公开(公告)号：US20090159452A1

公开(公告)日：2009-06-25

申请号：US12164429

申请日：2008-06-30

Applicant: SHING-TZA LIOU ,  YAO-WEN BAI ,  RUI ZHANG ,  QIU-YUE ZHANG

Inventor： SHING-TZA LIOU ,  YAO-WEN BAI ,  RUI ZHANG ,  QIU-YUE ZHANG

IPC: C25D5/02

CPC classification number: C25D5/54 ,  C25D5/02 ,  C25D5/56

Abstract: An electroplating method includes steps of: providing a substrate having a first portion and a second portion connected to the first portion; forming a metallic layer on a surface of the second portion; immersing the first portion of the substrate in an electrolyte solution, applying a current to the metallic layer to electroplate the first portion of the substrate with a metal layer; and moving the substrate in a direction away from the electrolyte solution during electroplating the first portion of the substrate. The method can improve a uniformity of the obtained plating layer.

Abstract translation: 电镀方法包括以下步骤：提供具有连接到第一部分的第一部分和第二部分的基板; 在所述第二部分的表面上形成金属层; 将基板的第一部分浸入电解液中，向金属层施加电流以用金属层电镀基板的第一部分; 以及在电镀所述基板的第一部分期间沿着远离所述电解质溶液的方向移动所述基板。 该方法可以提高所得镀层的均匀性。

公开(公告)号：US20090139086A1

公开(公告)日：2009-06-04

申请号：US12207333

申请日：2008-09-09

Applicant: TSO-HUNG YEH ,  HUNG-YI CHANG ,  CHIA-CHENG CHEN

Inventor： TSO-HUNG YEH ,  HUNG-YI CHANG ,  CHIA-CHENG CHEN

IPC: H05K3/10 ,  H05K3/36

CPC classification number: H05K3/427 ,  H05K3/0094 ,  H05K3/064 ,  H05K2201/0959 ,  H05K2203/0369 ,  H05K2203/1394 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: The present invention relates to a method for manufacturing printed circuit boards. A substrate including a base and two conductive layers on two opposite surfaces of the base is provided. A through-hole passing through the base and the conductive layers is defined in the substrate. A metal layer is formed on the substrate. The metal layer has a first portion on an outer surface of the substrate and a second portion on an inner surface in the through-hole thereof. A protecting material is applied onto the metal layer in the through-hole, an unwanted section of the first portion of the metal layer is removed. Electrical traces in each of the conductive layers are formed.

Abstract translation: 本发明涉及印刷电路板的制造方法。 提供了一种在基底的两个相对表面上包括基底和两个导电层的基底。 在基板中限定穿过基底和导电层的通孔。 在基板上形成金属层。 金属层在基板的外表面上具有第一部分，在其通孔的内表面上具有第二部分。 将保护材料施加到通孔中的金属层上，去除金属层的第一部分的不希望的部分。 形成每个导电层中的电迹线。

公开(公告)号：US20090039895A1

公开(公告)日：2009-02-12

申请号：US12143632

申请日：2008-06-20

Applicant: Li Xiao ,  I-Hsien Chiang ,  Chih-Yi Tu

Inventor： Li Xiao ,  I-Hsien Chiang ,  Chih-Yi Tu

IPC: G01R31/04

CPC classification number: G01R31/2812

Abstract: A method of detecting faulty via holes of a printed circuit board. The printed circuit board including a number of electric trace segments. The method includes steps of: providing a testing system, the testing system comprising a processor, a storing means and a resistance measuring device, the storing means for storing a function Ymin=fmin(X) wherein X represents a reference resistance associated with a given electric trace segment, Ymin represents a minimum threshold value; measuring a resistance of an electric trace segment of a to-be-tested printed circuit board using the resistance measuring device, a to-be-tested via hole located on the electric trace segment; and judging whether the to-be-tested via hole is a faulty via hole according to the following criteria: if |Xa−X|≧Ymin, the to-be-tested via hole is a faulty via hole, and if |Xa−X|

Abstract translation: 一种检测印刷电路板故障通孔的方法。 印刷电路板包括多个电迹线段。 该方法包括以下步骤：提供测试系统，所述测试系统包括处理器，存储装置和电阻测量装置，所述存储装置用于存储功能Ymin = fmin（X），其中X表示与给定的相关联的参考电阻 电迹线段，Ymin表示最小阈值; 使用电阻测量装置测量待测试印刷电路板的电迹线段的电阻，该电阻测量装置是位于电迹线段上的待测试通孔; 并且根据以下标准判断被测试的通孔是否是故障的通孔：如果| Xa-X |> = Ymin，待测试的通孔是故障的通孔，如果| Xa -X |

公开(公告)号：US20090039053A1

公开(公告)日：2009-02-12

申请号：US11964583

申请日：2007-12-26

Applicant: TSO-HUNG YEH ,  CHIH-LUNG HSIAO ,  HUNG-YI CHANG

Inventor： TSO-HUNG YEH ,  CHIH-LUNG HSIAO ,  HUNG-YI CHANG

IPC: H01B13/00

CPC classification number: H05K3/067 ,  H05K3/064 ,  H05K3/388 ,  H05K2201/0338 ,  H05K2203/1476

Abstract: An exemplary method for manufacturing a printed circuit board is provided. Firstly, a copper clad substrate comprising a base film, a copper layer and intermediate layer interposed between the base film and the copper layer is provided. The intermediate layer is comprised of nickel, chromium, or alloy of nickel and chromium. A patterned photoresist layer is formed on the copper layer with portions of the copper layer are exposed from the photoresist pattern layer. Exposed portions of the copper layer are removed using a copper etchant to form a number of electrical traces, thereby exposing portions of the intermediate layer from the patterned photoresist layer. Exposed portions of the intermediate layer are removed using a chromium-nickel etchant. The method can prevent a bottom of each of electrical traces from enlarging, thereby improving quality of printed circuit board.

Abstract translation: 提供了制造印刷电路板的示例性方法。 首先，提供包括基膜，铜层和介于基膜和铜层之间的中间层的铜包覆基板。 中间层由镍，铬或镍和铬的合金组成。 在铜层上形成图案化的光致抗蚀剂层，其中部分铜层从光致抗蚀剂图案层露出。 使用铜蚀刻剂去除铜层的暴露部分以形成多个电迹线，从而将中间层的部分暴露于图案化的光致抗蚀剂层。 使用铬 - 镍蚀刻剂去除中间层的暴露部分。 该方法可以防止每个电迹线的底部放大，从而提高印刷电路板的质量。

公开(公告)号：US20090032290A1

公开(公告)日：2009-02-05

申请号：US12135849

申请日：2008-06-09

Applicant: TSO-HUNG YEH ,  HUNG-YI CHANG ,  SHING-TZA LIOU

Inventor： TSO-HUNG YEH ,  HUNG-YI CHANG ,  SHING-TZA LIOU

IPC: H05K1/00 ,  B32B5/12

CPC classification number: H05K1/056 ,  B82Y10/00 ,  H05K1/0206 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10T428/24124 ,  Y10T428/24132

Abstract: A flexible printed circuit board base film for flexible printed circuit boards includes a sheet of flexible polymer matrix and a number of carbon nanotube bundles embedded in the polymer matrix. Each of the nanotubes bundles are spaced apart from each other. The flexible polymer matrix includes a first surface and a second surface. Due to the high thermal conductivity of carbon nanotubes, heat can be efficiently conducted from the first surface to the second surface of the flexible printed circuit board base film. The present invention also provides a flexible laminate made from the flexible printed circuit board base film and a flexible printed circuit boards made from the flexible laminate.

Abstract translation: 用于柔性印刷电路板的柔性印刷电路板基膜包括柔性聚合物基体片和嵌入聚合物基质中的多个碳纳米管束。 每个纳米管束彼此间隔开。 柔性聚合物基质包括第一表面和第二表面。 由于碳纳米管的高导热性，可以从柔性印刷电路板基膜的第一表面到第二表面有效地传导热量。 本发明还提供了由柔性印刷电路板基膜制成的柔性层压板和由柔性层压板制成的柔性印刷电路板。

公开(公告)号：US20090031561A1

公开(公告)日：2009-02-05

申请号：US11967004

申请日：2007-12-29

Applicant: Hsiao-Chun HUANG ,  Meng-Hung WU ,  Cheng-Hsien LIN

Inventor： Hsiao-Chun HUANG ,  Meng-Hung WU ,  Cheng-Hsien LIN

IPC: H05K3/02 ,  H05K3/26 ,  H05K3/36

CPC classification number: H05K3/4092 ,  H05K3/061 ,  H05K3/281 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2203/063 ,  H05K2203/308 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method for manufacturing a hollowed printed circuit board includes steps of: providing an electrically conductive layer; laminating a first dielectric layer having a first through opening defined therein on a first surface of the electrically conductive layer; forming a protecting layer on the first surface of the electrically conductive layer in the first opening; creating an electrically conductive pattern in the conductive layer; removing the protecting layer; and laminating a second dielectric layer having a second through opening defined therein on an opposite second surface of the electrically conductive layer in a manner that the first through opening is aligned with the second through opening, thereby a portion of the electrically conductive layer is exposed to exterior through the first through opening and the second through opening.

Abstract translation: 一种中空印刷电路板的制造方法，包括以下步骤：提供导电层; 层压具有限定在其中的第一通孔的第一电介质层在导电层的第一表面上; 在第一开口中的导电层的第一表面上形成保护层; 在导电层中形成导电图案; 去除保护层; 并且以使得所述第一通孔与所述第二通孔对准的方式层叠具有限定在其中的第二通孔的第二介电层，所述第二介电层在所述导电层的相对的第二表面上，从而一部分所述导电层暴露于 外部通过第一通孔和第二通孔。

公开(公告)号：US20090025582A1

公开(公告)日：2009-01-29

申请号：US11952964

申请日：2007-12-07

Applicant: TSO-HUNG YEH ,  CHIH-KANG YANG ,  HUNG-YI CHANG ,  CHIH-LUNG HSIAO

Inventor： TSO-HUNG YEH ,  CHIH-KANG YANG ,  HUNG-YI CHANG ,  CHIH-LUNG HSIAO

IPC: B41M1/12

CPC classification number: H05K3/28 ,  H05K3/1225 ,  H05K3/1233 ,  H05K2201/09236 ,  H05K2203/0139

Abstract: An exemplary screen printing method for printing a printed circuit board is provided. The printed circuit board includes a number of parallel electrical traces. In the method, firstly, a screen printing stencil is disposed on a side of the printed circuit board having the electrical traces and a squeegee is disposed on the screen printing stencil. Secondly, the squeegee is drawn across the screen printing stencil in a manner such that an angle between a blade of the squeegee and the electrical traces is in a range from 20 degrees to 70 degrees so as to print an ink on the printed circuit board. The method can improve quality of the printed circuit board.

Abstract translation: 提供了用于印刷印刷电路板的示例性丝网印刷方法。 印刷电路板包括多个平行的电迹线。 在该方法中，首先，在具有电迹线的印刷电路板的一侧设置丝网印刷模版，并且在丝网印刷模版上设置刮板。 其次，将刮板沿着丝网印刷模板拉伸，使得刮板的刮刀和电迹线之间的角度在20度至70度的范围内，以便在印刷电路板上印刷油墨。 该方法可以提高印刷电路板的质量。

公开(公告)号：US20080285241A1

公开(公告)日：2008-11-20

申请号：US11960656

申请日：2007-12-19

Applicant: NING HOU ,  SHING-TZA LIOU

Inventor： NING HOU ,  SHING-TZA LIOU

IPC: H05K1/00 ,  H01R12/00

CPC classification number: H05K1/0281 ,  H05K2201/09263 ,  H05K2201/09781 ,  H05K2201/09909 ,  H05K2201/2009

Abstract: A flexible printed circuit board includes a flexible base, a working trace region, and at least one reinforcement trace. The working trace region and the at least one reinforcement trace are formed on the flexible base. The working trace is formed by a number of working traces. In the flexible base, the at least one reinforcement trace is disposed at a periphery of the working trace region.

Abstract translation: 柔性印刷电路板包括柔性基座，工作迹线区域和至少一个加强迹线。 工作轨迹区域和至少一个加强迹线形成在柔性基座上。 工作痕迹由多条工作痕迹组成。 在柔性基座中，至少一个加强迹线设置在工作轨迹区域的周边。

公开(公告)号：US20080266819A1

公开(公告)日：2008-10-30

申请号：US11847300

申请日：2007-08-29

Applicant: YING SU ,  WEI HUANG ,  I-HSIEN CHIANG

Inventor： YING SU ,  WEI HUANG ,  I-HSIEN CHIANG

IPC: H05K5/00

CPC classification number: H05K3/00 ,  H05K1/189 ,  H05K2203/0173 ,  H05K2203/085

Abstract: An exemplary mounting support for a flexible printed circuit board is provided. The flexible printed circuit board has a side surface and at least one electronic component mounted on the side surface. The mounting support includes a first surface for contacting with the side surface of the flexible printed circuit board and a second surface on an opposite side of the mounting support to the first surface. The mounting support has at least one first recess defined in the first surface for receiving the at least one electronic component therein and at least one through-hole defined through the first surface and the second surface. The mounting support has at least one second recess defined in the second surface. The mounting support can fix a double surface mounted flexible printed circuit board flatly, thereby enhancing laser processing precision.

Abstract translation: 提供了一种用于柔性印刷电路板的示例性安装支撑件。 柔性印刷电路板具有侧表面和安装在侧表面上的至少一个电子部件。 安装支撑件包括用于与柔性印刷电路板的侧表面接触的第一表面和与安装支撑件相对的第一表面到第一表面的第二表面。 安装支撑件具有限定在第一表面中的至少一个第一凹部，用于容纳至少一个电子部件和至少一个通过第一表面和第二表面限定的通孔。 安装支架具有限定在第二表面中的至少一个第二凹部。 安装支架可以平整地固定双面安装的柔性印刷电路板，从而提高激光加工精度。

公开(公告)号：US20080250637A1

公开(公告)日：2008-10-16

申请号：US11957324

申请日：2007-12-14

Applicant: JUN-QING ZHANG ,  CHIH-YI TU ,  SZU-MIN HUANG

Inventor： JUN-QING ZHANG ,  CHIH-YI TU ,  SZU-MIN HUANG

IPC: H01K3/10 ,  H05K1/11

CPC classification number: H05K3/4697 ,  H05K1/0393 ,  H05K3/4611 ,  H05K3/4635 ,  H05K2201/0394 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2203/061 ,  H05K2203/063 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method for manufacturing a multilayer FPCB includes the steps of: providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the first substrate, the binder layer and the second substrate; forming a second slit in the conductive layer of the first substrate, the second slit is configured to be aligned with the first slit, cutting the first substrate, the binder layer and the second substrate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.

Abstract translation: 一种制造多层FPCB的方法包括以下步骤：提供第一基板，第二基板和粘合剂层; 在粘合剂层上限定开口; 限定所述第一基板的介电层中的第一狭缝; 层压第一基板，粘合剂层和第二基板; 在所述第一基板的导电层中形成第二狭缝，所述第二狭缝被构造成与所述第一狭缝对准，切割所述第一基板，所述粘合剂层和所述第二基板，从而形成具有不同数量的多层柔性印刷电路板 不同领域的层次。