Semiconductor devices having metal gate and method for manufacturing semiconductor devices having metal gate
    73.
    发明授权
    Semiconductor devices having metal gate and method for manufacturing semiconductor devices having metal gate 有权
    具有金属栅极的半导体器件和具有金属栅极的半导体器件的制造方法

    公开(公告)号:US09530778B1

    公开(公告)日:2016-12-27

    申请号:US14834439

    申请日:2015-08-25

    Abstract: Semiconductor devices having metal gate include a substrate, a first nFET device formed thereon, and a second nFET device formed thereon. The first nFET device includes a first n-metal gate, and the first n-metal gate includes a third bottom barrier metal layer and an n type work function metal layer. The n type work function metal layer directly contacts the third bottom barrier layer. The second nFET device includes a second n-metal gate and the second n-metal gate includes a second bottom barrier metal layer, the n type work function metal layer, and a third p type work function metal layer sandwiched between the second bottom barrier metal layer and the n type work function metal layer. The third p type work function metal layer of the second nFET device and the third bottom barrier metal layer of the first nFET device include a same material.

    Abstract translation: 具有金属栅极的半导体器件包括衬底,其上形成的第一nFET器件和形成在其上的第二nFET器件。 第一nFET器件包括第一n型金属栅极,并且第一n型金属栅极包括第三底部阻挡金属层和n型功函数金属层。 n型功函数金属层直接接触第三底层阻挡层。 第二nFET器件包括第二n型金属栅极,第二n型金属栅极包括第二底部阻挡金属层,n型功函数金属层和夹在第二底部阻挡金属之间的第三p型功函数金属层 层和n型功函数金属层。 第二nFET器件的第三p型功函数金属层和第一nFET器件的第三底阻挡金属层包括相同的材料。

    SEMICONDUCTOR STRUCTURE HAVING A CENTER DUMMY REGION
    76.
    发明申请
    SEMICONDUCTOR STRUCTURE HAVING A CENTER DUMMY REGION 有权
    具有中心地区的半导体结构

    公开(公告)号:US20160240540A1

    公开(公告)日:2016-08-18

    申请号:US14620212

    申请日:2015-02-12

    Abstract: A semiconductor structure is provided, including a substrate, a plurality of first semiconductor devices, a plurality of second semiconductor devices, and a plurality of dummy slot contacts. The substrate has a device region, wherein the device region includes a first functional region and a second functional region, and a dummy region is disposed therebetween. The first semiconductor devices and a plurality of first slot contacts are disposed in the first functional region. The second semiconductor devices and a plurality of second slot contacts are disposed in the second functional region. The dummy slot contacts are disposed in the dummy region.

    Abstract translation: 提供一种半导体结构,包括基板,多个第一半导体器件,多个第二半导体器件和多个虚拟插槽触点。 衬底具有器件区域,其中器件区域包括第一功能区域和第二功能区域,并且虚设区域设置在其间。 第一半导体器件和多个第一时隙触点设置在第一功能区域中。 第二半导体器件和多个第二槽触点设置在第二功能区域中。 虚拟插槽触点设置在虚拟区域中。

    METHOD FOR FORMING SEMICONDUCTOR DEVICE
    78.
    发明申请
    METHOD FOR FORMING SEMICONDUCTOR DEVICE 有权
    形成半导体器件的方法

    公开(公告)号:US20160104646A1

    公开(公告)日:2016-04-14

    申请号:US14514374

    申请日:2014-10-14

    Abstract: A manufacturing method for forming a semiconductor device includes: first, a substrate is provided, a fin structure is formed on the substrate, and a plurality of gate structures are formed on the fin structure, next, a hard mask layer and a first photoresist layer are formed on the fin structure, an first etching process is then performed on the first photoresist layer, afterwards, a plurality of patterned photoresist layers are formed on the remaining first photoresist layer and the remaining hard mask layer, where each patterned photoresist layer is disposed right above each gate structure, and the width of each patterned photoresist is larger than the width of each gate structure, and the patterned photoresist layer is used as a hard mask to perform an second etching process to form a plurality of second trenches.

    Abstract translation: 一种半导体器件的制造方法,其特征在于,首先,在基板上形成有基板,在所述散热片结构上形成有多个栅极结构,然后将硬掩模层和第一光致抗蚀剂层 形成在鳍结构上,然后在第一光致抗蚀剂层上进行第一蚀刻工艺,然后在剩余的第一光致抗蚀剂层和剩余的硬掩模层上形成多个图案化的光致抗蚀剂层,其中每个图案化的光致抗蚀剂层被设置 每个栅极结构的正上方,并且每个图案化的光致抗蚀剂的宽度大于每个栅极结构的宽度,并且图案化的光致抗蚀剂层用作硬掩模以执行第二蚀刻工艺以形成多个第二沟槽。

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