公开(公告)号：US4726983A

公开(公告)日：1988-02-23

申请号：US811885

申请日：1985-12-20

申请人： Hiroshi Harada ,  Yoshihiro Hirata ,  Masanobu Tosa

发明人： Hiroshi Harada ,  Yoshihiro Hirata ,  Masanobu Tosa

IPC分类号： H01L21/285 ,  C23C14/00 ,  C23C14/02 ,  C23C14/34 ,  C23C16/02 ,  C23C16/12 ,  H01L21/28 ,  H01L21/768 ,  H01L23/532 ,  H01L21/72 ,  H01L21/60

CPC分类号： C23C16/12 ,  C23C14/0073 ,  C23C14/024 ,  C23C16/0272 ,  H01L21/76886 ,  H01L23/53214 ,  H01L2924/0002 ,  Y10T428/24967

摘要： A homogeneous fine grained metal film (6') on a substrate in accordance with the present invention comprises multiple metal layers and intervening layers (14) between the respective metal layers, the intervening layers being formed of a compound of the metal and a reactive gas and serving to suppress growth of grains (12') in the respective metal layers and to suppress electromigration of grain boundaries (13').In a method for manufacturing a metal film (6') having homogeneous and fine grains on a substrate in accordance with the present invention, one or more intervening layers (14) are formed by introducing a gas reactive with the metal film one or more times during deposition of the metal film, whereby intervening layers of a metal compound are interposed between the successively deposited metal layers. Thus, a metal film of a multilayered structure including multiple metal layers separated by the intervening layers is formed.

摘要翻译： 根据本发明的基板上的均匀细粒金属膜（6'）在各个金属层之间包括多个金属层和中间层（14），所述中间层由金属和反应性气体的化合物形成 并且用于抑制各金属层中的晶粒（12'）的生长并抑制晶界（13'）的电迁移。 在根据本发明的基板上制造具有均匀和细晶粒的金属膜（6'）的方法中，通过将与金属膜反应的气体一次或多次引入一个或多个中间层（14） 在金属膜的沉积期间，金属化合物的中间层插入在相继沉积的金属层之间。 因此，形成包括由中间层隔开的多个金属层的多层结构的金属膜。

公开(公告)号：US20120328988A1

公开(公告)日：2012-12-27

申请号：US13530225

申请日：2012-06-22

申请人： Yoshihiro Hirata

发明人： Yoshihiro Hirata

IPC分类号： G21K5/00 ,  G03F7/20 ,  H03F3/08

CPC分类号： H01J37/16 ,  B82Y10/00 ,  B82Y40/00 ,  H01J37/3177 ,  H01J2237/0435 ,  H01J2237/188 ,  H01J2237/31774 ,  H03F3/08

摘要： A drawing apparatus which performs drawing on a substrate with a plurality of charged particle beams includes: a blanking deflector located in a vacuum chamber and configured to blank each of the plurality of charged particle beams; a device located in an external chamber in which a gas pressure is higher than a gas pressure in the vacuum chamber, and configured to control the blanking deflector; and a first substrate facing the blanking deflector. The first substrate constitutes a partition which separates the vacuum chamber and the external chamber in a region, of the first substrate, facing the blanking deflector, and includes an electrode which fills a via formed in the region. The device is electrically connected to the blanking deflector via the electrode.

摘要翻译： 利用多个带电粒子束在基板上进行绘图的绘图装置包括：位于真空室中并被构造成对多个带电粒子束中的每一个进行空白的消隐偏转器; 位于外部室中的装置，其中气体压力高于真空室中的气体压力，并且构造成控制消隐偏转器; 以及面向遮光偏转器的第一基板。 第一基板构成在第一基板的面向消隐偏转器的区域中分离真空室和外部室的隔板，并且包括填充在该区域中形成的通孔的电极。 该装置通过电极电连接到消隐偏转器。

公开(公告)号：US20120115306A1

公开(公告)日：2012-05-10

申请号：US13289350

申请日：2011-11-04

申请人： Toru Yamazaki ,  Masamichi Kuwabara ,  Yoshihiro Hirata

发明人： Toru Yamazaki ,  Masamichi Kuwabara ,  Yoshihiro Hirata

IPC分类号： H01L21/02 ,  G21K5/10 ,  H01J37/305 ,  H01J3/14

CPC分类号： H01J37/3177 ,  B82Y10/00 ,  B82Y40/00 ,  G21K1/087 ,  H01J37/045 ,  H01J2237/0437 ,  H01J2237/31754 ,  H01J2237/31774

摘要： A deflector array includes a first base substrate including a plurality of apertures formed thereon, and a plurality of deflector chips including a plurality of apertures formed thereon and a plurality of electrode pairs disposed at both sides of at least a part of the plurality of apertures. The plurality of deflector chips is fixed to the first base substrate in such a manner that the plurality of apertures of the deflector chips is arranged at positions corresponding to the plurality of apertures of the first base substrate.

摘要翻译： 偏转器阵列包括包括形成在其上的多个孔的第一基底基板和包括形成在其上的多个孔的多个偏转片，以及设置在多个孔的至少一部分的两侧的多个电极对。 多个偏转器芯片以这样的方式固定到第一基底基板，使得偏转片的多个孔布置在与第一基底的多个孔对应的位置处。

公开(公告)号：US08052810B2

公开(公告)日：2011-11-08

申请号：US12399589

申请日：2009-03-06

申请人： Kazunori Okada ,  Yoshihiro Hirata ,  Shinji Inazawa ,  Masao Sakuta ,  Yoshiaki Tani ,  Teruhisa Sakata

发明人： Kazunori Okada ,  Yoshihiro Hirata ,  Shinji Inazawa ,  Masao Sakuta ,  Yoshiaki Tani ,  Teruhisa Sakata

IPC分类号： C23C14/00 ,  C22F1/10

CPC分类号： C22F1/10 ,  G01R1/06733 ,  G01R1/0675 ,  G01R1/06755

摘要： A metal structure according to the present invention is unlikely to become brittle and has excellent hardness and creep resistance, characterized in that annealing has been applied at a temperature not more than the temperature at which crystals of the metal material start to become larger. This metal structure includes at least two kinds of metal material, and annealing can be applied at a temperature not more than the temperature at which crystals of the metal material start to become larger. For example, the present invention is advantageous in the manner of a microstructure for a contact probe. A fabricating method according to the present invention is a method of fabricating a metal structure unlikely to become brittle and having excellent hardness and creep resistance, characterized in that the step of applying annealing at a temperature not more than the temperature at which crystals of the metal material start to become larger is included.

摘要翻译： 根据本发明的金属结构不可能变脆，并具有优异的硬度和抗蠕变性，其特征在于，在不高于金属材料的晶体开始变大的温度的温度下进行退火。 该金属结构包括至少两种金属材料，并且可以在不高于金属材料的晶体开始变大的温度的温度下进行退火。 例如，本发明对于接触探针的微结构的方式是有利的。 根据本发明的制造方法是一种制造不易脆性并且具有优异的硬度和抗蠕变性的金属结构的方法，其特征在于，在不高于金属晶体的温度的温度下进行退火的步骤 材料开始变大了。

公开(公告)号：US20100073662A1

公开(公告)日：2010-03-25

申请号：US12565164

申请日：2009-09-23

申请人： Yoshihiro Hirata

发明人： Yoshihiro Hirata

IPC分类号： G03B27/58

CPC分类号： G03B27/58 ,  G03F7/70725

摘要： A stage apparatus comprises plural stages movable across plural areas, movable bodies which are provided in one-to-one correspondence with the plural stages and are movable across the plural areas, plural lines which connect each of the plural stages to a corresponding one of the plural movable bodies, a driving unit which drives the plural movable bodies, and a controller which controls the driving by the driving unit. The controller controls the driving unit with the movable body moving in synch with movement of the stage during inter-area movement in which the stage moves across two of the plural areas, and stops the driving of the movable body by the driving unit or controls the driving unit with the movable body remaining at a specific target position during intra-area movement in which a process is performed on the stage while the stage moves within one of the plural areas.

摘要翻译： 舞台装置包括多个可移动跨越多个区域的移动体，可移动体与多个台阶一一对应地设置，并且可移动跨越多个区域，将多个级中的每一个连接到相应的一个 多个可移动体，驱动多个移动体的驱动单元，以及控制由驱动单元驱动的控制器。 所述控制器控制所述驱动单元，其中所述移动体在所述平台在所述多个区域中的两个区域移动的区域间移动期间与所述平台的运动同步地移动，并且通过所述驱动单元停止所述可移动体的驱动或控制所述驱动单元 驱动单元，其中可移动体在区域内运动期间保持在特定目标位置，其中在台架在多个区域中的一个区域内移动时在台架上进行处理。

公开(公告)号：US07507665B2

公开(公告)日：2009-03-24

申请号：US11200191

申请日：2005-08-10

申请人： Koji Nitta ,  Shinji Inazawa ,  Yoshihiro Hirata ,  Kazunori Okada

发明人： Koji Nitta ,  Shinji Inazawa ,  Yoshihiro Hirata ,  Kazunori Okada

IPC分类号： H01L21/4763 ,  H01L21/44

CPC分类号： C25D5/34 ,  B81B2201/018 ,  B81B2207/07 ,  B81C1/00698 ,  C25D5/022 ,  C25D5/10 ,  H05K3/205 ,  H05K2203/0315 ,  H05K2203/1157

摘要： A method of manufacturing electrical parts is provided, which method comprises the steps of: forming a photoresist on a part of the surface of a substrate; forming a metal layer on the surface of the substrate after the photoresist has been formed; removing a part of the metal layer; removing a metal oxide film formed on the: surface of the metal layer as a result of removing a part of the metal layer; and removing the photoresist. With this method the contact resistance on the surfaces of the electrical parts can be decreased.

摘要翻译： 提供一种制造电气部件的方法，该方法包括以下步骤：在基板表面的一部分上形成光致抗蚀剂; 在形成光致抗蚀剂之后，在基板的表面上形成金属层; 去除所述金属层的一部分; 通过除去金属层的一部分，去除形成在金属层的表面上的金属氧化物膜; 并去除光致抗蚀剂。 通过这种方法，可以减少电气部件表面上的接触电阻。

公开(公告)号：US20080088050A1

公开(公告)日：2008-04-17

申请号：US11665473

申请日：2005-11-18

申请人： Jun Yorita ,  Yoshihiro Hirata

发明人： Jun Yorita ,  Yoshihiro Hirata

IPC分类号： C04B35/00

CPC分类号： B41J2/1631 ,  B01D39/1692 ,  B26F1/24 ,  B29C43/003 ,  B29C43/021 ,  B29C2043/025 ,  B41J2/162 ,  B41J2/1625 ,  B41J2/1629 ,  B41J2/1632 ,  B41J2/1637 ,  B41J2/1642 ,  B41J2/1646 ,  H05K3/005 ,  H05K2201/0129 ,  H05K2203/0108 ,  H05K2203/1105 ,  H05K2203/1189

摘要： In order to provide a processing method according to which a highly precise microstructure can be easily formed with low manufacturing cost, the present invention is characterized by comprising the steps of: placing a thin film made of a resin between a pressing die and a facing base; heating the thin film made of a resin between a pressing die and a facing base to a temperature that is no lower than the temperature at which the resin starts being liquefied; and applying pressure to the thin film made of a resin between a pressing die and a facing base at a temperature that is no lower than the temperature at which the resin starts being liquefied, so that a through hole is formed.

摘要翻译： 为了提供一种能够以低制造成本容易地形成高精度微结构的加工方法，本发明的特征在于包括以下步骤：将由树脂制成的薄膜放置在压模和面对基座之间 ; 在压模和面对基座之间加热由树脂制成的薄膜至不低于树脂开始液化的温度的温度; 并且在不低于树脂开始液化温度的温度下对由压模和面对基部之间的树脂制成的薄膜施加压力，从而形成通孔。

公开(公告)号：US07151385B2

公开(公告)日：2006-12-19

申请号：US10470399

申请日：2002-01-22

申请人： Yoshihiro Hirata ,  Tsuyoshi Haga ,  Toshiyuki Numazawa ,  Kazuo Nakamae ,  Kazunori Okada ,  Jun Yorita

发明人： Yoshihiro Hirata ,  Tsuyoshi Haga ,  Toshiyuki Numazawa ,  Kazuo Nakamae ,  Kazunori Okada ,  Jun Yorita

IPC分类号： G01R31/02 ,  H01K3/10

CPC分类号： G01R1/06733 ,  G01R1/06738 ,  G01R1/06755 ,  G01R3/00 ,  Y10T29/49117 ,  Y10T29/49204

摘要： A method of manufacturing a contact probe includes an electroforming step of, using a resist film (522) arranged on a substrate (521) as a pattern frame having a shape corresponding to a contact probe, performing electroforming to fill a gap in the resist film (522) to form a metal layer (526), a tip end shaping step of obliquely removing and sharpening that part of the metal layer (526) which serves as a tip end portion of the contact probe, and a take-out step of taking out only the metal layer (526) from the pattern frame.

摘要翻译： 制造接触探针的方法包括：电铸步骤，使用布置在基板（521）上的抗蚀剂膜（522）作为具有与接触探针对应的形状的图案框架，进行电铸以填充抗蚀剂膜的间隙 （522），以形成金属层（526）;顶端成形步骤，用于倾斜和磨削用作接触探针的顶端部分的金属层（526）的该部分，以及取出步骤 仅从图案框架中取出金属层（526）。

公开(公告)号：US20060276044A1

公开(公告)日：2006-12-07

申请号：US11503303

申请日：2006-08-14

申请人： Jun Yorita ,  Yoshihiro Hirata ,  Tsuyoshi Haga

发明人： Jun Yorita ,  Yoshihiro Hirata ,  Tsuyoshi Haga

IPC分类号： G03C5/00 ,  H01L21/302

CPC分类号： B81C99/0085 ,  B81C2201/032 ,  C25D1/003 ,  H01L21/4821 ,  H05K3/202 ,  H05K3/205

摘要： A method of manufacturing a metal microstructure (1) by using a resin mold (13). In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold (13) can be set and the high-precision metal microstructure (1) can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure (1) according to the present invention includes the steps of: fixing on a conductive substrate (11) the resin mold (13) having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer (12) having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure (2) having the resin mold (13); exposing the layered structure (2) having the resin mold (13) to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer (12c) existing at the vacant portion of the resin mold (13); and filling with a metal (14) the vacant portion of the layered structure (2) having the resin mold (13) by electroforming.

摘要翻译： 一种通过使用树脂模具（13）制造金属微结构（1）的方法。 为了提供可以设定对树脂模具（13）造成较小损害的温和制造条件并且可以通过均匀电铸来大量生产高精度金属微结构（1）的方法，制造 根据本发明的金属微结构（1）包括以下步骤：通过插入具有一个或多个金属微结构（1）的光敏聚合物（12）将具有穿过厚度方向的空白部分的树脂模具（13）固定在导电基板（11）上， 化学成分由电子束，紫外线辐射或可见光辐射而变化，形成具有树脂模具（13）的层状结构（2）。 将具有树脂模具（13）的层状结构（2）暴露于电子束，紫外线或可见光; 去除存在于树脂模具（13）的空缺部分的曝光的光敏聚合物（12c）; 并通过电铸将金属（14）填充到具有树脂模具（13）的层状结构（2）的空位部分上。

公开(公告)号：US20060255815A1

公开(公告)日：2006-11-16

申请号：US11472621

申请日：2006-06-21

申请人： Yoshihiro Hirata ,  Tsuyoshi Haga ,  Toshiyuki Numazawa ,  Kazuo Nakamae ,  Kazunori Okada ,  Jun Yorita

发明人： Yoshihiro Hirata ,  Tsuyoshi Haga ,  Toshiyuki Numazawa ,  Kazuo Nakamae ,  Kazunori Okada ,  Jun Yorita

IPC分类号： G01R31/02

CPC分类号： G01R1/06733 ,  G01R1/06738 ,  G01R1/06755 ,  G01R3/00 ,  Y10T29/49117 ,  Y10T29/49204

摘要： A method of manufacturing a contact probe includes an electroforming step of, using a resist film (522) arranged on a substrate (521) as a pattern frame having a shape corresponding to a contact probe, performing electroforming to fill a gap in the resist film (522) to form a metal layer (526), a tip end shaping step of obliquely removing and sharpening that part of the metal layer (526) which serves as a tip end portion of the contact probe, and a take-out step of taking out only the metal layer (526) from the pattern frame.

摘要翻译： 制造接触探针的方法包括：电铸步骤，使用布置在基板（521）上的抗蚀剂膜（522）作为具有与接触探针对应的形状的图案框架，进行电铸以填充抗蚀剂膜的间隙 （522），以形成金属层（526）;顶端成形步骤，用于倾斜和磨削用作接触探针的顶端部分的金属层（526）的该部分，以及取出步骤 仅从图案框架中取出金属层（526）。