公开(公告)号：US08790472B2

公开(公告)日：2014-07-29

申请号：US11628746

申请日：2005-05-09

申请人： Minoru Ueshima ,  Takashi Ishii

发明人： Minoru Ueshima ,  Takashi Ishii

IPC分类号： B22D17/00

CPC分类号： B23K35/40 ,  B23K35/0222 ,  B23K35/025 ,  B23K35/22 ,  C22C2001/1052 ,  Y10T428/1216

摘要： [Problems] A conventional process for producing a solder preform in which a predetermined amount of high-melting metal particles are directly put into molten solder and stirred, requires a long time for dispersing the high-melting metal particles by stirring. Therefore, in the conventional method for producing a solder preform, dissolution of the high-melting metal particles into the molten solder occurred during stirring, and their particle diameters became small. If a semiconductor chip and a substrate are soldered with a solder preform containing metal particles having such decreased diameters, the space between portions being soldered becomes narrow, and a sufficient bonding strength is not obtained.[Means for Solving the Problems] In the present invention, a premixed master alloy having a higher proportion of the high-melting metal particles in solder is first prepared, then the premixed master alloy is put into molten solder to disperse the high-melting metal particles. As a result, the high-melting metal particles can be uniformly dispersed in solder in a short length of time. Accordingly, a solder preform which is obtained by the process for producing a solder preform according to the present invention can maintain a predetermined clearance between portions being soldered, and a sufficient bonding strength is obtained.

摘要翻译： [问题]将预定量的高熔点金属颗粒直接投入熔融焊料并搅拌的用于生产焊料预制件的常规方法需要长时间以通过搅拌分散高熔点金属颗粒。 因此，在以往的焊料预制体的制造方法中，在熔融焊料中溶解高熔点金属粒子发生搅拌，粒径变小。 如果半导体芯片和基板与含有直径减小的金属粒子的焊料预制体焊接，则被焊接的部分之间的间隔变窄，并且不能获得充分的接合强度。 解决问题的手段在本发明中，首先准备焊料中高熔点金属颗粒比例较高的预混合母合金，然后将预混合的母合金放入熔融焊料中以分散高熔点金属 粒子。 结果，高熔点金属颗粒可以在短时间内均匀地分散在焊料中。 因此，通过本发明的焊料预成型体的制造方法获得的焊料预成型体可以在被焊接的部分之间保持规定的间隙，并且获得充分的接合强度。

公开(公告)号：US07966629B2

公开(公告)日：2011-06-21

申请号：US11412945

申请日：2006-04-28

申请人： Mitsuhiro Iwama ,  Takashi Ishii ,  Kunio Omi ,  Tsuneo Suzuki ,  Kouzou Ohno

发明人： Mitsuhiro Iwama ,  Takashi Ishii ,  Kunio Omi ,  Tsuneo Suzuki ,  Kouzou Ohno

IPC分类号： G11B33/02

CPC分类号： G11B17/056 ,  G11B17/0405 ,  G11B33/1493

摘要： An optical disc device includes a conductive member of a bezel assembly with openings formed by a plurality of parting lines, and gaskets are attached to the upper and lower sides of the conductive member using conductive adhesion bond.

摘要翻译： 光盘装置包括具有由多个分型线形成的开口的边框组件的导电构件，并且使用导电粘合键将垫圈附接到导电构件的上侧和下侧。

公开(公告)号：US20110068149A1

公开(公告)日：2011-03-24

申请号：US12923319

申请日：2010-09-14

申请人： Naohiko Hirano ,  Akira Tanahashi ,  Yoshitsugu Sakamoto ,  Kaichi Tsuruta ,  Takashi Ishii ,  Satoshi Soga

发明人： Naohiko Hirano ,  Akira Tanahashi ,  Yoshitsugu Sakamoto ,  Kaichi Tsuruta ,  Takashi Ishii ,  Satoshi Soga

IPC分类号： B23K35/14

CPC分类号： C22C13/00 ,  B22F1/025 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/3033 ,  B23K35/36

摘要： A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded, rolled, and punched to form a pellet or a washer, for example.

摘要翻译： 从包含可热解助熔剂和高熔点金属颗粒的焊料混合物制备混合母合金，将混合母合金装入大量熔融焊料中并搅拌，并制备坯料。 然后可以将坯料挤出，轧制和冲压以形成例如颗粒或垫圈。

公开(公告)号：US20090236725A1

公开(公告)日：2009-09-24

申请号：US12226764

申请日：2007-04-26

申请人： Naohiko Hirano ,  Yoshitsugu Sakamoto ,  Tomomi Okumura ,  Kaichi Tsuruta ,  Minoru Ueshima ,  Takashi Ishii

发明人： Naohiko Hirano ,  Yoshitsugu Sakamoto ,  Tomomi Okumura ,  Kaichi Tsuruta ,  Minoru Ueshima ,  Takashi Ishii

IPC分类号： H01L23/488 ,  B23K35/24

CPC分类号： H05K3/3478 ,  B23K35/262 ,  B23K35/40 ,  H01L23/492 ,  H01L23/49866 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/291 ,  H01L2224/29101 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29211 ,  H01L2224/29355 ,  H01L2224/29499 ,  H01L2224/29582 ,  H01L2224/29611 ,  H01L2224/29694 ,  H01L2224/29695 ,  H01L2224/32225 ,  H01L2224/83101 ,  H01L2224/83455 ,  H01L2224/83801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/15747 ,  H05K2201/0215 ,  H05K2201/2036 ,  H05K2203/0415 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/01026 ,  H01L2924/01049 ,  H01L2924/01083 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2224/13109 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

摘要： An electronic component having a semiconductor element bonded to a substrate with solder has a decreased bonding strength if there is not a suitable clearance between the semiconductor element and the substrate. Therefore, a solder preform having high melting point metal particles dispersed in solder has been used in the manufacture of electronic components. However, when an electronic component was manufactured using a conventional solder preform, there were cases in which the semiconductor element leaned or the bonding strength was not adequate.A solder preform according to the present invention has a variation in the size of high melting point metal particles which is at most 20 micrometers when the metal particle diameter is 50 micrometers, and an alloy layer of the high melting point metal particles and the main component of solder is formed around the high melting point metal particles. In addition, no voids at all are present in the solder. An electronic component according to the present invention has a semiconductor element bonded to a substrate with the above-described solder preform and has excellent resistance to heat cycles.

摘要翻译： 如果半导体元件和基板之间没有合适的间隙，则具有用焊料与基板结合的半导体元件的电子部件的接合强度降低。 因此，在电子部件的制造中已经使用了分散在焊料中的高熔点金属粒子的焊料预成型体。 然而，当使用常规的焊料预制件制造电子部件时，存在半导体元件倾斜或接合强度不足的情况。 根据本发明的焊料预成型体在金属粒径为50微米时具有至多20微米的高熔点金属颗粒的尺寸变化，并且高熔点金属颗粒和主要组分的合金层 的焊料形成在高熔点金属颗粒周围。 另外，在焊料中也不存在空隙。 根据本发明的电子部件具有利用上述焊料预成型件与基板结合的半导体元件，并具有优异的耐热循环性。

公开(公告)号：US07582057B2

公开(公告)日：2009-09-01

申请号：US11061722

申请日：2005-02-22

申请人： Tomoaki Toriya ,  Takashi Tsumanuma ,  Kenichi Nakatate ,  Takashi Ishii ,  Kiyoshi Oka ,  Toshio Osaki ,  Akiyoshi Hayakawa

发明人： Tomoaki Toriya ,  Takashi Tsumanuma ,  Kenichi Nakatate ,  Takashi Ishii ,  Kiyoshi Oka ,  Toshio Osaki ,  Akiyoshi Hayakawa

IPC分类号： A61B1/06 ,  A61B1/04

CPC分类号： A61B1/00167 ,  A61B1/0017 ,  A61B1/07 ,  A61B18/22 ,  A61B2018/2244 ,  A61B2090/3614 ,  G02B6/4206 ,  G02B23/2469 ,  G02B23/26

摘要： Endoscopic system 40 comprises composite optical fiber 34 that consists of a large-diameter, laser light transmitting optical fiber surrounded by a large number of image transmitting fibers that are bundled together to form an integral assembly with the central fiber, laser applying and image observing optical unit 42 that is connected to the eyepiece portion of said composite optical fiber such that it launches laser light into said large-diameter optical fiber and that the image being transmitted through said image transmitting optical fiber is focused on a camera to become observable, and an illuminating light transmitting unit that transmits illuminating light to the tip of the objective portion of said composite optical fiber for irradiation purposes.

摘要翻译： 内窥镜系统40包括由大直径的激光传输光纤组成的复合光纤34，该光纤被大量图像传输光纤包围，所述多个图像传输光纤被捆绑在一起，以形成与中心光纤，激光施加和图像观察光学 单元42，其连接到所述复合光纤的目镜部分，使得其将激光发射到所述大直径光纤中，并且通过所述图像发送光纤传输的图像被聚焦在相机上以变得可观察到，并且 照明光发射单元，其将照射光发射到所述复合光纤的目标部分的末端用于照射目的。

公开(公告)号：US07562745B2

公开(公告)日：2009-07-21

申请号：US10548947

申请日：2004-06-17

申请人： Takashi Ishii ,  Kazuaki Miyakoshi ,  Shigeru Takaishi ,  Hiroshi Sano ,  Kan Kawasaki ,  Ikuo Asami ,  Kazuhiro Izumi ,  Takanori Urata ,  Shun Fujimura ,  Masayuki Higashi ,  Satoshi Takasawa ,  Masahiro Kuramitsu

发明人： Takashi Ishii ,  Kazuaki Miyakoshi ,  Shigeru Takaishi ,  Hiroshi Sano ,  Kan Kawasaki ,  Ikuo Asami ,  Kazuhiro Izumi ,  Takanori Urata ,  Shun Fujimura ,  Masayuki Higashi ,  Satoshi Takasawa ,  Masahiro Kuramitsu

IPC分类号： B66B11/08 ,  B66B7/02 ,  B66B11/04

CPC分类号： B66B11/0015 ,  B66B11/004 ,  B66B11/009

摘要： An elevator in which a driving apparatus, a traction sheave, and a counterweight-side rope hitching portion are arranged above one rail of the right and left cage-side guide rails, while a cage-side rope hitching portion and a speed governor are arranged above the other rail of the right and left cage-side guide rails. Since a control panel is arranged along a rear inner wall surface of the machine room, a large operation space can be secured in a center part of the floor of the machine room. Further, since a machine beam can be extended at full length in the back and forth direction in the machine room, no additional building-side receiving beam is needed.

摘要翻译： 在左右笼式导轨的一个轨道上配置有驱动装置，牵引滑轮和配重侧绳索搭接部的升降机，同时设有笼侧绳索挂接部和调速器 在左右笼式导轨的另一条轨道上方。 由于控制面板沿着机房的后内壁表面布置，因此可以在机房的地板的中心部分确保大的操作空间。 此外，由于机器梁可以在机房中沿前后方向全长地延伸，所以不需要额外的建筑物侧接收梁。

公开(公告)号：US07518155B2

公开(公告)日：2009-04-14

申请号：US10546777

申请日：2004-03-15

申请人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

发明人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

IPC分类号： H01L33/00

CPC分类号： H01L33/60 ,  H01L33/486 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01S5/0224 ,  H01S5/02292 ,  H01L2924/00014 ,  H01L2924/00

摘要： The object of the present invention is to provide a light-emitting element mounting member and a semiconductor device using the same that is easy to process and that allows adequate heat dissipation.A light-emitting element mounting member 200 includes: a substrate 2 including an element mounting surface 2a mounting a semiconductor light-emitting element 1 and first and second conductive regions 21, 22 disposed on the element mounting surface 2a and connected to the semiconductor light-emitting element 1; a reflective member 6 including a reflective surface 6a defining an internal space 6b for housing the semiconductor light-emitting element 1 and containing a metal disposed on the element mounting surface 1a; and a metal layer 13 disposed on the reflective surface 6a. The reflective surface 6a is sloped relative to the element mounting surface 2a so that a diameter of the internal space 6b is greater away from the element mounting surface 2a.

摘要翻译： 本发明的目的是提供一种发光元件安装构件和使用该发光元件安装构件的半导体装置，其易于处理并且允许充分的散热。 发光元件安装构件200包括：基板2，其包括安装半导体发光元件1的元件安装表面2a和设置在元件安装表面2a上并连接到半导体发光元件1的第一和第二导电区域21,22。 发光元件1; 反射构件6，其包括限定用于容纳半导体发光元件1并且容纳设置在元件安装表面1a上的金属的内部空间6b的反射表面6a; 以及设置在反射面6a上的金属层13。 反射表面6a相对于元件安装表面2a倾斜，使得内部空间6b的直径远离元件安装表面2a。

公开(公告)号：US07420223B2

公开(公告)日：2008-09-02

申请号：US11929387

申请日：2007-10-30

申请人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

发明人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L33/46 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

摘要： A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1 and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u. In addition, when an electrode 32 which connects to an external part is provided on main surface 1a, on the cavity side of the part which connects with electrode 32, main surface 1a is provided with a groove. The groove is for preventing outward flow of connection member 34 of electrode 32.

摘要翻译： 提供了用于充分去除由半导体元件产生的热的半导体器件。 半导体器件100配备有具有底面2b和位于底面2b的相反侧的元件安装面2a的基板2和具有主表面1a的半导体元件1， 安装在元件安装表面2a上。 其中L为主面1的长度方向的长度，H为底面2b与元件安装面2a的距离，H / L的比为0.3以上。 当半导体元件是发光元件时，元件安装表面2a是空腔2u，元件1设置在腔体2u中。 金属层13设置在空腔2u的表面上。 此外，当在主表面1a上设置连接到外部部分的电极32时，在与电极32连接的部分的空腔侧上，主表面1a设置有凹槽。 凹槽用于防止电极32的连接构件34向外流动。

公开(公告)号：US20080067540A1

公开(公告)日：2008-03-20

申请号：US11929492

申请日：2007-10-30

申请人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

发明人： Sadamu Ishidu ,  Kenjiro Higaki ,  Takashi Ishii ,  Yasushi Tsuzuki

IPC分类号： H01L33/00

CPC分类号： H01L33/642 ,  H01L33/46 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2924/00014

摘要： A semiconductor device for adequately removing heat generated by a semiconductor element is provided. A semiconductor device 100 is equipped with a substrate 2, having a bottom surface 2b and an element mounting surface 2a which is positioned on the opposite side of bottom surface 2b, and a semiconductor element 1, having a main surface 1a which is mounted onto element mounting surface 2a. With L being the length in the long direction of main surface 1 and H being the distance between bottom surface 2b and element mounting surface 2a, the ratio H/L is 0.3 or greater. When the semiconductor element is a light emitting element, element mounting surface 2a is a cavity 2u, and element 1 is provided in cavity 2u. A metal layer 13 is provided on the surface of cavity 2u. In addition, when an electrode 32 which connects to an external part is provided on main surface 1a, on the cavity side of the part which connects with electrode 32, main surface 1a is provided with a groove. The groove is for preventing outward flow of connection member 34 of electrode 32.

摘要翻译： 提供了用于充分去除由半导体元件产生的热的半导体器件。 半导体器件100配备有具有底面2b和位于底面2b的相反侧的元件安装面2a的基板2和具有主表面1a的半导体元件1， 安装在元件安装表面2a上。 其中L为主面1的长度方向的长度，H为底面2b与元件安装面2a的距离，H / L的比为0.3以上。 当半导体元件是发光元件时，元件安装表面2a是空腔2u，元件1设置在腔体2u中。 金属层13设置在空腔2u的表面上。 此外，当在主表面1a上设置连接到外部部分的电极32时，在与电极32连接的部分的空腔侧，主表面1a设置有凹槽。 凹槽用于防止电极32的连接构件34向外流动。

公开(公告)号：US07293631B2

公开(公告)日：2007-11-13

申请号：US10480647

申请日：2003-04-11

申请人： Takashi Ishii ,  Hiroshi Sano ,  Kan Kawasaki

发明人： Takashi Ishii ,  Hiroshi Sano ,  Kan Kawasaki

IPC分类号： B66B11/02 ,  B66B9/02

CPC分类号： B66B11/0206 ,  B66B11/008 ,  B66B11/0226

摘要： There is provided an machineroom-less elevator which can reduce the pit depth in a bottom part of an elevator shaft, mostly perform maintenance work on an upper space of a cage, and reduce a top clearance. A pair of right and left cage-side sheaves are disposed in the upper space of the cage, and the rotational axes of the traction sheave and the cage-side sheaves are extended in the longitudinal direction. A sheave supporting beam to rotatably support cage-side sheaves is disposed in a space between and upper beam of the cage frame and a ceiling of the cage, and disposed below rotary shafts of the cage-side sheaves.

摘要翻译： 提供了一种能够减小电梯井底部的坑深度的无机加电梯，主要在保持架的上部空间进行维护工作，并且减小顶部间隙。 一对左右的笼式侧滑轮设置在保持架的上部空间中，牵引滑轮和保持架侧滑轮的旋转轴线在长度方向上延伸。 在保持架框架的上梁和保持架的天花板之间的空间中设置有用于可旋转地支撑保持架侧滑轮的滑轮支撑梁，并且设置在轿厢侧滑轮的旋转轴的下方。