公开(公告)号：US20050052851A1

公开(公告)日：2005-03-10

申请号：US10902024

申请日：2004-07-30

申请人： Nobuaki Yamada ,  Kazunari Suzuki ,  Bunshi Kuratomi ,  Hiroaki Tanaka ,  Akira Onozawa

发明人： Nobuaki Yamada ,  Kazunari Suzuki ,  Bunshi Kuratomi ,  Hiroaki Tanaka ,  Akira Onozawa

IPC分类号： B42D15/10 ,  G06K19/077 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/02 ,  H04B1/38 ,  H04M1/00 ,  H05K1/14

CPC分类号： G06K19/07745 ,  G06K19/077 ,  G06K19/07718 ,  G06K19/07724 ,  G06K19/07733 ,  G06K19/07743 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/19041 ,  H01L2924/00014 ,  H01L2924/00

摘要： A multi-function structure of a plug-in universal IC card is to be promoted and the manufacturing cost is to be reduced. The body of the plug-in UICC is constructed of a molding resin. A tape substrate and a chip mounted on one side of the tape substrate are sealed in the interior of the molding resin. A side opposite to the chip mounting side of the tape substrate is exposed to the exterior of the molding resin and constitutes a surface portion of the plug-in UICC. Contact patterns serving as external terminals of the plug-in UICC are formed on the surface of the tape substrate exposed to the exterior of the molding resin. In the plug-in UICC whose body is constructed of molding resin, cracking of the chip can be prevented effectively even in the case where the chip is large-sized.

摘要翻译： 推动插入式通用IC卡的多功能结构，降低制造成本。 插件UICC的主体由模制树脂构成。 胶带基板和安装在带基材一侧的芯片被密封在模塑树脂的内部。 与带基片的芯片安装侧相对的一侧暴露于模制树脂的外部，构成插件UICC的表面部分。 作为插件UICC的外部端子的接触图案形成在暴露于成型树脂的外部的带基材的表面上。 在其主体由模制树脂构成的插件UICC中，即使在芯片尺寸较大的情况下也可以有效地防止芯片的开裂。

公开(公告)号：US06723020B2

公开(公告)日：2004-04-20

申请号：US10152355

申请日：2002-05-22

申请人： Kouji Ohbayashi ,  Kazunari Suzuki ,  Yoshihisa Yamamoto ,  Kengo Nomura

发明人： Kouji Ohbayashi ,  Kazunari Suzuki ,  Yoshihisa Yamamoto ,  Kengo Nomura

IPC分类号： F16H5708

CPC分类号： C21D1/10 ,  C21D9/0068 ,  C21D9/32 ,  F16H57/082 ,  Y02P10/253

摘要： A planetary carrier supports pinion gears of a planetary gear set via pinion shafts. Each hole in which a pinion shaft is mounted has a shallow hardened wall surface that is hardened by very-high-frequency induction heating and quenching. Therefore, the durability of the pinion shaft-supporting holes of a cold-forged piece or a pressed piece can be improved without thermal strain.

摘要翻译： 行星齿轮架通过小齿轮轴支撑行星齿轮组的小齿轮。 安装有小齿轮轴的每个孔都具有通过非常高频感应加热和淬火而硬化的浅硬化壁面。 因此，可以在没有热应变的情况下改善冷锻件或压制件的小齿轮轴支撑孔的耐久性。

公开(公告)号：US06441400B1

公开(公告)日：2002-08-27

申请号：US10051077

申请日：2002-01-22

申请人： Yoshinori Miyaki ,  Kazunari Suzuki ,  Daisuke Omoda

发明人： Yoshinori Miyaki ,  Kazunari Suzuki ,  Daisuke Omoda

IPC分类号： H01L31112

CPC分类号： H01L24/32 ,  H01L21/565 ,  H01L23/49503 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/00012

摘要： A semiconductor device includes a semiconductor chip having a plurality of electrodes formed on a first major surface thereof, a resin package sealing the semiconductor chip therein, a plurality of leads electrically connected to the electrodes of the semiconductor chip and formed so as to extend inside and outside the resin package, and a support lead supporting the semiconductor chip at a part of a second major surface of the semiconductor chip opposite the first major surface. The semiconductor chip is bonded to the support lead with an adhesive tape.

摘要翻译： 一种半导体器件包括：半导体芯片，其具有形成在其第一主表面上的多个电极;密封其中的半导体芯片的树脂封装;电连接到半导体芯片的电极并形成为在内部延伸的多个引线; 以及在半导体芯片的与第一主表面相对的第二主表面的一部分处支撑半导体芯片的支撑引线。 半导体芯片用胶带粘合到支撑引线上。

公开(公告)号：US5869888A

公开(公告)日：1999-02-09

申请号：US721339

申请日：1996-09-26

申请人： Kunihiro Tsubosaki ,  Michio Tanimoto ,  Kunihiko Nishi ,  Masahiro Ichitani ,  Shunji Koike ,  Kazunari Suzuki ,  Ryosuke Kimoto ,  Ichiro Anjoh ,  Taisei Jin ,  Akihiko Iwaya ,  Gen Murakami ,  Masamichi Ishihara ,  Junichi Arita

发明人： Kunihiro Tsubosaki ,  Michio Tanimoto ,  Kunihiko Nishi ,  Masahiro Ichitani ,  Shunji Koike ,  Kazunari Suzuki ,  Ryosuke Kimoto ,  Ichiro Anjoh ,  Taisei Jin ,  Akihiko Iwaya ,  Gen Murakami ,  Masamichi Ishihara ,  Junichi Arita

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L25/10 ,  H01L23/48

CPC分类号： H01L24/06 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/4951 ,  H01L24/05 ,  H01L24/49 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48724 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/73215 ,  H01L2224/85424 ,  H01L2225/1029 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/1305 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T29/49121

摘要： A semiconductor device having inner leads secured via insulating adhesive films to the principal surface of a semiconductor chip and electrically connected to the respective external terminals of the semiconductor chip. The semiconductor device that can be about the size of the chip is so configured that an outer lead is continuously extended from each inner lead up to the rear surface opposite to the principal surface of the semiconductor chip in order to hold the leads and an external device in conduction.

摘要翻译： 一种半导体器件，其具有通过绝缘粘合剂膜固定到半导体芯片的主表面并与半导体芯片的各个外部端子电连接的内部引线。 可以关于芯片尺寸的半导体器件被配置为使得外引线从每个内引线连续地延伸到与半导体芯片的主表面相对的后表面，以便保持引线和外部器件 导通。

公开(公告)号：US5637913A

公开(公告)日：1997-06-10

申请号：US311021

申请日：1994-09-22

申请人： Yujiro Kajihara ,  Kazunari Suzuki ,  Kunihiro Tsubosaki ,  Hiromichi Suzuki ,  Yoshinori Miyaki ,  Takahiro Naito ,  Sueo Kawai

发明人： Yujiro Kajihara ,  Kazunari Suzuki ,  Kunihiro Tsubosaki ,  Hiromichi Suzuki ,  Yoshinori Miyaki ,  Takahiro Naito ,  Sueo Kawai

IPC分类号： H01L23/50 ,  H01L21/48 ,  H01L21/52 ,  H01L21/60 ,  H01L23/495 ,  H01L23/48

CPC分类号： H01L24/743 ,  H01L21/4842 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/02166 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/82181 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/85181 ,  H01L2224/859 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  Y10T29/49121

摘要： In order to improve the package body cracking resistance of an LSI package at the reflow soldering and to provide both a leadframe suitable for fabricating the LSI package according to the flexible manufacturing system and an LSI using the leadframe, the adhered area between a semiconductor chip 2 and a resin is enlarged by making the external size of a die pad 3 smaller than that of the semiconductor chip to be mounted thereon. Moreover, a variety of semiconductor chips 2 having different external sizes can be mounted on the die pad 3 by cutting the leading ends of leads 5 to a suitable length in accordance with the external sizes of the semiconductor chips 2.

摘要翻译： 为了提高回流焊时的LSI封装的封装体抗开裂性，并且提供适用于制造根据柔性制造系统的LSI封装的引线框和使用引线框的LSI，半导体芯片2 并且通过使管芯焊盘3的外部尺寸小于要安装在其上的半导体芯片的外部尺寸来扩大树脂。 此外，通过根据半导体芯片2的外部尺寸将引线5的前端切割成合适的长度，可以将不同的外部尺寸的各种半导体芯片2安装在管芯焊盘3上。

公开(公告)号：US5283892A

公开(公告)日：1994-02-01

申请号：US395016

申请日：1989-08-17

申请人： Keiichi Nakane ,  Kazunari Suzuki ,  Toshio Kushida ,  Junichi Seki ,  Hiroshi Kodaka ,  Tadashi Kuwabara

发明人： Keiichi Nakane ,  Kazunari Suzuki ,  Toshio Kushida ,  Junichi Seki ,  Hiroshi Kodaka ,  Tadashi Kuwabara

IPC分类号： G06F9/44 ,  G06F11/32 ,  G06F9/40

CPC分类号： G06F9/44 ,  G06F11/32

摘要： A method and apparatus for file operation comprise a file operation method which enters, prior to the file operation, processing methods for exceptional events which are expected to occur during the file operation, a file operation method which, at the occurrence of an exceptional event during a file operation, holds the file operation, saves information pertinent to the held file into a memory, and inquires the user of the processing method of the held file for the exceptional event, and a file operation method which displays a list of hierarchically organized files at multiple levels so that multiple files can be designated as objects of operations.

摘要翻译： 用于文件操作的方法和装置包括文件操作方法，该文件操作方法在文件操作之前输入预期在文件操作期间发生的异常事件的处理方法，文件操作方法，在发生异常事件期间， 文件操作，保存文件操作，将与保持的文件相关的信息保存到存储器中，并向用户询问用于异常事件的保持文件的处理方法，以及显示分层组织文件列表的文件操作方法 在多个级别，以便可以将多个文件指定为操作对象。

公开(公告)号：US4954818A

公开(公告)日：1990-09-04

申请号：US920425

申请日：1986-10-20

申请人： Keiichi Nakane ,  Tadashi Kuwabara ,  Naoya Ikeda ,  Hiroyuki Koreeda ,  Hiroaki Aotsu ,  Masaki Kawase ,  Yujiro Tatsuno ,  Naomichi Nonaka ,  Kazunari Suzuki

发明人： Keiichi Nakane ,  Tadashi Kuwabara ,  Naoya Ikeda ,  Hiroyuki Koreeda ,  Hiroaki Aotsu ,  Masaki Kawase ,  Yujiro Tatsuno ,  Naomichi Nonaka ,  Kazunari Suzuki

IPC分类号： G09G5/14

CPC分类号： G09G5/14

摘要： A central processing unit, a main memory for storing graphic or character data, an external memory, an input device for inputting the graphic or character data, a shared memory for temporarily storing the graphic or character data read by the central processing unit, a display processing means for preparing a plurality of display data displayed on a display from the graphic or character data on the shared memory, and a display memory for storing the plurality of display data are connected to a bus. The display memory, the shared memory, and the external memory have first, second and third save areas for temporarily saving the overlapped display data when the plurality of display data are overlapped. The main memory is provided with a first control table for controlling display position, mutual priority for display, and a save area during overlap, regarding each of the plurality of display data stored in the display memory. The display processing means controls to display the plurality of display data on the display using the first table, the first, second and third save areas, and the display memory. In the first, second and third save areas, the first save area has highest priority and the third save area has lowest priority.

摘要翻译： 中央处理单元，用于存储图形或字符数据的主存储器，外部存储器，用于输入图形或字符数据的输入装置，用于临时存储由中央处理单元读取的图形或字符数据的共享存储器，显示器 处理装置，用于从共享存储器上的图形或字符数据准备在显示器上显示的多个显示数据，以及用于存储多个显示数据的显示存储器连接到总线。 显示存储器，共享存储器和外部存储器具有用于在多个显示数据重叠时临时保存重叠显示数据的第一，第二和第三保存区域。 主存储器具有第一控制表，用于控制显示位置的显示位置，显示的相互优先级和重叠期间的保存区域，关于存储在显示存储器中的多个显示数据。 显示处理装置控制使用第一表，第一，第二和第三保存区以及显示存储器在显示器上显示多个显示数据。 在第一，第二和第三保存区域中，第一个保存区域具有最高优先级，第三个保存区域具有最低优先级。