公开(公告)号：US20050194666A1

公开(公告)日：2005-09-08

申请号：US11112107

申请日：2005-04-21

申请人： Chien Huang ,  Yu-Po Wang ,  Chih-Ming Huang

发明人： Chien Huang ,  Yu-Po Wang ,  Chih-Ming Huang

IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L23/495

CPC分类号： H01L21/4857 ,  H01L21/4832 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3121 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/05554 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of the openings. A first copper layer and a second copper layer are in turn deposited over the dielectric material layer and solder materials, and the first and second copper layers are patterned to form a plurality of conductive traces each of which has a terminal coated with a metal layer. A chip is mounted on the conductive traces and electrically connected to the terminals by bonding wires, with the dielectric material layer and solder materials being exposed to the outside. This package structure can flexibly arrange the conductive traces and effectively shorten the bonding wires, thereby improve trace routability and quality of electrical connection for the semiconductor package.

公开(公告)号：US08618641B2

公开(公告)日：2013-12-31

申请号：US12228379

申请日：2008-08-11

申请人： Chang-Yueh Chan ,  Chih-Ming Huang ,  Chun-Yuan Li ,  Chih-Hsin Lai

发明人： Chang-Yueh Chan ,  Chih-Ming Huang ,  Chun-Yuan Li ,  Chih-Hsin Lai

IPC分类号： H01L23/495

CPC分类号： H01L24/89 ,  H01L21/561 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A semiconductor package and a method for fabricating the same are provided. A leadframe including a die pad and a plurality of peripheral leads is provided. A carrier, having a plurality of connecting pads formed thereon, is attached to the die pad, wherein a planar size of the carrier is greater than that of the die pad, allowing the connecting pads on the carrier to be exposed from the die pad. At least a semiconductor chip is attached to a side of an assembly including the die pad and the carrier, and is electrically connected to the connecting pads of the carrier and the leads via bonding wires. A package encapsulant encapsulates the semiconductor chip, the bonding wires, a part of the carrier and a part of the leadframe, allowing a bottom surface of the carrier and a part of the leads to be exposed from the package encapsulant.

摘要翻译： 提供半导体封装及其制造方法。 提供了包括管芯焊盘和多个外围引线的引线框架。 具有形成在其上的多个连接焊盘的载体被附接到管芯焊盘，其中载体的平面尺寸大于管芯焊盘的平面尺寸，允许载体上的连接焊盘从裸片焊盘露出。 至少一个半导体芯片附着到包括芯片焊盘和载体的组件的一侧，并通过接合线电连接到载体和引线的连接焊盘。 封装密​​封剂封装半导体芯片，接合线，载体的一部分和引线框架的一部分，允许载体的底表面和引线的一部分从封装密封剂暴露。

公开(公告)号：US20110177643A1

公开(公告)日：2011-07-21

申请号：US12769087

申请日：2010-04-28

申请人： Chi-Hsin Chiu ,  Chih-Ming Huang ,  Chang-Yueh Chan ,  Hsin-Yi Liao ,  Chun-Chi Ke

发明人： Chi-Hsin Chiu ,  Chih-Ming Huang ,  Chang-Yueh Chan ,  Hsin-Yi Liao ,  Chun-Chi Ke

IPC分类号： H01L21/56 ,  H01L21/60

CPC分类号： B81B7/0064 ,  B81B7/007 ,  B81B2207/095 ,  H01L21/56 ,  H01L23/315 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A fabrication method of a package structure having at least an MEMS element is provided, including: preparing a wafer having electrical connection pads and the at least an MEMS element; disposing lids for covering the at least an MEMS element, the lids having a metal layer formed thereon; electrically connecting the electrical connection pads and the metal layer with bonding wires; forming an encapsulant for covering the lids, bonding wires, electrical connection pads and metal layer; removing portions of the encapsulant to separate the bonding wires each into first and second sub-bonding wires, wherein top ends of the first and second sub-bonding wires are exposed, the first sub-bonding wires electrically connecting to the electrical connection pads, and the second sub-bonding wires electrically connecting to the metal layer; forming metallic traces on the encapsulant for electrically connecting to the first sub-bonding wires; forming bumps on the metallic traces; and performing a singulation process.

摘要翻译： 提供具有至少MEMS元件的封装结构的制造方法，包括：制备具有电连接焊盘和所述至少MEMS元件的晶片; 设置用于覆盖所述至少一个MEMS元件的盖，所述盖具有在其上形成的金属层; 电连接焊盘和金属层与接合线; 形成用于覆盖盖子，接合线，电连接垫和金属层的密封剂; 去除所述密封剂的部分以将所述接合线分别分离成第一和第二子接合线，其中所述第一和第二次接合线的顶端被暴露，所述第一子接合线电连接到所述电连接焊盘，以及 所述第二子接合线电连接到所述金属层; 在所述密封剂上形成用于电连接到所述第一子接合线的金属迹线; 在金属痕迹上形成凸块; 并执行单独处理。

公开(公告)号：US20110175179A1

公开(公告)日：2011-07-21

申请号：US12769993

申请日：2010-04-29

申请人： Chi-Hsin Chiu ,  Chih-Ming Huang ,  Chang-Yueh Chan ,  Hsin-Yi Liao ,  Chun-Chi Ke

发明人： Chi-Hsin Chiu ,  Chih-Ming Huang ,  Chang-Yueh Chan ,  Hsin-Yi Liao ,  Chun-Chi Ke

IPC分类号： H01L29/84 ,  H01L23/52

CPC分类号： B81B7/0064 ,  B81B7/007 ,  B81B2207/095 ,  H01L21/56 ,  H01L23/315 ,  H01L23/552 ,  H01L24/48 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package structure having at least an MEMS element is provided, including a chip having electrical connecting pads and the MEMS element; a lid disposed on the chip to cover the MEMS element and having a metal layer provided thereon; first sub-bonding wires electrically connecting to the electrical connecting pads; second sub-bonding wires electrically connecting to the metal layer; an encapsulant disposed on the chip, wherein the top ends of the first and second sub-bonding wires are exposed from the encapsulant; and metallic traces disposed on the encapsulant and electrically connecting to the first sub-bonding wires. The package structure advantageously features reduced size, relatively low costs, diverse bump locations, and an enhanced EMI shielding effect.

摘要翻译： 提供具有至少MEMS元件的封装结构，其包括具有电连接焊盘和MEMS元件的芯片; 设置在所述芯片上以覆盖所述MEMS元件并且具有设置在其上的金属层的盖; 电连接到电连接焊盘的第一子接合线; 电连接到金属层的第二子接合线; 设置在所述芯片上的密封剂，其中所述第一和第二子接合线的顶端从所述密封剂露出; 以及设置在密封剂上并电连接到第一子接合线的金属迹线。 封装结构有利地具有减小的尺寸，相对低的成本，不同的凸起位置和增强的EMI屏蔽效果。

公开(公告)号：US20090103913A1

公开(公告)日：2009-04-23

申请号：US11874934

申请日：2007-10-19

申请人： Chih-Ming Huang

发明人： Chih-Ming Huang

IPC分类号： G03B17/00

CPC分类号： G03B17/00

摘要： A multifunctional supporting frame for a web camera, comprises a movable supporting clamping seat having a hollow rectangular receiving chamber; the rectangular receiving chamber being formed by an upper L shape sheet, a middle U shape sheet, and a lower enclosed rectangular sheet; one lateral side of the L shape sheet being extended with a sheet plate; at least one guide post being extended from one surface of the sheet plate; the guide posts being combined with springs so as to be formed as a telescopic structure which is adjustable to have a desire width for clamping an object; and a bendable shaft seat formed by an upper U shape plate and a lower U shape plate which are pivotally engaged. A lens set is installed above the movable supporting clamping seat by using a lens set pin seat.

摘要翻译： 一种用于网络摄像机的多功能支撑框架，包括具有中空矩形接收室的可移动支撑夹座; 矩形容纳室由上部L形片，中部U形片和下部封闭矩形片形成; L形片的一个侧面用片状板延伸; 至少一个引导柱从所述板的一个表面延伸; 引导柱与弹簧组合，以形成可伸缩结构，其可调节以具有用于夹紧物体的期望宽度; 以及由上U形板和下U形板形成的可枢转地接合的可弯曲的轴座。 通过使用镜头组座座将透镜组安装在可动支撑夹座上方。

公开(公告)号：US06963135B2

公开(公告)日：2005-11-08

申请号：US10816339

申请日：2004-03-31

申请人： Cheng-Chian Chiang ,  Chih-Ming Huang ,  Chin-Huang Chang ,  Cheng-Hsu Hsiao ,  Min-Nan Tsai

发明人： Cheng-Chian Chiang ,  Chih-Ming Huang ,  Chin-Huang Chang ,  Cheng-Hsu Hsiao ,  Min-Nan Tsai

IPC分类号： G11C5/04 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H01L23/34

CPC分类号： H01L23/3121 ,  G11C5/04 ,  H01L23/5388 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor package includes two substrates each having a plurality of electrical connection pads, at least one chip mounted on each of the substrates, an encapsulation body formed on each of the substrates for encapsulating the chip, and an cover for receiving the substrates and the chips therein. The chip is electrically connected to the electrical connection pads. The electrical connection pads are exposed from the cover and located on the same surface or oppositely arranged. The substrates and the cover each substantially has a rectangular shape, with a longer side of each of the substrates being vertical to a longer side of the cover. The semiconductor package is incorporated with multiple chips to enhance the performance and memory capacity thereof, and the substrates are smaller than those in the prior art and thus are more cost-effective to fabricate.

摘要翻译： 半导体封装包括两个基板，每个基板具有多个电连接焊盘，安装在每个基板上的至少一个芯片，形成在每个基板上的封装体，用于封装芯片;以及盖，用于接收基板和芯片 其中。 芯片电连接到电连接焊盘。 电连接垫从盖子露出并位于相同的表面上或相对布置。 基板和盖子基本上具有矩形形状，每个基板的较长边与盖的较长边垂直。 半导体封装结合有多个芯片以提高其性能和存储器容量，并且衬底小于现有技术中的衬底，因此制造更具成本效益。

公开(公告)号：USD493799S1

公开(公告)日：2004-08-03

申请号：US29195995

申请日：2003-12-18

申请人： Cheng-Chia Chiang ,  Chih-Ming Huang ,  Chin-Huang Chang ,  Cheng-Hsu Hsiao ,  Min-Nan Tsai

设计人： Cheng-Chia Chiang ,  Chih-Ming Huang ,  Chin-Huang Chang ,  Cheng-Hsu Hsiao ,  Min-Nan Tsai

公开(公告)号：US06380587B1

公开(公告)日：2002-04-30

申请号：US09706527

申请日：2000-11-03

申请人： Shing-Ren Sheu ,  Chung-Hsien Wu ,  Chih-Ming Huang

发明人： Shing-Ren Sheu ,  Chung-Hsien Wu ,  Chih-Ming Huang

IPC分类号： H01L2976

CPC分类号： H01L27/1126 ,  H01L27/105 ,  H01L27/11293

摘要： A semiconductor read-only memory (ROM) and a method of fabricating the same are provided. The ROM device is structured in such a manner that allows the fabrication to include a fewer number of mask processes. This makes it more cost effective and allows a cycle time that is shorter than that of the prior art. Moreover, the particular structure of the ROM device makes punchthrough less likely to occur between any neighboring pairs of the buried bit lines when the ROM device is further scaled down. The ROM device is constructed on a semiconductor substrate which is partitioned into a peripheral region and a cell region. A plurality of STI structures are formed at predefined locations in both the peripheral region and the cell region. Immediately after this, a first ion-implantation process can be performed on the cell region to form a plurality of buried bit lines. Subsequently, the dielectric isolation layers in all of the STI structures in the cell region are removed, leaving a plurality of empty trenches behind. A conformal insulating layer and a conductive layer are then successively formed over the wafer, and the conductive layer is further selectively removed to form a word line in the cell region and a gate in the peripheral region. In the code implantation process, selected channel regions between the buried bit lines are doped with impurities for code implantation of data into the ROM device.

公开(公告)号：US08241059B2

公开(公告)日：2012-08-14

申请号：US12792910

申请日：2010-06-03

申请人： Wei-Chao Huang ,  Chih-Ming Huang

发明人： Wei-Chao Huang ,  Chih-Ming Huang

IPC分类号： H01R13/621

CPC分类号： H01R12/7047

摘要： A connector and printed circuit board assembly includes a printed circuit board, a connector fixed on the printed circuit board, and a fixing board fixed on the connector, the fixing board defining a through hole, a connecting member fixed on the printed circuit board adjacent to the connector, a threaded retainer, and a threaded post securely connected with the connecting member. The threaded post passes through the through hole and seats the threaded retainer to lock the connector onto the printed circuit board.

摘要翻译： 连接器和印刷电路板组件包括印刷电路板，固定在印刷电路板上的连接器和固定在连接器上的固定板，固定板限定通孔，固定在印刷电路板上的连接件 连接器，螺纹保持器和与连接构件牢固连接的螺纹柱。 螺纹柱穿过通孔并安装螺纹固定器以将连接器锁定到印刷电路板上。

公开(公告)号：US07667421B2

公开(公告)日：2010-02-23

申请号：US11861838

申请日：2007-09-26

申请人： Chih-Ming Huang

发明人： Chih-Ming Huang

IPC分类号： H02P7/00

CPC分类号： H02P6/08 ,  H02P6/14

摘要： A torque compensation method and system for a DC brushless motor. When the DC brushless motor coupled with an asymmetric load is rotating, the difference between an instant current and an average current of a shunt resister is an index of adjusting control signals within an absolute rotor position for the purpose of approaching the corresponding instant current to the average current.

摘要翻译： 一种用于直流无刷电机的转矩补偿方法和系统。 当与非对称负载耦合的DC无刷电动机旋转时，分流电阻器的瞬时电流和平均电流之间的差异是在绝对转子位置内调整控制信号的指标，以便接近对应于瞬时电流 平均电流。