公开(公告)号：US20120206037A1

公开(公告)日：2012-08-16

申请号：US13386616

申请日：2010-07-19

申请人： Soo Young Lee ,  Young Gil Kim ,  Youngg Jun Cho ,  Hyuck Joo Kwon ,  Bong Ok Kim ,  Sung Min Kim ,  Seung Soo Yoon

发明人： Soo Young Lee ,  Young Gil Kim ,  Youngg Jun Cho ,  Hyuck Joo Kwon ,  Bong Ok Kim ,  Sung Min Kim ,  Seung Soo Yoon

IPC分类号： H05B33/14 ,  C07D403/04 ,  C07F7/10

CPC分类号： C07D471/22 ,  C07D209/82 ,  C07D209/86 ,  C07D401/04 ,  C07D471/04 ,  C07D471/14 ,  C07F7/0816 ,  C09B5/24 ,  C09B57/00 ,  C09K11/06 ,  C09K2211/1007 ,  C09K2211/1011 ,  C09K2211/1029 ,  C09K2211/1096 ,  H01L51/0067 ,  H01L51/0072 ,  H01L51/0094 ,  H01L51/5016 ,  H05B33/10

摘要： Provided are a novel organic electroluminescent compound and an organic electroluminescent device using the same.When used as a host material of an organic electroluminescent material of an OLED device, the organic electroluminescent compound disclosed herein exhibits good luminous efficiency and excellent life property as compared to the existing host material. Therefore, it may be used to manufacture OLEDs having very superior operation life.

摘要翻译： 提供了一种新颖的有机电致发光化合物和使用其的有机电致发光器件。 当用作OLED器件的有机电致发光材料的主体材料时，与现有的主体材料相比，本文公开的有机电致发光化合物表现出良好的发光效率和优异的寿命。 因此，可以用于制造具有非常优异的使用寿命的OLED。

公开(公告)号：US08107669B2

公开(公告)日：2012-01-31

申请号：US11785913

申请日：2007-04-20

申请人： Hwan Joon Kim ,  Mi Suk Huh ,  Dae Youb Kim ,  Chee Sun Won ,  Sung Min Kim

发明人： Hwan Joon Kim ,  Mi Suk Huh ,  Dae Youb Kim ,  Chee Sun Won ,  Sung Min Kim

IPC分类号： G06K9/00 ,  G06K9/36

CPC分类号： G06T1/0057 ,  G06T2201/0051 ,  H04N19/467

摘要： A video watermarking apparatus and method are provided, including an information provider for providing spatial domain segmentation information of an image with respect to a compressed video, a grouping unit for grouping the compressed video, based on the spatial domain segmentation information, and generating a grouped spatial domain, an extraction domain selector for selecting an extraction domain for extracting a watermark from the grouped spatial domain, and a watermark extractor for extracting a watermark bit inserted in the extraction domain.

摘要翻译： 提供了一种视频水印设备和方法，包括用于提供关于压缩视频的图像的空间域分割信息的信息提供器，用于基于空间域分割信息对压缩视频进行分组的分组单元，以及生成分组 空间域，用于从分组的空间域中选择用于提取水印的提取域的提取域选择器，以及用于提取插入到提取域中的水印位的水印提取器。

公开(公告)号：US08065055B2

公开(公告)日：2011-11-22

申请号：US12276160

申请日：2008-11-21

申请人： Hong Sig Kim ,  Sung Min Kim

发明人： Hong Sig Kim ,  Sung Min Kim

IPC分类号： B60G17/018

CPC分类号： F16F9/5126 ,  B60G17/06 ,  F16F9/46

摘要： Disclosed herein is a shock absorber capable of controlling damping force characteristics. The shock absorber includes a cylinder filled with an operating fluid, a piston valve disposed inside the cylinder to divide an interior of the cylinder into a first chamber and a second chamber, a piston rod having one end extending outside the cylinder and the other end coupled to the piston valve inside the cylinder, a hollow chamber formed inside the piston rod to communicate with the first and second chambers, a free piston disposed within the hollow chamber to move up and down and to divide the hollow chamber into upper and lower chambers, and a variable part configured to control the damping force characteristics by adjusting a vertical displacement of the free piston.

摘要翻译： 本文公开了一种能够控制阻尼力特性的减震器。 该减震器包括一个填充有工作流体的气缸，一个活塞阀，设置在气缸内部，以将汽缸的内部分隔成第一腔室和第二腔室;活塞杆，其一端延伸到气缸外部，另一端连接 在缸体内的活塞阀，形成在活塞杆的内部以与第一和第二腔室连通的中空室，设置在中空室内的自由活塞，上下移动并将中空室分成上下腔室， 以及可变部件，其构造成通过调节自由活塞的垂直位移来控制阻尼力特性。

公开(公告)号：US07989909B2

公开(公告)日：2011-08-02

申请号：US12329814

申请日：2008-12-08

申请人： Sung Min Kim

发明人： Sung Min Kim

IPC分类号： H01L31/0224 ,  H01L31/02

CPC分类号： H01L27/14618 ,  H01L27/14687 ,  H01L2224/13

摘要： An image sensor module includes a semiconductor chip. Photodiode units are disposed in an active region of the semiconductor chip to convert light into electric signals. Pads are disposed in a peripheral region formed around the active region and the pads are electrically connected to the photodiode units. A connecting region is formed around the peripheral region. Re-distribution layers are electrically connected to respective pads and extend to the connecting region. A transparent substrate covers the photodiode units and the pads and exposes at least a portion of the re-distribution layers. Connecting layers are electrically connected to the respective re-distribution layers and extend to a top surface of the transparent substrate. Connecting members are connected to the respective connecting layers disposed on the top surface of the transparent substrate.

摘要翻译： 图像传感器模块包括半导体芯片。 光电二极管单元设置在半导体芯片的有源区域中，以将光转换为电信号。 垫片设置在围绕有源区域形成的周边区域中，并且焊盘电连接到光电二极管单元。 围绕周边区域形成连接区域。 再分布层电连接到相应的焊盘并延伸到连接区域。 透明基板覆盖光电二极管单元和焊盘并暴露至少一部分再分布层。 连接层电连接到相应的再分布层并延伸到透明基底的顶表面。 连接构件连接到设置在透明基板的顶表面上的各个连接层。

公开(公告)号：US07834463B2

公开(公告)日：2010-11-16

申请号：US11647621

申请日：2006-12-29

申请人： Sung Min Kim ,  Min Suk Suh ,  Kwon Whan Han

发明人： Sung Min Kim ,  Min Suk Suh ,  Kwon Whan Han

IPC分类号： H01L25/065

CPC分类号： H01L25/0657 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05553 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/30105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A stack package includes an edge-pad-type first semiconductor chip having bonding pads arranged near the edges thereof. A pattern die is placed on the first semiconductor chip. The pattern die is smaller in size than the first semiconductor chip and has line-type-redistribution parts formed thereon. An edge-pad-type second semiconductor chip smaller in size than the pattern die is placed on the pattern die. Bonding wires electrically connect the bonding pads of the first semiconductor chip and the redistribution parts of the pattern die and also electrically connect the redistribution parts of the pattern die and bonding pads of the second semiconductor chip.

摘要翻译： 堆叠封装包括边缘焊盘型第一半导体芯片，其具有布置在其边缘附近的焊盘。 图案裸片放置在第一半导体芯片上。 图案芯片的尺寸小于第一半导体芯片，并且在其上形成线型再分配部件。 尺寸小于图案裸片的边缘焊盘型第二半导体芯片被放置在图案芯片上。 接合线电连接第一半导体芯片的接合焊盘和图案芯片的再分配部分，并且还将图案芯片的再分配部分和第二半导体芯片的焊盘电连接。

公开(公告)号：US20100237330A1

公开(公告)日：2010-09-23

申请号：US12451572

申请日：2008-05-08

申请人： Mi Ae Lee ,  Hyuck Joo Kwon ,  Young Jun Cho ,  Bong Ok Kim ,  Sung Min Kim

发明人： Mi Ae Lee ,  Hyuck Joo Kwon ,  Young Jun Cho ,  Bong Ok Kim ,  Sung Min Kim

IPC分类号： H01L51/54 ,  C07F7/08

CPC分类号： C09K11/06 ,  C09K2211/1007 ,  C09K2211/1011 ,  C09K2211/1014 ,  H01L51/0058 ,  H01L51/0094 ,  H01L51/5048

摘要： The present invention relates to novel organic electroluminescent compounds and organic light emitting diodes comprising the same. Since the organic electrolumescent compounds according to the invention have good luminous efficiency and life property as an electroluminescent material, OLED's having very good operation lifetime can be produced.

摘要翻译： 本发明涉及新颖的有机电致发光化合物和包含该有机电致发光化合物的有机发光二极管。 由于根据本发明的有机电致发光化合物作为电致发光材料具有良好的发光效率和寿命性质，因此可以生产具有非常好的操作寿命的OLED。

公开(公告)号：US07795139B2

公开(公告)日：2010-09-14

申请号：US11777388

申请日：2007-07-13

申请人： Kwon Whan Han ,  Chang Jun Park ,  Min Suk Suh ,  Seong Cheol Kim ,  Sung Min Kim ,  Seung Taek Yang ,  Seung Hyun Lee ,  Jong Hoon Kim ,  Ha Na Lee

发明人： Kwon Whan Han ,  Chang Jun Park ,  Min Suk Suh ,  Seong Cheol Kim ,  Sung Min Kim ,  Seung Taek Yang ,  Seung Hyun Lee ,  Jong Hoon Kim ,  Ha Na Lee

IPC分类号： H01L21/4763

CPC分类号： H01L21/76898 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/04042 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/16145 ,  H01L2224/274 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/013

摘要： A method for manufacturing a semiconductor package includes forming a groove in the portion outside of the bonding pad of a semiconductor chip provided with the bonding pad on an upper surface thereof; forming an insulation layer on the side wall of the groove; forming a metal layer over the semiconductor chip so as to fill the groove formed with the insulation layer; etching the metal layer to simultaneously form a through silicon via for filling the groove and a distribution layer for connecting the through silicon via and the bonding pad; and removing a rear surface of the semiconductor chip such that the lower surface of the through silicon via protrudes from the semiconductor chip.

摘要翻译： 一种半导体封装的制造方法，其特征在于，在设置有所述接合焊盘的半导体芯片的焊盘的外侧的部分的外表面形成有槽， 在所述槽的侧壁上形成绝缘层; 在半导体芯片上形成金属层，以填充形成有绝缘层的槽; 蚀刻金属层以同时形成用于填充槽的通过硅通孔和用于连接通过硅通孔和接合焊盘的分布层; 以及去除所述半导体芯片的后表面，使得所述贯穿硅通孔的下表面从所述半导体芯片突出。

公开(公告)号：US07795073B2

公开(公告)日：2010-09-14

申请号：US12345858

申请日：2008-12-30

申请人： Kwon Whan Han ,  Chang Jun Park ,  Seong Cheol Kim ,  Sung Min Kim ,  Hyeong Seok Choi ,  Ha Na Lee

发明人： Kwon Whan Han ,  Chang Jun Park ,  Seong Cheol Kim ,  Sung Min Kim ,  Hyeong Seok Choi ,  Ha Na Lee

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L24/16 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/11 ,  H01L24/17 ,  H01L24/90 ,  H01L24/97 ,  H01L25/50 ,  H01L2221/68372 ,  H01L2224/05001 ,  H01L2224/05548 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/90 ,  H01L2224/9202 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014

摘要： Manufacturing a wafer level stack package includes the steps of back-grinding a lower surface of a wafer including a plurality of first semiconductor chips. A support member is attached to a lower surface of the back-grinded wafer. One or more second semiconductor chips are stacked on the respective first semiconductor chips of the back-grinded wafer. First through-electrodes are formed to electrically connect the stacked first semiconductor chips and second semiconductor chips. Third semiconductor chips are attached to uppermost ones of the stacked second semiconductor chips, and the third semiconductor chips have second through-electrodes which are electrically connected to the first through-electrodes and re-distribution lines which are connected to the second through-electrodes. Outside connection terminals are attached to the re-distribution lines of the third semiconductor chips. The first semiconductor chips of a wafer level on which the second and third semiconductor chips are stacked are sawed to for semiconductor packages at a chip level.

摘要翻译： 制造晶片级堆叠封装包括对包括多个第一半导体芯片的晶片的下表面进行背面磨削的步骤。 支撑构件附接到后磨碎晶片的下表面。 一个或多个第二半导体芯片堆叠在背面研磨的晶片的相应的第一半导体芯片上。 形成第一贯通电极以电连接堆叠的第一半导体芯片和第二半导体芯片。 第三半导体芯片附着到堆叠的第二半导体芯片的最上面，并且第三半导体芯片具有与连接到第二贯通电极的第一贯通电极和再分配线电连接的第二贯通电极。 外部连接端子附接到第三半导体芯片的再分配线路。 第二半导体芯片和第三半导体芯片堆叠的晶片级的第一半导体芯片在芯片级被锯切以用于半导体封装。

公开(公告)号：US07723520B2

公开(公告)日：2010-05-25

申请号：US12220367

申请日：2008-07-24

申请人： Hyun Kim ,  Young Jun Cho ,  Hyuck Joo Kwon ,  Bong Ok Kim ,  Sung Min Kim ,  Seung Soo Yoon

发明人： Hyun Kim ,  Young Jun Cho ,  Hyuck Joo Kwon ,  Bong Ok Kim ,  Sung Min Kim ,  Seung Soo Yoon

IPC分类号： C07F15/00 ,  B32B15/00

CPC分类号： C09K11/06 ,  C07F15/0033 ,  C09K2211/1007 ,  C09K2211/1011 ,  C09K2211/1029 ,  C09K2211/185 ,  H01L51/006 ,  H01L51/0081 ,  H01L51/0085 ,  H01L51/5016 ,  Y10S428/917

摘要： The present invention relates to novel red phosphorescent compounds exhibiting high luminous efficiency, and organic electroluminescent devices comprising the same.

摘要翻译： 本发明涉及具有高发光效率的新型红色磷光化合物和包含其的有机电致发光器件。

公开(公告)号：US20090260686A1

公开(公告)日：2009-10-22

申请号：US12383763

申请日：2009-03-26

申请人： Hyo Nim Shin ,  Young Jun Cho ,  Hyuck Joo Kwon ,  Bong Ok Kim ,  Sung Min Kim ,  Seung Soo Yoon

发明人： Hyo Nim Shin ,  Young Jun Cho ,  Hyuck Joo Kwon ,  Bong Ok Kim ,  Sung Min Kim ,  Seung Soo Yoon

IPC分类号： H01L31/04 ,  H01J1/63 ,  C07D221/06 ,  C07D221/18

CPC分类号： C09K11/06 ,  C09K2211/1022 ,  C09K2211/1029 ,  Y02E10/549

摘要： The present invention relates to novel organic electroluminescent compounds, and organic electroluminescent devices employing the same as electroluminescent material. Specifically, the organic electroluminescent compounds according to the invention are characterized in that they are represented by Chemical Formula (1): wherein, A and B independently represent CR7 or N, provided that both A and B cannot be CR7 or N at the same time; and X is O or S. Since the organic electroluminescent compounds according to the invention have good luminous efficiency and excellent color purity and life property of material, OLED's having very good operation life can be manufactured therefrom.

摘要翻译： 本发明涉及新颖的有机电致发光化合物，以及将其用作电致发光材料的有机电致发光器件。 具体地说，根据本发明的有机电致发光化合物的特征在于它们由化学式（1）表示：其中A和B独立地表示CR7或N，条件是A和B两者不能同时为CR7或N ; 并且X是O或S.由于本发明的有机电致发光化合物具有良好的发光效率和优异的色纯度和材料的寿命特性，所以可以制造具有非常好的使用寿命的OLED。