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公开(公告)号：US07109118B2
公开(公告)日：2006-09-19
申请号：US10841100
申请日：2004-05-07
IPC分类号： H01L21/311
CPC分类号： H01L21/288 , B33Y10/00 , C23C18/1605 , C25D5/022 , C25D5/10 , H01L21/311 , H01L21/7682 , H01L21/76879
摘要： A method of fabricating three-dimensional structures from a plurality of adhered layers of at least a first and a second material wherein the first material is a conductive material and wherein each of a plurality of layers includes treating a surface of a first material prior to deposition of the second material. The treatment of the surface of the first material either (1) decreases the susceptibility of deposition of the second material onto the surface of the first material or (2) eases or quickens the removal of any second material deposited on the treated surface of the first material. In some embodiments the treatment of the first surface includes forming a dielectric coating over the surface and the second material is electrodeposited (e.g. using an electroplating or electrophoretic process). In other embodiments the first material is coated with a conductive material that doesn't readily accept deposits of electroplated or electroless deposited materials.
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72.发明授权公开(公告)号：US08702955B2
公开(公告)日：2014-04-22
申请号：US13287437
申请日：2011-11-02
CPC分类号： B29C65/56 , B33Y10/00 , C25D5/02 , Y10T29/49885
摘要： Embodiments are directed to methods for forming multi-layer three-dimensional structures involving the joining of at least two structural elements, at least one of which is formed as a multi-layer three-dimensional structure, wherein the joining occurs via one of: (1) elastic deformation and elastic recovery and subsequent retention of elements relative to each other, (2) relative deformation of an initial portion of at least one element relative to another portion of the at least one element until the at least two elements are in a desired retention position after which the deformation is reduced or eliminated and a portion of at least one element is brought into position which in turn locks the at least two elements together via contact with one another including contact with the initial portion of at least one element, or (3) moving a retention region of one element into the retention region of the other element, without deformation of either element, along a path including a loading region of the other element and wherein during normal use the first and second elements are configured relative to one another so that the loading region of the second elements is not accessible to the retention region of the first element.
摘要翻译： 实施例涉及用于形成多层三维结构的方法，所述多层三维结构涉及至少两个结构元件的接合，其中至少一个结构元件形成为多层三维结构，其中通过以下之一进行接合：（ 1）弹性变形和弹性恢复以及随后元件相对于彼此的保持，（2）至少一个元件的初始部分相对于至少一个元件的另一部分的相对变形，直到至少两个元件处于 期望的保持位置，在此之后，变形被减小或消除，并且至少一个元件的一部分进入位置，其又通过彼此接触将至少两个元件锁定在一起，包括与至少一个元件的初始部分的接触， 或（3）将一个元件的保持区域移动到另一个元件的保持区域中，而不会使任一元件变形，沿着包括装载物 g区域，并且其中在正常使用期间，第一和第二元件相对于彼此构造，使得第二元件的加载区域不能被第一元件的保持区域访问。
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73.发明授权公开(公告)号：US08551314B2
公开(公告)日：2013-10-08
申请号：US12611795
申请日：2009-11-03
CPC分类号： C25D1/003 , B33Y10/00 , B81B2201/042 , B81C1/00293 , B81C1/00333 , B81C2201/0197 , B81C2203/0145 , C25D1/10 , C25D5/022 , G01P15/0802 , G01P15/125 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H05K3/4647 , Y10T156/10
摘要： Various embodiments of the invention are directed to formation of mesoscale or microscale devices using electrochemical fabrication techniques where structures are formed from a plurality of layers as opened structures which can be folded over or other otherwise combined to form structures of desired configuration. Each layer is formed from at least one structural material and at least one sacrificial material. The initial formation of open structures may facilitate release of the sacrificial material, ability to form fewer layers to complete a structure, ability to locate additional materials into the structure, ability to perform additional processing operations on regions exposed while the structure is open, and/or the ability to form completely encapsulated and possibly hollow structures.
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公开(公告)号：US08512861B2
公开(公告)日：2013-08-20
申请号：US13323995
申请日：2011-12-13
CPC分类号： C25D1/08 , B33Y70/00 , C25D1/003 , C25D5/022 , C25D5/10 , Y10T137/86759 , Y10T428/12361 , Y10T428/12479 , Y10T428/19 , Y10T428/24975 , Y10T428/249981 , Y10T428/29
摘要： Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.
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75.发明申请Electrochemically Fabricated Structures Having Dielectric or Active Bases and Methods of and Apparatus for Producing Such Structures 审中-公开具有电介质或活性碱的电化学结构和用于生产这种结构的方法和装置公开(公告)号：US20110180410A1
公开(公告)日：2011-07-28
申请号：US13010324
申请日：2011-01-20
IPC分类号： C25D1/00
CPC分类号： C25D1/003 , B81C1/00373 , B81C2201/0181 , B81C2201/019
摘要： Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.
摘要翻译： 多层结构在临时的（例如导电的）衬底上电化学地制造，然后在永久（例如电介质，图案化，多材料或其他功能）的衬底上结合并从临时衬底去除。 在一些实施例中，结构由顶层到底层形成，使得结构的底层变得粘附到永久性基底上，而在其它实施例中，结构由底层到顶层形成，然后是双层衬底交换 发生。 永久性基材可以是与层状结构结合的固体（例如通过粘合剂），或者可以作为在凝固期间发生结合而邻近或部分地围绕结构的一部分固化的可流动材料开始。 多层结构可以在附着永久性基底之前从牺牲材料上释放，或者在附着后可以释放多层结构。
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76.发明申请Method of Electrochemically Fabricating Multilayer Structures Having Improved Interlayer Adhesion 审中-公开电化学制造具有改善的层间粘附性的多层结构的方法公开(公告)号：US20110155580A1
公开(公告)日：2011-06-30
申请号：US13021939
申请日：2011-02-07
申请人： Gang Zhang , Adam L. Cohen , Michael S. Lockard , Ananda H. Kumar , Ezekiel J. J. Kruglick , Kieun Kim
发明人： Gang Zhang , Adam L. Cohen , Michael S. Lockard , Ananda H. Kumar , Ezekiel J. J. Kruglick , Kieun Kim
CPC分类号： C25D5/50 , C25D1/003 , C25D5/022 , C25D5/10 , C25D5/12 , C25D5/14 , C25D5/18 , C25D5/34 , C25D5/40 , C25D5/48 , H01L21/2885 , H01L21/76879 , H05K3/241 , H05K3/243
摘要： Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.
摘要翻译： 多层微尺度或中尺度结构用粘附层（例如在连续层沉积到先前层上时结合在一起的层）制造，然后进行显着增强层间粘合的热处理操作。 认为热处理操作导致材料在层边界上的扩散，并且附着力增强（即扩散粘合）。 可以通过在有助于从表面甚至从内部部分去除较弱的氧化物的还原气氛的热处理来增强层间粘附和可能的层内内聚力。
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公开(公告)号：US20110073479A1
公开(公告)日：2011-03-31
申请号：US12892734
申请日：2010-09-28
IPC分类号： C25D5/02
CPC分类号： C23C18/1689 , B33Y10/00 , B81C1/0019 , C23C18/1605 , C23C18/1651 , C25D1/003 , G03F7/00
摘要： Multi-layer structures are electrochemically fabricated from at least one structural material (e.g. nickel), that is configured to define a desired structure and which may be attached to a substrate, and from at least one sacrificial material (e.g. copper) that surrounds the desired structure. After structure formation, the sacrificial material is removed by a multi-stage etching operation. In some embodiments sacrificial material to be removed may be located within passages or the like on a substrate or within an add-on component. The multi-stage etching operations may be separated by intermediate post processing activities, they may be separated by cleaning operations, or barrier material removal operations, or the like. Barriers may be fixed in position by contact with structural material or with a substrate or they may be solely fixed in position by sacrificial material and are thus free to be removed after all retaining sacrificial material is etched.
摘要翻译： 多层结构由至少一种结构材料（例如镍）进行电化学制造，其被构造成限定期望的结构并且可以附着到基底上，并且由至少一种围绕期望的材料的牺牲材料（例如铜） 结构体。 在结构形成之后，通过多级蚀刻操作去除牺牲材料。 在一些实施例中，待移除的牺牲材料可以位于基底上或附加部件内的通道等内。 多级蚀刻操作可以通过中间后处理活动来分离，它们可以通过清洁操作或阻隔材料去除操作等分开。 障碍物可以通过与结构材料或基底接触而固定在适当的位置，或者它们可以通过牺牲材料单独固定在适当位置，并且因此在所有保留的牺牲材料被蚀刻之后可以被自由地去除。
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78.发明申请Complex Microdevices and Apparatus and Methods for Fabricating Such Devices 审中-公开用于制造这种装置的复杂微型装置和装置及方法公开(公告)号：US20100133952A1
公开(公告)日：2010-06-03
申请号：US12637659
申请日：2009-12-14
CPC分类号： H02N1/008 , B33Y10/00 , B81C1/0019 , C25D1/003
摘要： Various embodiments of the invention are directed to various microdevices including sensors, actuators, valves, scanning mirrors, accelerometers, switches, and the like. In some embodiments the devices are formed via electrochemical fabrication (EFAB®).
摘要翻译： 本发明的各种实施例涉及包括传感器，致动器，阀，扫描反射镜，加速度计，开关等的各种微型装置。 在一些实施例中，通过电化学制造（EFAB）形成器件。
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79.发明申请Electrochemical Fabrication Process Including Process Monitoring, Making Corrective Action Decisions, and Taking Appropriate Actions 审中-公开电化学制造过程包括过程监控，制定纠正措施决策，采取适当行动公开(公告)号：US20100065431A1
公开(公告)日：2010-03-18
申请号：US12624189
申请日：2009-11-23
IPC分类号： C25D21/12
CPC分类号： C25D1/003 , B81B2201/042 , B81C99/004 , G01P15/0802 , G01P15/125 , H01L21/2885 , H01L21/4857 , H01L21/76879 , H01P1/202 , H01P3/06 , H01P5/183 , H01P11/00 , H01P11/005 , H05K3/241 , H05K3/243 , H05K3/4647
摘要： Electrochemical fabrication processes and apparatus for producing multi-layer structures include operations or means for providing enhanced monitoring of build operations or detection of the results of build operations, operations or means for build problem recognition, operations or means for evaluation of corrective action options, operations or means for making corrective action decisions, and operations or means for executing actions based on those decisions.
摘要翻译： 用于生产多层结构的电化学制造工艺和设备包括用于提供构建操作的增强监控或构建操作的结果的检测，构建问题识别的操作或手段，用于评估校正动作选项的操作或手段的操作或装置 或作出纠正行动决定的手段，以及基于这些决定执行行动的操作或手段。
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80.发明申请Electrochemical Fabrication Method for Producing Compliant Beam-Like Structures 审中-公开制造符合梁状结构的电化学制造方法公开(公告)号：US20100006443A1
公开(公告)日：2010-01-14
申请号：US12504496
申请日：2009-07-16
摘要： Embodiments of the invention are directed to the formation of beam-like structures using electrochemical fabrication techniques where the beam like structures have narrow regions and wider regions such that a beam of desired compliance is obtained. In some embodiments, narrower regions of the beam are thinner than a minimum feature size but are formable as a result of the thicker regions. In some embodiments the beam-like structures are formed from a plurality of adhered layers.
摘要翻译： 本发明的实施例涉及使用电化学制造技术形成束状结构，其中束状结构具有窄区域和较宽区域，使得获得所需柔性束。 在一些实施例中，光束的较窄区域比最小特征尺寸更薄，但是由于较厚的区域而可形成。 在一些实施例中，束状结构由多个粘附层形成。
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