG devices, wherein the n-tip dopant concentration for the PG device is lower than the n-tip dopant concentration for the PD device.
摘要:
A Group III-V Semiconductor device and method of fabrication is described. A high-k dielectric is interfaced to a confinement region by a chalcogenide region.
摘要:
A method of fabricating a quantum well device includes forming a diffusion barrier on sides of a delta layer of a quantum well to confine dopants to the quantum well.
摘要:
A method for fabricating a three-dimensional transistor is described. Atomic Layer Deposition of nickel, in one embodiment, is used to form a uniform silicide on all epitaxially grown source and drain regions, including those facing downwardly.
摘要:
Multi-gate transistors having different channel widths formed on non-planar semiconductor bodies have different sidewall heights and method of manufacturing the same. In an embodiment, a multi-gate SRAM transistor is formed on a non-planar semiconductor body having a greater sidewall height than a non-planar semiconductor body utilized for a multi-gate logic transistor to improve performance of SRAM and logic transistors formed on the same substrate. In another embodiment, to reduce cell area, a first SRAM transistor is formed on a non-planar semiconductor body having a greater sidewall height than a non-planar semiconductor body utilized for a second multi-gate SRAM transistor.
摘要:
A method including forming a via dielectric layer on a semiconductor device substrate; forming a trench dielectric layer on the via dielectric layer; forming a trench through the trench dielectric layer to expose the via dielectric layer; forming a via in the via dielectric layer through the trench to expose the substrate; and forming a semiconductor material in the via and in the trench. An apparatus including a device substrate; a dielectric layer formed on a surface of the device substrate; and a device base formed on the dielectric layer including a crystalline structure derived from the device substrate.