公开(公告)号：US20070136286A1

公开(公告)日：2007-06-14

申请号：US11556088

申请日：2006-11-02

Applicant: Steven Webster ,  Jonathan Duhig ,  Laurence Crew

Inventor： Steven Webster ,  Jonathan Duhig ,  Laurence Crew

IPC: G06F7/00

CPC classification number: G06F16/61 ,  G06F16/447 ,  G06F16/54 ,  G06F16/64 ,  G06F16/68

Abstract: Disclosed is a method of browsing a collection of sortable items (201) stored in a digital system. A plurality of grouping hierarchies (207, 217) are provided, each comprising a sort order and zero or more grouping levels (204-206, 214-216) forming groups with which the items are associable. At least one grouping hierarchy comprises a sort order and at least one grouping level. One item (203) in the collection is set to be a focus item (208, 218) thereby establishing a current focus group (209, 219) of a current grouping hierarchy. The focus item is then maintained upon selection of a new grouping hierarchy (210-220) from one of the plurality. A displaying of the collection of items may be performed by arranging the items in a list sorted according to one sort order of a plurality of sort orders associable with the items. The plurality of grouping hierarchies may then be used, each grouping hierarchy corresponding to one of the sort orders, wherein each level of each grouping hierarchy is associable with at least one level of each other grouping hierarchy. At least part of the collection is the displayed based upon the one sort order of items represented and the corresponding one grouping hierarchy.

Abstract translation: 公开了一种浏览存储在数字系统中的可排序项目（201）的集合的方法。 提供了多个分组层次（207,217），每个分组层次（207,217）包括排序顺序和零个或更多个分组级别（204- 206,214-216），其形成与所述项目可关联的组。 至少一个分组层次结构包括排序顺序和至少一个分组级别。 集合中的一个项目（203）被设置为焦点项目（208,218），从而建立当前分组层次结构的当前焦点组（209,219）。 然后，从多个中的一个选择新的分组层次结构（210-220）来维护焦点项。 项目集合的显示可以通过将项目排列在根据与项目相关联的多个排序顺序的一种排序顺序排列的列表中来执行。 然后可以使用多个分组层次，每个分组层级对应于排序顺序中的一个，其中每个分组层次结构的每个级别可与每个其他分组层次结构的至少一个级别相关联。 集合的至少一部分是基于所表示的项目的一个排序顺序和相应的一个分组层次来显示的。

公开(公告)号：US20070126081A1

公开(公告)日：2007-06-07

申请号：US11525447

申请日：2006-09-22

Applicant: Steven Webster ,  Ying-Cheng Wu

Inventor： Steven Webster ,  Ying-Cheng Wu

IPC: H01L27/082

CPC classification number: H01L27/14618 ,  H01L24/73 ,  H01L27/14625 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15153 ,  H01L2924/15311 ,  H04N5/2257 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A digital camera module (200) includes a carrier (20), an image sensor chip (30), a number of wires (50), a holder (60), and a lens module (70). The carrier includes a base (21) and a leadframe (23) embedded in the base. The base includes a board (211), a sidewall (213) and a cavity (24). The leadframe includes a number of conductive leads (233) spaced from each other. Each lead has a first terminal portion (235), a second terminal portion (236), and an interconnecting portion (237) connecting the first and second terminal portions. The chip is mounted on the carrier, and has an active area (301). The wires electrically connect the chip and the leadframe. The holder is mounted to the carrier to close the cavity. The lens module is received in the holder and guides light to the active area of the chip.

Abstract translation: 数字照相机模块（200）包括载体（20），图像传感器芯片（30），多个电线（50），保持器（60）和透镜模块（70）。 载体包括嵌入基座中的基座（21）和引线框架（23）。 基座包括板（211），侧壁（213）和空腔（24）。 引线框架包括彼此间隔开的多个导电引线（233）。 每个引线具有连接第一和第二端子部分的第一端子部分（235），第二端子部分（236）和互连部分（237）。 芯片安装在载体上，并具有有效区域（301）。 导线将芯片和引线框架电连接。 保持器安装到载体以封闭空腔。 透镜模块被容纳在保持器中并将光引导到芯片的有效区域。

公开(公告)号：US20060097405A1

公开(公告)日：2006-05-11

申请号：US11262907

申请日：2005-10-31

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

IPC: H01L23/48 ,  H01L23/52 ,  H01L23/12

CPC classification number: H01L23/055 ,  H01L23/10 ,  H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An IC (integrated circuit) chip package includes a substrate (2), a chip (3), a plurality of bonding wires (32), and a cover (5). The substrate has a top surface, a bottom surface, a receiving chamber (23) defined therein, a plurality of solder pads (24) arranged around the top surface and the bottom surface, and a plurality of vias (25) having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate to cover the opening, and has a smaller profile than that of the substrate, thereby not cover a peripheral area of the top surface.

Abstract translation: IC（集成电路）芯片封装包括基板（2），芯片（3），多个接合线（32）和盖（5）。 衬底具有顶表面，底表面，限定在其中的接收室（23），围绕顶表面和底表面布置的多个焊盘（24），以及多个通孔（25），其具有导电材料 将顶部焊盘与其中限定的底部焊盘连接。 芯片安装在接收室中，并且具有围绕其顶表面布置的多个芯片焊盘。 接合线分别将衬底的顶部焊盘与芯片焊盘电连接。 盖被固定到基板的顶表面以覆盖开口，并且具有比基板更小的轮廓，从而不覆盖顶表面的周边区域。

公开(公告)号：US06946316B2

公开(公告)日：2005-09-20

申请号：US10286269

申请日：2002-10-31

Applicant: Thomas P. Glenn ,  Steven Webster

Inventor： Thomas P. Glenn ,  Steven Webster

IPC: B29C43/36 ,  H01L21/00 ,  H01L23/02

CPC classification number: H01L27/14625 ,  B29C33/0022 ,  B29C43/36 ,  B29C2043/023 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.

Abstract translation: 图像传感器封装包括具有锁定特征的模制件。 该包装还包括具有突片的卡扣盖，其中突片附接到模制件的锁定特征。 为了形成图像传感器封装，将窗口放置在模制品的口袋中。 卡扣盖固定就位。 一旦固定，卡扣盖压靠窗口外表面的周边区域。 窗口夹在模制件和卡扣盖之间并保持就位。

公开(公告)号：US06869861B1

公开(公告)日：2005-03-22

申请号：US09803083

申请日：2001-03-08

Applicant: Thomas P. Glenn ,  Roy Dale Hollaway ,  Steven Webster

Inventor： Thomas P. Glenn ,  Roy Dale Hollaway ,  Steven Webster

IPC: H01L21/301 ,  H01L21/68 ,  H01L21/78 ,  H01L23/544

CPC classification number: H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A wafer includes a vertical scribe line and a horizontal scribe line on a front-side surface of the wafer. An intersection of the vertical scribe line and the horizontal scribe line is optically recognized through a wafer support attached to the front-side surface of the wafer. The wafer is drilled all the way through at the intersection to form a back-side alignment mark on a back-side surface of said wafer. The back-side alignment mark is used to aligning a saw, which singulates the wafer from the back-side surface.

Abstract translation: 晶片包括在晶片的前侧表面上的垂直划线和水平划线。 垂直划线和水平划线的交叉点通过附着在晶片的前侧表面的晶片支架而被光学识别。 晶圆在相交处一直穿过，在所述晶片的背面形成背面对准标记。 背面对准标记用于对准从后侧表面对晶片进行单片化的锯。

公开(公告)号：US06791076B2

公开(公告)日：2004-09-14

申请号：US10286589

申请日：2002-10-31

Applicant: Steven Webster

Inventor： Steven Webster

IPC: H01J502

CPC classification number: H01L27/14627 ,  G02B7/02 ,  G02B7/022 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L27/14683 ,  H01L27/14685 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02325 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H04N5/2251 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  Y10T29/49002 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.

Abstract translation: 图像传感器封装包括图像传感器，窗口和模制件，其中模制件包括从窗户向上延伸的透镜保持器延伸部分。 透镜保持器延伸部分包括从窗口延伸的阴螺纹孔，使得窗口通过孔露出。 透镜支撑在螺纹透镜支架中。 带螺纹的透镜支撑件被拧入透镜保持器延伸部分的孔中。 通过旋转透镜支架，相对于图像传感器容易地调节透镜。

公开(公告)号：US06686588B1

公开(公告)日：2004-02-03

申请号：US09764165

申请日：2001-01-16

Applicant: Steven Webster ,  Thomas P. Glenn ,  Roy Dale Hollaway

Inventor： Steven Webster ,  Thomas P. Glenn ,  Roy Dale Hollaway

IPC: H01J502

CPC classification number: H01L27/14618 ,  H01L24/97 ,  H01L27/14625 ,  H01L27/14634 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83

Abstract: An optical module includes a lens housing and a substrate having a base and a sidewall. An image sensor is mounted to the base. The sidewall includes a joint surface and the lens housing includes a mounting surface. The mounting surface of the lens housing is bonded to the joint surface of the substrate thus mounting the lens housing to the sidewall. To minimize the overall width of the optical module and to maximize the strength of the bond between the lens housing and the substrate, the mounting surface of the lens housing is formed with a locking feature. The locking feature includes a horizontal surface bonded to the joint surface and a vertical surface bonded to an interior surface of the sidewall.

Abstract translation: 光学模块包括透镜壳体和具有基底和侧壁的基底。 图像传感器安装在基座上。 侧壁包括接合表面，并且透镜壳体包括安装表面。 透镜壳体的安装表面结合到基板的接合表面，从而将透镜壳体安装到侧壁上。 为了最小化光学模块的总宽度并且最大化透镜壳体和衬底之间的结合的强度，透镜壳体的安装表面形成有锁定特征。 锁定特征包括结合到接合表面的水平表面和结合到侧壁的内表面的垂直表面。

公开(公告)号：US06629633B1

公开(公告)日：2003-10-07

申请号：US09711994

申请日：2000-11-13

Applicant: Thomas P. Glenn ,  Steven Webster ,  Markus K. Liebhard

Inventor： Thomas P. Glenn ,  Steven Webster ,  Markus K. Liebhard

IPC: B22K3102

CPC classification number: H01L27/1469 ,  H01L24/94 ,  H01L27/14618 ,  H01L27/14634 ,  H01L2224/48091 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

Abstract: To form an image sensor package, a window is mounted above an active area on an upper surface of an image sensor. The image sensor further includes a plurality of bond pads on the upper surface. Interior traces on a lower surface of a step up ring are aligned with the bond pads on the upper surface of the image sensor. Bumps are formed between the interior traces and the bond pads thus flip chip mounting the step up ring to the image sensor. The step up ring is mounted such that the window is located in or adjacent a central aperture of the step up ring. An underfill material is applied into the central aperture. The underfill material flows from the central aperture between the lower surface of the step up ring and the upper surface of the image sensor. The underfill material encloses the bumps. The underfill material is cured, if necessary, to form a package body. The package body enhances the reliability of the image sensor package by preventing the failure of the bumps and preventing the associated dismounting of the step up ring.

Abstract translation: 为了形成图像传感器封装，将窗口安装在图像传感器的上表面上的有效区域上方。 图像传感器还包括在上表面上的多个接合焊盘。 升降环的下表面上的内部迹线与图像传感器的上表面上的接合焊盘对准。 在内部迹线和接合焊盘之间形成凸起，因此倒装芯片将升压环安装到图像传感器。 安装升降环使得窗口位于或靠近升压环的中心孔。 将底部填充材料施加到中心孔中。 底部填充材料从升压环的下表面和图像传感器的上表面之间的中心孔流出。 底部填充材料包住凸块。 如果需要，底部填充材料被固化以形成包装体。 封装体通过防止凸块的故障并防止相关的升压环的拆卸来增强图像传感器封装的可靠性。

公开(公告)号：US06580167B1

公开(公告)日：2003-06-17

申请号：US09839284

申请日：2001-04-20

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H01L2334

CPC classification number: H01L23/552 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/40225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15173 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2224/37099

Abstract: An RF shielded package includes a heat sink having a plurality of spring elements. The spring elements press the heat sink against a mold half during encapsulation to prevent encapsulant from leaking between the heat sink and the mold half. Further, the spring elements ground the heat sink to shield an electronic component from RF radiation.

Abstract translation: RF屏蔽封装包括具有多个弹簧元件的散热器。 弹簧元件在封装期间将散热器压在半模上，以防止密封剂在散热器和半模之间泄漏。 此外，弹簧元件将散热器接地以将电子部件与RF辐射屏蔽。

公开(公告)号：US06571466B1

公开(公告)日：2003-06-03

申请号：US09536830

申请日：2000-03-27

Applicant: Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

Inventor： Thomas P. Glenn ,  Steven Webster ,  Roy Dale Hollaway

IPC: H05K330

CPC classification number: H01L27/14618 ,  H01L24/97 ,  H01L31/0203 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/15151 ,  H01L2924/15153 ,  Y10T29/49133 ,  Y10T29/49139 ,  Y10T29/49146 ,  H01L2224/81

Abstract: A method of fabricating a flip chip image sensor package includes forming an aperture in a substrate and mounting an image sensor to the substrate. The image sensor is mounted such that an active area of the image sensor is aligned with the aperture. A bead is formed around a periphery of the image sensor. An aperture side of the aperture, the image sensor, and the bead define a pocket. The method further includes filling the pocket with a transparent liquid encapsulant and hardening the transparent liquid encapsulant. The hardened transparent liquid encapsulant serves as the window for the flip chip image sensor package.

Abstract translation: 制造倒装芯片图像传感器封装的方法包括在衬底中形成孔并将图像传感器安装到衬底。 图像传感器被安装成使得图像传感器的有效区域与孔径对准。 围绕图像传感器的周边形成珠。 光圈的光圈侧，图像传感器和光圈限定了一个口袋。 该方法还包括用透明液体密封剂填充袋，并硬化透明液体密封剂。 硬化的透明液体密封剂用作倒装芯片图像传感器封装的窗口。