Abstract:
The polarity of the semiconductor layers in an AlGaInP semiconductor laser fabricated by impurity induced layer disordering (IILD) is reversed to allow n-doping. Thus, the cladding and confinement layers between the substrate and the active layer will have p-type conductivity. The upper confinement, cladding, and contact layers can be either n or p-type conductivity with n-diffused regions formed by IILD extending down from the contact layer to the lower cladding layer. The electrodes can include either a substrate electrode or a lateral electrode.
Abstract:
In a method for manufacturing a semiconductor laser diode, producing visible light after growing a p type GaAs contact layer on a p type AlGaInP cladding layer, an n type layer comprising that can be selectively etched with an etchant that does not etch GaAs is grown on the p type GaAs contact layer. After cooling, the n type layer is selectively etched and removed. In this method, a diffusion potential produced at the p-n junction between the p type GaAs contact layer and the n type layer prevents ionized hydrogen from entering the p type AlGaInP cladding layer during cooling, whereby the activation ratio of Zn atoms in the p type AlGaInP cladding layer is increased. Therefore, even if the Zn/III ratio during the growth of the p type AlGaInP cladding layer is low, a semiconductor laser diode with reduced threshold current and improved temperature characteristics is attained. In addition, since the n type layer grown on the p type GaAs contact layer comprises a semiconductor material that can be selectively etched with an etchant that does not etch GaAs, the etching process of the n type layer is carried out with high controllability without adversely affecting the surface of the p type GaAs contact layer, resulting in a highly reliable semiconductor laser diode.
Abstract:
A surface emitting, circular grating, semiconductor laser. Gain is generated by injecting current into an active, annular mesa region which surrounds a central, circular region having a circular grating for surface emission. The annular mesa region is surrounded by an outer annular region in which is etched a first order grating for creating feedback. Methods of fabricating the circular grating laser are also described.
Abstract:
The semiconductor laser comprises a Sn doped InP substrate 1, n-InGaAsP wave guide layer 2, 5 nm thick InGaAs well layer 3, 3.5 nm thick undoped InGaAsP layer 4, 3 nm thick p-InGaAsP modulation doping layer 5, 3.5 nm thick undoped InGaAsP layer 6, a modulation doping quantum well layer 7 with ten wells, a 90 nm thick p-InGaAsP layer 8, a p-InP clad layer 9 (Zn=7.times.10.sup.17 cm.sup.-3), p-n-p current block layer 10, and a mesa-shaped active layer region 11. An Au/sn n-electrode 12 and if Au/Zn p-electrode 13 are formed by vapor deposition to complete the laser structure.
Abstract:
A method for activating the zinc dopant in an active layer of a Group III/Group V semiconductor device comprises forming a layer of zinc doped Group III/Group IV material, and thereafter annealing the layer at a predetermined temperature and for a predetermined time sufficient to convert inactive zinc in the layer to acceptor zinc. In a preferred embodiment of the invention, a method for activating zinc dopant in the active layer of an InP-InGaAsP double heterostructure comprises annealing the active layer at a temperature of about 625.degree. C. for at least about 190 seconds which converts inactive zinc to acceptor zinc without substantially decreasing the total zinc in the active layer. In another preferred embodiment, a method for increasing the power output of InP-InGaAsP optoelectronic semiconductor device, such as a laser or an LED having a zinc doped active layer, comprises annealing the active layer of the semiconductor device at a temperature of about 625.degree. C. for at least about 190 seconds.
Abstract:
A vertical-cavity surface emitting laser and method of making in which a III-V heterostructure is epitaxially grown to include a quantum well active region between two interference mirrors separated by an emitting wavelength of the quantum well region. A small pillar of this heterostructure is etched by chemically assisted xenon ion beam itching. Prior to etching, a top metal contact is deposited on the epitaxial semiconductor. Light is emitted through the substrate having a bandgap larger than that of the quantum well region.
Abstract:
A semiconductor laser comprising a middle-positioned active layer sandwiched between the lower-positioned active layer and the upper-positioned active layer, the refractivity of each of said lower- and upper- positioned active layers being slightly different from that of the middle-positioned active layer.
Abstract:
In conventional InGaAsP/InP semiconductor lasers the p-doping in the InP laser level cannot be increased above 1.times.10.sup.18 atoms/cm.sup.3 without adversely affecting the optical characteristics of the devices. However, by introducing a thin low-doped p-InP layer and a thicker highly doped InP layer, good optical characteristics can be maintained and series resistance can be reduced by a factor of 2 to 4, thereby resulting in operable devices having significantly increased operating currents and higher output power than those of the prior art.
Abstract:
A vertical cavity surface emitting laser includes an optical resonator, a photodiode, and an electrical contact arrangement. The optical resonator includes a semiconductor multilayer stack. The semiconductor multilayer stack includes, in a direction of growth of the multilayer stack, a first distributed Bragg reflector, a second distributed Bragg reflector, and an active region for laser emission arranged between the first distributed Bragg reflector and second distributed Bragg reflector. The electrical contact arrangement is arranged to electrically pump the optical resonator and to electrically contact the photodiode. A reflectivity of the second distributed Bragg reflectoris higher than a reflectivity of the first distributed Bragg reflector. The photodiode has an absorbing region arranged in the second distributed Bragg reflector. A tunnel junction is arranged between the photodiode and the active region.
Abstract:
A semiconductor layer stack, a component made therefrom, a component module, and a production method is provided. The semiconductor layer stack has at least two layers (A, B), which, as individual layers, each have an energy position of the Fermi level in the semiconductor band gap,