SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20180166578A1

    公开(公告)日:2018-06-14

    申请号:US15831763

    申请日:2017-12-05

    Abstract: A semiconductor device with favorable electrical characteristics is provided. The semiconductor device includes a first conductor over a substrate; a first insulator over the first conductor; an oxide over the first insulator; a second insulator over the oxide; a second conductor over the second insulator; a third insulator over the second conductor; a fourth insulator in contact with a side surface of the second insulator, a side surface of the second conductor, and a side surface of the third insulator; and a fifth insulator in contact with the oxide, the first insulator, and the fourth insulator. The first insulator and the fifth insulator are in contact with each other in a region on the periphery of the side of the oxide. The oxide includes a first region where a channel is formed; a second region adjacent to the first region; a third region adjacent to the second region; and a fourth region adjacent to the third region. The first region has higher resistance than the second region, the third region, and the fourth region and overlaps with the second conductor. The second region has higher resistance than the third region and the fourth region and overlaps with the second conductor. The third region has higher resistance than the fourth region and overlaps with the fourth insulator.

    Manufacturing method of semiconductor device

    公开(公告)号:US09966473B2

    公开(公告)日:2018-05-08

    申请号:US15147279

    申请日:2016-05-05

    Inventor: Yuta Endo

    Abstract: A miniaturized transistor with less variation and highly stable electrical characteristics is provided. Further, high performance and high reliability of a semiconductor device including the transistor are achieved. A semiconductor and a conductor are formed over a substrate, a sacrificial layer is formed over the conductor, and an insulator is formed to cover the sacrificial layer. After that, a top surface of the insulator is removed to expose a top surface of the sacrificial layer. The sacrificial layer and a region of the conductor overlapping with the sacrificial layer are removed, whereby a source region, a drain region, and an opening are formed. Next, a gate insulator and a gate electrode are formed in the opening.

    Semiconductor device and method for manufacturing the same
    89.
    发明授权
    Semiconductor device and method for manufacturing the same 有权
    半导体装置及其制造方法

    公开(公告)号:US08975115B2

    公开(公告)日:2015-03-10

    申请号:US14148906

    申请日:2014-01-07

    Abstract: An insulating layer which releases a large amount of oxygen is used as an insulating layer in contact with a channel region of an oxide semiconductor layer, and an insulating layer which releases a small amount of oxygen is used as an insulating layer in contact with a source region and a drain region of the oxide semiconductor layer. By releasing oxygen from the insulating layer which releases a large amount of oxygen, oxygen deficiency in the channel region and an interface state density between the insulating layer and the channel region can be reduced, so that a highly reliable semiconductor device having small variation in electrical characteristics can be manufactured. The source region and the drain region are provided in contact with the insulating layer which releases a small amount of oxygen, thereby suppressing the increase of the resistance of the source region and the drain region.

    Abstract translation: 使用释放大量氧的绝缘层作为与氧化物半导体层的沟道区域接触的绝缘层,并且使用释放少量氧的绝缘层作为与源极接触的绝缘层 区域和氧化物半导体层的漏极区域。 通过从释放大量氧的绝缘层释放氧气,可以减少沟道区域中的氧缺乏以及绝缘层和沟道区域之间的界面态密度,从而可以降低电子变化小的高度可靠的半导体器件 特性可以制造。 源极区域和漏极区域设置成与释放少量氧气的绝缘层接触,从而抑制源极区域和漏极区域的电阻的增加。

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
    90.
    发明申请
    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 有权
    半导体器件及其制造方法

    公开(公告)号:US20140183528A1

    公开(公告)日:2014-07-03

    申请号:US14141806

    申请日:2013-12-27

    Inventor: Yuta Endo

    Abstract: A semiconductor device with high aperture ratio is provided. The semiconductor device includes a transistor and a capacitor having a pair of electrodes. An oxide semiconductor layer formed over the same insulating surface is used for a channel formation region of the transistor and one of the electrodes of the capacitor. The other electrode of the capacitor is a transparent conductive film. One electrode of the capacitor is electrically connected to a wiring formed over the insulating surface over which a source electrode or a drain electrode of the transistor is provided, and the other electrode of the capacitor is electrically connected to one of the source electrode and the drain electrode of the transistor.

    Abstract translation: 提供了一种具有高开口率的半导体器件。 半导体器件包括晶体管和具有一对电极的电容器。 形成在同一绝缘表面上的氧化物半导体层用于晶体管的沟道形成区域和电容器的电极之一。 电容器的另一个电极是透明导电膜。 电容器的一个电极电连接到形成在绝缘表面上的布线,在该绝缘表面上设置有晶体管的源电极或漏极,并且电容器的另一个电极电连接到源电极和漏极 电极。

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