公开(公告)号：US06222661B1

公开(公告)日：2001-04-24

申请号：US09484445

申请日：2000-01-18

申请人： Shuichi Takeuchi ,  Junji Kamikubo

发明人： Shuichi Takeuchi ,  Junji Kamikubo

IPC分类号： G02B2608

CPC分类号： G02B27/4211 ,  G02B26/125 ,  G02B27/0031 ,  G02B27/0037 ,  G02B27/4227 ,  G02B27/4261

摘要： A scanning optical system is provided with a semiconductor laser, a polygonal mirror, which deflects a beam emitted from the semiconductor laser, an f&thgr; lens for converging the beam deflected by the deflector onto a surface to be scanned, and a diffractive surface between the polygonal mirror and the surface to be scanned. The diffractive surface compensates for a lateral chromatic aberration caused by the f&thgr; lens. Further, the diffraction efficiency of the diffractive surface on an optical axis of the f&thgr; lens is smaller than that of a peripheral portion to cancel a power variation due to a variation of the light quantity transmitted through the scanning lens.

摘要翻译： 扫描光学系统设置有半导体激光器，多角镜，其偏转从半导体激光器发射的光束，用于会聚由偏转器偏转的光束到待扫描的表面上的光束透镜，以及多边形之间的衍射面 镜子和待扫描的表面。 衍射面弥补了由透镜引起的横向色差。 此外，衍射面在透镜的光轴上的衍射效率小于外围部分的衍射面的衍射效率，以消除透过扫描透镜的光量的变化引起的功率变化。

公开(公告)号：US08456979B2

公开(公告)日：2013-06-04

申请号：US13250135

申请日：2011-09-30

申请人： Satoshi Inoue ,  Shuichi Takeuchi

发明人： Satoshi Inoue ,  Shuichi Takeuchi

IPC分类号： G11B7/135

CPC分类号： G11B7/13922 ,  G11B7/0956 ,  G11B7/1374

摘要： An optical information recording/reproducing apparatus for an optical disc using a light beam having a wavelength of λ including: an objective lens that converges the light beam onto a recording surface of the optical disc and satisfies a condition: 0.48

摘要翻译： 一种使用波长为λ的光束的光盘的光学信息记录/再现装置，包括：将光束会聚到光盘的记录表面上并满足以下条件的物镜：0.48

公开(公告)号：US08395904B2

公开(公告)日：2013-03-12

申请号：US12821938

申请日：2010-06-23

申请人： Takayoshi Matsumura ,  Kenji Kobae ,  Shuichi Takeuchi ,  Tetsuya Takahashi

发明人： Takayoshi Matsumura ,  Kenji Kobae ,  Shuichi Takeuchi ,  Tetsuya Takahashi

IPC分类号： H05K7/00

CPC分类号： H01L24/11 ,  H01L24/45 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13644 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A multichip module includes a package substrate, a first semiconductor device, a second semiconductor device and a conductive bump. The first semiconductor device is flip-chip bonded to the package substrate. The first semiconductor device includes a first chip pad on a surface thereof. The second semiconductor device is mounted on the first semiconductor device. The second semiconductor device includes a second chip pad facing the first chip pad. The conductive bump connects the first chip pad to the second chip pad. The conductive bump includes a first metallic body that has a first diffusion rate and a second metallic body that has a second diffusion rate lower than the first diffusion rate.

摘要翻译： 多芯片模块包括封装基板，第一半导体器件，第二半导体器件和导电凸块。 第一半导体器件被倒装芯片结合到封装衬底。 第一半导体器件包括在其表面上的第一芯片焊盘。 第二半导体器件安装在第一半导体器件上。 第二半导体器件包括面向第一芯片焊盘的第二芯片焊盘。 导电凸块将第一芯片焊盘连接到第二芯片焊盘。 导电凸块包括具有第一扩散速率的第一金属体和具有低于第一扩散速率的第二扩散速率的第二金属体。

公开(公告)号：US08390277B2

公开(公告)日：2013-03-05

申请号：US12908591

申请日：2010-10-20

申请人： Shuichi Takeuchi

发明人： Shuichi Takeuchi

IPC分类号： G01B7/30

CPC分类号： H02K29/12 ,  G01D5/2458

摘要： A rotational angle detector provided with a circular rotary plate integrally rotatable with a rotor of a motor and including a circumferential surface having marks, which are spaced apart by different angular intervals in a circumferential direction. A rotational angle detection unit is arranged along the circumferential direction of the rotary plate to detect a rotational angle of each mark, rotated together with the rotary plate, in a predetermined detection zone. The rotational angle detector determines, when adjacent marks are located in the detection zone, angular intervals between the adjacent marks based on the rotational angle of each mark, specifies a mark that is located in the detection zone based on the determined angular intervals, and detects the rotational angle of the rotor based on the rotational angle of the specified mark rotating in the detection zone.

摘要翻译： 一种旋转角度检测器，其设置有与电动机的转子一体地旋转的圆形旋转板，并且包括具有沿圆周方向以不同角度间隔间隔的标记的圆周表面。 旋转角度检测单元沿着旋转板的圆周方向布置，以检测与旋转板一起旋转的每个标记的旋转角度在预定检测区域中。 当相邻标记位于检测区域中时，旋转角度检测器基于每个标记的旋转角度确定相邻标记之间的角度间隔，基于确定的角度间隔指定位于检测区域中的标记，并且检测 基于在检测区域中旋转的指定标记的旋转角度的转子的旋转角度。

公开(公告)号：US08223442B2

公开(公告)日：2012-07-17

申请号：US12021516

申请日：2008-01-29

申请人： Naoki Yamagata ,  Shuichi Takeuchi

发明人： Naoki Yamagata ,  Shuichi Takeuchi

IPC分类号： G02B13/18 ,  G02B3/02

CPC分类号： G11B7/13922 ,  G11B7/1374

摘要： There is provided an objective lens for an optical pick-up. The objective lens is formed to be a single-element plastic lens having a first surface and a second surface. The first surface is configured to have, within an effective diameter, an inflection point at which a second derivative of a sag of the first surface takes a value of 0. Further, the objective lens having a numerical aperture larger than or equal to 0.75.

摘要翻译： 提供了用于光学拾取器的物镜。 物镜形成为具有第一表面和第二表面的单元塑料透镜。 第一表面被配置为在有效直径内具有第一表面的下垂的二次导数取值为0的拐点。此外，具有大于或等于0.75的数值孔径的物镜。

公开(公告)号：US08169075B2

公开(公告)日：2012-05-01

申请号：US12402881

申请日：2009-03-12

申请人： Tetsuya Takahashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

发明人： Tetsuya Takahashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Yoshiyuki Satoh ,  Hidehiko Kira ,  Takayoshi Matsumura

IPC分类号： H01L29/40

CPC分类号： B81B3/0078 ,  B81B2201/042 ,  B81B2203/0109 ,  B81B2203/0307 ,  B81C1/00126 ,  H01L24/14 ,  H01L2224/1134 ,  H01L2224/1403 ,  H01L2224/73204 ,  H01L2924/07811 ,  H01L2924/1461 ,  H01L2924/00

摘要： According to an aspect of the invention, an electronic part includes a substrate having a first planar surface, a first bump affixed to the first planar surface of the substrate, a second bump affixed to the first planar surface of the substrate a predetermined distance from the first bump, a MEMS chip including a element, the MEMS chip coupled to the first bump and the second bump, the MEMS chip distanced from the first planar surface, an adhesive region bonding with the first bump, the substrate and the MEMS chip.

摘要翻译： 根据本发明的一个方面，电子部件包括具有第一平坦表面的基板，固定到基板的第一平面表面的第一凸起，固定到基板的第一平面表面的第二凸起，距离基板的预定距离 第一凸块，包括元件的MEMS芯片，耦合到第一凸块和第二凸块的MEMS芯片，与第一平坦表面分开的MEMS芯片，与第一凸块，基板和MEMS芯片结合的粘合区域。

公开(公告)号：US07960215B2

公开(公告)日：2011-06-14

申请号：US12559219

申请日：2009-09-14

申请人： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

发明人： Hiroshi Kobayashi ,  Kenji Kobae ,  Shuichi Takeuchi ,  Hidehiko Kira

IPC分类号： H01L21/50 ,  H01L21/48 ,  H01L21/44 ,  H01L23/02 ,  H01L23/24 ,  H01L23/28 ,  H01L23/04

CPC分类号： H01L23/16 ,  G06K19/077 ,  G06K19/07728 ,  H01L23/3121 ,  H01L23/3135 ,  H01L2224/16

摘要： An electronic device includes: a base; a conductor pattern formed on the base; and a circuit chip electrically connected to the conductor pattern. The electronic device further includes a reinforcing member which is disposed on the base to surround the circuit chip, whose outer shape is like a ring, and which includes layers stacked in the thickness direction of the base. The lowermost layer of the layers is closest to the base and softer than the layer that is at least one of the remaining layers. The electronic device further includes a sealing member which fills an inside of the reinforcing member while covering the top of the circuit chip, thereby sealing the circuit chip on the base.

摘要翻译： 电子设备包括：基座; 形成在基座上的导体图案; 以及与导体图形电连接的电路芯片。 该电子设备还包括一个加强件，该加强件设置在基座上以围绕电路芯片，其外形像环形，并且包括沿基座的厚度方向堆叠的层。 层的最下层最靠近基底并且比作为剩余层中的至少一层的层更柔软。 电子装置还包括密封构件，其在覆盖电路芯片的顶部的同时填充加强构件的内部，从而将电路芯片密封在基座上。

公开(公告)号：US07880615B2

公开(公告)日：2011-02-01

申请号：US11966375

申请日：2007-12-28

申请人： Hiroshi Kobayashi ,  Shuichi Takeuchi

发明人： Hiroshi Kobayashi ,  Shuichi Takeuchi

IPC分类号： G08B13/14 ,  H01L21/00 ,  H01P11/00 ,  B44C1/17 ,  G06K19/06

CPC分类号： G06K19/07749 ,  G06K19/07718 ,  G06K19/0775 ,  H01L21/67144 ,  H01L2224/16 ,  H01L2224/75252 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H05K1/0393 ,  H05K3/0097 ,  H05K2201/09227 ,  H05K2203/1545 ,  Y10T29/49016 ,  H01L2224/0401

摘要： A tag manufacturing system includes an antenna forming apparatus which forms multiple antennas in such a way that the antennas are formed in a point-symmetrical arrangement including antenna orientations, on a long base sheet large enough to place multiple bases, and winds the base sheet into a roll body; an IC chip mounting apparatus which pulls the base sheet out of the roll body, mounts an IC chip on each of the antennas formed on the pulled base sheet in an orientation corresponding to an orientation of each antenna, and electrically connects the IC chip with the antenna; and a post-processing apparatus which performs post-processing of the base sheet with the IC chips mounted on the antennas to work up the base sheet into finished RFID tags.

摘要翻译： 标签制造系统包括天线形成装置，其形成多个天线，使得天线以包括天线取向的点对称布置形成，在长的基片上，足以放置多个基底，并将基片卷绕成 卷体; 将基片从辊体拉出的IC芯片安装装置以与每个天线的取向对应的取向安装在形成在拉动基片上的每个天线上的IC芯片，并将IC芯片与 天线; 以及后处理装置，其利用安装在天线上的IC芯片对基片执行后处理，以将基片加工成成品的RFID标签。

公开(公告)号：US07868437B2

公开(公告)日：2011-01-11

申请号：US11936332

申请日：2007-11-07

申请人： Shuichi Takeuchi

发明人： Shuichi Takeuchi

IPC分类号： H01L23/02 ,  H01L23/20

CPC分类号： G06K19/07749 ,  G06K19/0775 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/4847 ,  H01L2224/48599 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3426 ,  H05K2201/10386 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A mounting structure for an IC tag where an IC chip for mounting (10) is mounted so as to be electrically connected to antenna patterns (44a), (44b). The assembly process that mounts the IC chip for mounting (10) on the antenna patterns (44a), (44b) is simplified, which makes it possible to reduce the manufacturing cost of IC tags. The IC chip for mounting 10 is formed by winding conductive wires (12a), (12b) so as to encircle an outer surface of an IC chip (20) between two opposite edges of the IC chip (20) in a state where the conductive wires (12a), (12b) mechanically contact electrodes formed on the IC chip (20) and are electrically connected to the electrodes, so that the IC chip for mounting (10) is joined to the antenna patterns (44a), (44b) via the conductive wires (12a), (12b).

摘要翻译： 一种用于安装IC芯片（10）的IC标签的安装结构，以电连接到天线图案（44a），（44b）。 将用于安装（10）的IC芯片安装在天线图案（44a），（44b）上的组装过程被简化，这使得可以降低IC标签的制造成本。 用于安装的IC芯片10通过在导电（12a），（12b）之间缠绕以在IC芯片（20）的两个相对边缘之间环绕IC芯片（20）的外表面的方式形成，其中导电 电线（12a），（12b）机械地接触形成在IC芯片（20）上的电极，并与电极电连接，使得安装用IC芯片（10）与天线图案（44a），（44b） 经由导线（12a），（12b）。

公开(公告)号：US20100258640A1

公开(公告)日：2010-10-14

申请号：US12756487

申请日：2010-04-08

申请人： Shuichi Takeuchi ,  Kenji Kobae ,  Takayoshi Matsumura ,  Tetsuya Takahashi

发明人： Shuichi Takeuchi ,  Kenji Kobae ,  Takayoshi Matsumura ,  Tetsuya Takahashi

IPC分类号： G06K19/077 ,  B29C65/00

CPC分类号： G06K19/07749 ,  G06K19/07724 ,  G06K19/07728 ,  Y10T156/10

摘要： An RFID tag includes an inlet on which an antenna pattern serving as an antenna for communication and an IC chip electrically connected to the antenna pattern are mounted. The RFID tag also includes an exterior body that encloses the inlet from outside and a hollow space that is formed by the inlet and the exterior body and that is filled with gas or a gel material.

摘要翻译： RFID标签包括其上安装用作通信用天线的天线图案和与天线图案电连接的IC芯片的入口。 RFID标签还包括从外部包围入口的外部主体和由入口和外部主体形成并且填充有气体或凝胶材料的中空空间。