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81.发明授权Electroplanarization of large and small damascene features using diffusion barriers and electropolishing 有权使用扩散屏障和电解抛光的大型和小型镶嵌特征的电平面化公开(公告)号：US06315883B1
公开(公告)日：2001-11-13
申请号：US09412837
申请日：1999-10-05
IPC分类号： C25D502
CPC分类号： H01L21/32115 , B23H5/08 , H01L21/3212 , H01L21/32134
摘要： A disclosed electroplanarization process involves “masking” certain regions of a wafer surface during electropolishing. The regions chosen for masking are features of relatively low aspect ratio (i.e., features that are wider than they are deep). The masking is accomplished with a material of relatively low ionic conductivity, which effectively slows or blocks transport of the metal ions produced during electropolishing. Examples of masking materials include concentrated phosphoric acid and certain polymers.
摘要翻译： 所公开的电平面化方法涉及在电解抛光期间“掩蔽”晶片表面的某些区域。 选择用于掩蔽的区域是相对低的纵横比的特征（即，比它们更深的特征）。 掩蔽是用离子电导率相对较低的材料完成的，这有效地减慢或阻止了电解抛光过程中产生的金属离子的传输。 掩蔽材料的实例包括浓磷酸和某些聚合物。
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公开(公告)号：US06309981B1
公开(公告)日：2001-10-30
申请号：US09557668
申请日：2000-04-25
申请人： Steven T. Mayer , Carl Russo , Evan Patton
发明人： Steven T. Mayer , Carl Russo , Evan Patton
IPC分类号： H01L2100
CPC分类号： H01L21/76877 , C23F1/08 , H01L21/02063 , H01L21/32134 , H01L21/67051 , H01L21/6708
摘要： Chemical etching methods and associated modules for performing the removal of metal from the edge bevel region of a semiconductor wafer are described. The methods and systems apply liquid etchant in a precise manner at the edge bevel region of the wafer under viscous flow conditions, so that the etchant is applied on to the front edge area and flows over the side edge and onto the back edge in a viscous manner. The etchant thus does not flow or splatter onto the active circuit region of the wafer.
摘要翻译： 描述了用于从半导体晶片的边缘斜面区域去除金属的化学蚀刻方法和相关模块。 这些方法和系统在粘性流动条件下在晶片的边缘斜面区域以精确的方式施加液体腐蚀剂，使得蚀刻剂施加到前边缘区域上并且以粘性流过侧边缘并在后边缘上流动 方式。 因此，蚀刻剂不会流动或溅射到晶片的有源电路区域。
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公开(公告)号：US5908896A
公开(公告)日：1999-06-01
申请号：US586038
申请日：1996-01-16
CPC分类号： H01G9/155 , B01J13/00 , B01J13/0091 , Y02E60/13 , Y10T428/2982
摘要： Organic aerogel microspheres which can be used in capacitors, batteries, thermal insulation, adsorption/filtration media, and chromatographic packings, having diameters ranging from about 1 micron to about 3 mm. The microspheres can be pyrolyzed to form carbon aerogel microspheres. This method involves stirring the aqueous organic phase in mineral oil at elevated temperature until the dispersed organic phase polymerizes and forms nonsticky gel spheres. The size of the microspheres depends on the collision rate of the liquid droplets and the reaction rate of the monomers from which the aqueous solution is formed. The collision rate is governed by the volume ratio of the aqueous solution to the mineral oil and the shear rate, while the reaction rate is governed by the chemical formulation and the curing temperature.
摘要翻译： 可用于电容器，电池，绝热，吸附/过滤介质和色谱填料的有机气凝胶微球，其直径范围为约1微米至约3毫米。 微球可以热解形成碳气凝胶微球。 该方法包括在升高的温度下在矿物油中搅拌含水有机相，直到分散的有机相聚合并形成不粘的凝胶球。 微球的大小取决于液滴的碰撞速率和形成水溶液的单体的反应速率。 碰撞率由水溶液与矿物油的体积比和剪切速率决定，反应速率由化学配方和固化温度决定。
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公开(公告)号：US5789338A
公开(公告)日：1998-08-04
申请号：US619393
申请日：1996-03-20
CPC分类号： H01G9/155 , C04B38/0022 , C08G8/04 , C08G8/20 , H01G11/34 , C04B2111/00844 , Y02E60/13
摘要： A high energy density capacitor incorporating a variety of carbon foam electrodes is described. The foams, derived from the pyrolysis of resorcinol-formaldehyde and related polymers, are high density (0.1 g/cc-1.0 g/cc) electrically conductive and have high surface areas (400 m.sup.2 /g-1000 m.sup.2 /g). Capacitances on the order of several tens of farad per gram of electrode are achieved.
摘要翻译： 描述了包含各种碳泡沫电极的高能量密度电容器。 衍生自间苯二酚 - 甲醛和相关聚合物的热解的泡沫体具有高密度（0.1g / cc-1.0g / cc）的导电性，并具有高的表面积（400m2 / g-1000m2 / g）。 实现了每克电极数十法拉的数量级。
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公开(公告)号：US5601938A
公开(公告)日：1997-02-11
申请号：US183876
申请日：1994-01-21
CPC分类号： H01M4/96 , H01M8/08 , H01M2300/0082 , H01M4/92
摘要： A direct energy conversion device, such as a fuel cell, using carbon aerogel electrodes, wherein the carbon aerogel is loaded with a noble catalyst, such as platinum or rhodium and soaked with phosphoric acid, for example. A separator is located between the electrodes, which are placed in a cylinder having plate current collectors positioned adjacent the electrodes and connected to a power supply, and a pair of gas manifolds, containing hydrogen and oxygen positioned adjacent the current collectors. Due to the high surface area and excellent electrical conductivity of carbon aerogels, the problems relative to high polarization resistance of carbon composite electrodes conventionally used in fuel cells are overcome.
摘要翻译： 直接能量转换装置，例如使用碳气凝胶电极的燃料电池，其中碳气凝胶装载有贵金属催化剂，例如铂或铑，并用磷酸浸泡。 分离器位于电极之间，其被放置在具有邻近电极定位并且连接到电源的板集流器的气缸中，以及一对包含位于集流器附近的氢和氧的气体歧管。 由于碳气凝胶的高表面积和优异的导电性，克服了常规用于燃料电池中的碳复合电极的高极化电阻的问题。
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86.发明授权Method for forming a cell separator for use in bipolar-stack energy storage devices 失效用于形成用于双极堆叠储能装置的电池隔板的方法
公开(公告)号：US5336274A
公开(公告)日：1994-08-09
申请号：US90881
申请日：1993-07-08
CPC分类号： H01G9/155 , H01M6/48 , H01M8/0213 , Y02E60/13 , Y10T29/49114
摘要： An improved multi-cell electrochemical energy storage device, such as a battery, fuel cell, or double layer capacitor using a cell separator which allows cells to be stacked and interconnected with low electrical resistance and high reliability while maximizing packaging efficiency. By adding repeating cells, higher voltages can be obtained. The cell separator is formed by applying an organic adhesive on opposing surfaces of adjacent carbon electrodes or surfaces of aerogel electrodes of a pair of adjacent cells prior to or after pyrolysis thereof to form carbon aerogel electrodes. The cell separator is electronically conductive, but ionically isolating, preventing an electrolytic conduction path between adjacent cells in the stack.
摘要翻译： 改进的多单元电化学能量存储装置，例如电池，燃料电池或使用电池隔板的双层电容器，其允许电池以低电阻和高可靠性堆叠和互连，同时最大限度地提高包装效率。 通过添加重复单元，可以获得更高的电压。 通过在热分解之前或之后，在相邻的碳电极或一对相邻电池的气凝胶电极的表面的相对表面上施加有机粘合剂来形成电池隔板，以形成碳气凝胶电极。 细胞分离器是电子导电的，但是离子隔离，防止堆叠中相邻细胞之间的电解传导路径。
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公开(公告)号：US08795482B1
公开(公告)日：2014-08-05
申请号：US13572483
申请日：2012-08-10
申请人： Steven T. Mayer , Marshall R. Stowell , John S. Drewery , Richard S. Hill , Timothy M. Archer , Avishai Kepten
发明人： Steven T. Mayer , Marshall R. Stowell , John S. Drewery , Richard S. Hill , Timothy M. Archer , Avishai Kepten
CPC分类号： B23H5/08 , C25F3/16 , H01L21/02068 , H01L21/2885 , H01L21/32115 , H01L21/7684
摘要： Methods and apparatus are provided for planar metal plating on a workpiece having a surface with recessed regions and exposed surface regions; comprising the steps of: causing a plating accelerator to become attached to said surface including the recessed and exposed surface regions; selectively removing the plating accelerator from the exposed surface regions without performing substantial metal plating on the surface; and after removal of plating accelerator is at least partially complete, plating metal onto the surface, whereby the plating accelerator remaining attached to the surface increases the rate of metal plating in the recessed regions relative to the rate of metal plating in the exposed surface regions.
摘要翻译： 提供了用于在具有凹陷区域和暴露表面区域的表面的工件上进行平面金属电镀的方法和装置; 包括以下步骤：使电镀加速器附着到包括凹入和暴露的表面区域的所述表面; 选择性地从暴露的表面区域去除电镀加速器，而不在表面上进行实质的金属电镀; 在去除电镀促进剂至少部分完成后，将金属镀在表面上，由此保持附着在表面上的电镀加速剂相对于露出的表面区域中的金属电镀速率增加凹陷区域中的金属电镀速率。
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88.发明申请公开(公告)号：US20140190529A1
公开(公告)日：2014-07-10
申请号：US13857883
申请日：2013-04-05
CPC分类号： H01L21/6708 , H01L21/02068 , H01L21/02087 , H01L21/0209 , H01L21/32134 , H01L21/67745 , H01L21/68735 , H01L21/68785
摘要： Chemical etching methods and associated modules for performing the removal of metal from the edge bevel region of a semiconductor wafer are described. The methods and systems provide the thin layer of pre-rinsing liquid before applying etchant at the edge bevel region of the wafer. The etchant is less diluted and diffuses faster through a thinned layer of rinsing liquid. An edge bevel removal embodiment involving that is particularly effective at reducing process time, narrowing the metal taper and allowing for subsequent chemical mechanical polishing, is disclosed.
摘要翻译： 描述了用于从半导体晶片的边缘斜面区域去除金属的化学蚀刻方法和相关模块。 在晶片的边缘斜面区域上施加蚀刻剂之前，该方法和系统提供了薄层的预漂洗液体。 蚀刻剂较少稀释，并通过稀薄的冲洗液层更快地扩散。 公开了一种边缘斜面去除实施例，其涉及在减少加工时间，使金属锥度变窄并允许随后的化学机械抛光方面特别有效。
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89.发明授权公开(公告)号：US08603305B2
公开(公告)日：2013-12-10
申请号：US13051822
申请日：2011-03-18
申请人： Robert Rash , Richard Abraham , David W. Porter , Steven T. Mayer
发明人： Robert Rash , Richard Abraham , David W. Porter , Steven T. Mayer
CPC分类号： C25D5/08 , C25D5/006 , C25D17/00 , C25D17/002 , C25D21/04 , C25D21/06 , C25D21/14 , C25D21/18
摘要： An electrolyte, and particularly anolyte, may be circulated via an open loop having a pressure regulator, so that the pressure in the plating chamber is maintained at a constant (or substantially constant) value with respect to atmospheric pressure. In these embodiments, a pressure regulator is in fluid communication with the anode chamber.
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公开(公告)号：US20130292254A1
公开(公告)日：2013-11-07
申请号：US13852767
申请日：2013-03-28
申请人： Santosh Kumar , Bryan L. Buckalew , Steven T. Mayer , Thomas Ponnuswamy , Chad Michael Hosack , Robert Rash , Lee Peng Chua , David Porter
发明人： Santosh Kumar , Bryan L. Buckalew , Steven T. Mayer , Thomas Ponnuswamy , Chad Michael Hosack , Robert Rash , Lee Peng Chua , David Porter
IPC分类号： C25D17/00
CPC分类号： B08B3/022 , B08B3/041 , C25D7/12 , C25D17/00 , C25D17/001 , C25D21/00 , C25D21/12 , H01L21/67051
摘要： Disclosed herein are methods of cleaning a lipseal and/or cup bottom of an electroplating device by removing metal deposits accumulated in prior electroplating operations. The methods may include orienting a nozzle such that it is pointed substantially at the inner circular edge of the lipseal and/or cup bottom, and dispensing a stream of cleaning solution from the nozzle such that the stream contacts the inner circular edge of the lipseal and/or cup bottom while they are being rotated, removing metal deposits. In some embodiments, the stream has a velocity component against the rotational direction of the lipseal and/or cup bottom. In some embodiments, the deposits may include a tin/silver alloy. Also disclosed herein are cleaning apparatuses for mounting in electroplating devices and for removing electroplated metal deposits from their lipseals and/or cup bottoms. In some embodiments, the cleaning apparatuses may include a jet nozzle.
摘要翻译： 本文公开了通过去除在现有电镀操作中积累的金属沉积物来清洁电镀装置的唇密封和/或杯底的方法。 所述方法可以包括使喷嘴定向成使得其基本上指向唇密封件和/或杯底部的内圆形边缘，并且从喷嘴分配清洁溶液流，使得流接触唇塞的内圆形边缘，并且 /或杯底，同时旋转，去除金属沉积物。 在一些实施例中，流具有抵抗唇密封和/或杯底的旋转方向的速度分量。 在一些实施例中，沉积物可以包括锡/银合金。 本文还公开了用于安装在电镀装置中并用于从其密封件和/或杯底部去除电镀金属沉积物的清洁装置。 在一些实施例中，清洁设备可以包括喷嘴。
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