Techniques and configurations to impart strain to integrated circuit devices
    76.
    发明授权
    Techniques and configurations to impart strain to integrated circuit devices 有权
    赋予集成电路器件应变的技术和配置

    公开(公告)号:US08633470B2

    公开(公告)日:2014-01-21

    申请号:US12646697

    申请日:2009-12-23

    IPC分类号: H01L29/06

    摘要: Embodiments of the present disclosure describe techniques and configurations to impart strain to integrated circuit devices such as horizontal field effect transistors. An integrated circuit device includes a semiconductor substrate, a first barrier layer coupled with the semiconductor substrate, a quantum well channel coupled to the first barrier layer, the quantum well channel comprising a first material having a first lattice constant, and a source structure coupled to the quantum well channel, the source structure comprising a second material having a second lattice constant, wherein the second lattice constant is different than the first lattice constant to impart a strain on the quantum well channel. Other embodiments may be described and/or claimed.

    摘要翻译: 本公开的实施例描述了为诸如水平场效应晶体管等集成电路器件施加应变的技术和配置。 集成电路器件包括半导体衬底,与半导体衬底耦合的第一势垒层,耦合到第一势垒层的量子阱沟道,量子阱沟道包括具有第一晶格常数的第一材料和耦合到 量子阱沟道,源结构包括具有第二晶格常数的第二材料,其中第二晶格常数不同于在量子阱沟道上施加应变的第一晶格常数。 可以描述和/或要求保护其他实施例。