PARTICULATE COMPOSITIONS COMPRISING A METAL PRECURSOR FOR ADDITIVE MANUFACTURING AND METHODS ASSOCIATED THEREWITH

    公开(公告)号:US20210071020A1

    公开(公告)日:2021-03-11

    申请号:US16916460

    申请日:2020-06-30

    Inventor: Nan-Xing Hu

    Abstract: Additive manufacturing processes, such as powder bed fusion of thermoplastic particulates, may be employed to form printed objects in a range of shapes. It is sometimes desirable to form conductive traces upon the surface of printed objects. Conductive traces and similar features may be introduced during additive manufacturing processes by incorporating a metal precursor in a thermoplastic printing composition, converting a portion of the metal precursor to discontinuous metal islands using laser irradiation, and performing electroless plating. Suitable printing compositions may comprise a plurality of thermoplastic particulates comprising a thermoplastic polymer, a metal precursor admixed with the thermoplastic polymer, and optionally a plurality of nanoparticles disposed upon an outer surface of each of the thermoplastic particulates, wherein the metal precursor is activatable to form metal islands upon exposure to laser irradiation. Melt emulsification may be used to form the thermoplastic particulates.

    METHOD OF USING A TONER AS A PRINTABLE ADHESIVE

    公开(公告)号:US20190218437A1

    公开(公告)日:2019-07-18

    申请号:US15874451

    申请日:2018-01-18

    Abstract: Methods of using a toner as a printable adhesive are provided. In embodiments, a method of adhering substrates is provided which comprises disposing a cold pressure fix toner comprising a phase change material on a first substrate via xerography to form an unfused layer of the cold pressure fix toner on the first substrate; placing a second substrate on the unfused layer of the cold pressure fix toner; and subjecting the cold pressure fix toner to a pressure to form a bonded article comprising the first substrate, an adhesive layer formed from the cold pressure fix toner, and the second substrate. Methods of applying an adhesive to a substrate and bonded articles are also provided.

    Device comprising dielectric interlayer

    公开(公告)号:US10199586B2

    公开(公告)日:2019-02-05

    申请号:US15221885

    申请日:2016-07-28

    Abstract: A process for preparing a device and a device including a substrate; an interlayer disposed on the substrate, wherein the interlayer comprises a cured film formed from an interlayer composition, wherein the interlayer composition comprises: an epoxy compound; a polyvinyl phenol; a melamine resin; a solvent; an optional surfactant; and an optional catalyst; a source electrode and a drain electrode disposed on a surface of the interlayer; a semiconductor layer disposed on the interlayer, wherein the semiconductor layer is disposed into a gap between the source and drain electrode; a back channel interface comprising an interface between the semiconductor layer and the interlayer, wherein the interlayer serves as a back channel dielectric layer for the device; a dielectric layer disposed on the semiconductor layer; a gate electrode disposed on the dielectric layer. Also an interlayer composition and an organic thin film transistor comprising the interlayer composition.

Patent Agency Ranking