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97 条记录 (耗时 0.024 秒)

    On-chip RF shields with backside redistribution lines
    82.
    发明授权
    On-chip RF shields with backside redistribution lines 有权
    具有背面再分配线的片上RF屏蔽

    公开(公告)号：US07936052B2

    公开(公告)日：2011-05-03

    申请号：US12242487

    申请日：2008-09-30

    申请人： Hans-Joachim Barth ,  Jens Pohl ,  Gottfried Beer ,  Heinrich Koerner

    发明人： Hans-Joachim Barth ,  Jens Pohl ,  Gottfried Beer ,  Heinrich Koerner

    IPC分类号： H01L29/72

    CPC分类号： H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/552 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05 ,  H01L2224/05569 ,  H01L2924/0002 ,  H01L2224/05552

    摘要： Structures of a system on chip and methods of forming a system on chip are disclosed. In one embodiment, a method of fabricating the system on chip includes forming a through substrate opening from a back surface of a substrate, the through substrate opening disposed between a first and a second region, the first region comprising devices for RF circuitry and the second region comprising devices for other circuitry. The method further includes forming patterns for redistribution lines on a photo resist layer, the photo resist layer disposed under the back surface, and filling the through substrate opening and the patterns for redistribution lines with a conductive material.

    摘要翻译： 公开了一种片上系统的结构以及片上系统的形成方法。 在一个实施例中，一种制造片上系统的方法包括从衬底的背面形成穿透衬底开口，穿过衬底开口设置在第一和第二区域之间，第一区域包括用于RF电路的装置，第二区域包括第二 区域包括用于其他电路的装置。 该方法还包括在光致抗蚀剂层上形成用于再分配线的图案，设置在背面下方的光致抗蚀剂层，以及用导电材料填充贯通基板开口和再分配线图案。

    Semiconductor chips for TAG applications, devices for mounting the same, and mounting method
    83.
    发明授权
    Semiconductor chips for TAG applications, devices for mounting the same, and mounting method 有权
    用于TAG应用的半导体芯片，用于安装其的装置和安装方法

    公开(公告)号：US07922093B2

    公开(公告)日：2011-04-12

    申请号：US11938857

    申请日：2007-11-13

    申请人： Gottfried Beer ,  Werner Weber

    发明人： Gottfried Beer ,  Werner Weber

    IPC分类号： G06K19/06 ,  G06K19/00 ,  G06K5/00

    CPC分类号： H01L21/67144 ,  G06K19/07718 ,  H01L21/67132 ,  H01L23/49855 ,  H01L24/95 ,  H01L2224/75733 ,  H01L2224/95144 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00

    摘要： A TAG chip includes a magnetic coating or an electrostatically chargeable structure. A device for packing semiconductor chips includes an electromagnetic or electrostatic lifter, which picks up singulated semiconductor chips of a semiconductor wafer with a magnetic coating or including an electrostatically chargeable structure from a wafer position and deposits them in a collecting position. A mounting device includes a conveying roller with conveying receptacles for semiconductor chips, which pick up the semiconductor chips in a pick-up position with electromagnetically or electrostatically activatable conveying receptacles and, in a discharge position will discharge, via deactivation of the conveying receptacles, the semiconductor chips onto a corresponding liner or an object.

    摘要翻译： TAG芯片包括磁性涂层或静电电荷结构。 用于包装半导体芯片的装置包括电磁或静电提升器，其利用磁性涂层拾取半导体晶片的单个半导体芯片，或者从晶片位置拾取可静电充电的结构，并将它们沉积在收集位置。 安装装置包括具有用于半导体芯片的输送容器的输送辊，其利用电磁或静电可激活的输送容器拾取拾取位置中的半导体芯片，并且在放电位置将通过输送容器的失活将其排出， 半导体芯片到相应的衬里或物体上。

    Optical transmitter and/or receiver assembly comprising a planar optical circuit
    86.
    发明授权
    Optical transmitter and/or receiver assembly comprising a planar optical circuit 失效
    包括平面光电路的光发射器和/或接收器组件

    公开(公告)号：US07729569B2

    公开(公告)日：2010-06-01

    申请号：US10537717

    申请日：2002-12-05

    申请人： Gottfried Beer ,  Hans-Ludwig Althaus

    发明人： Gottfried Beer ,  Hans-Ludwig Althaus

    IPC分类号： G02B6/12 ,  G02B6/30 ,  G02B6/32

    CPC分类号： G02B6/421 ,  G02B6/4204 ,  G02B6/423 ,  G02B6/4246

    摘要： The invention relates to an optical transmitter and/or receiver assembly comprising at least one transmitter component (2) and/or at least one receiver component (3, 4), in addition to a planar optical circuit (5) with at least one integrated waveguide (51). According to the invention, light from the transmitter element (1) is coupled into a waveguide (51) of the planar optical circuit (5) and/or light from the waveguide (51) of the planar optical circuit (5) is uncoupled and guided onto the receiver component (3, 4). The assembly is provided with a lens (14, 15) for optically coupling the waveguide(s) (51) of the planar optical circuit (5) to a fiber-optic that can be fixed to the transmitter and/or receiver assembly (1), said lens (14, 15) being positioned on the planar optical circuit (5).

    摘要翻译： 本发明涉及一种包括至少一个发射器部件（2）和/或至少一个接收器部件（3,4）的光发射机和/或接收机组件，除了具有至少一个集成的平面光学电路 波导（51）。 根据本发明，来自发射器元件（1）的光耦合到平面光电路（5）的波导（51）和/或来自平面光电路（5）的波导（51）的光分离，并且 被引导到接收器部件（3,4）上。 组件设置有用于将平面光电路（5）的波导（51）光学耦合到可固定到发射器和/或接收器组件（1）的光纤的透镜（14,15） ），所述透镜（14,15）位于平面光电路（5）上。