摘要:
The universal platform for the SDR of the present invention employs the direct conversion approach with the n-port MMIC followed by reconfigurable reprogrammable devices such as DSP's or FPGA's. The universal platform is based on the linear operation of the devices. Thus, the DC offset problem may be solved. It is also possible to support very wide bandwidths compared with conventional I/Q receivers. Therefore, the present universal platform is suitable for multimode and multiband communications.
摘要:
A high-performance demodulator for use in UWB (Ultra WideBand) multiple-access communication is disclosed. In a communication device, the correlation between a received signal corresponding to signals transmitted from a plurality of communication terminals by means of UWB (Ultra WideBand) communication and pulses at possible positions in a signal transmitted from each communication terminal is calculated. On the basis of the resultant calculated correlation, and taking into account interference among the signals transmitted from the communication terminals, the received signal is demodulated into original data issued by the respective communication terminals.
摘要:
To realize an antenna apparatus capable of measuring a calibration factor accurately and further, capable of estimating an arrival direction of a received signal by composing a calibration circuit by using a directional coupler. The antenna system includes L-number of branch units, a calibration circuit and an operating unit. Each directional coupler composing the calibration circuit is structured symmetrically. Measuring the received signals Yti, i−1 and Yti, i+1 of i−1th and i+1th receivers, respectively, when an ith transmitter transmits a signal, on the basis of the first branch unit, the operating unit calculates a calibration factor at the ith branch unit as Hi=T1Ri/(TiR1)=Yt12Yt23−Yti−1,i/Yt21Yt32−Yti,i−1.
摘要:
A plurality of circuit cells, a plurality of matrix switch sections and a plurality of switch sections for connecting between the plurality of circuit cells, all of which form a part of a circuit cell array, and a plurality of input/output cell sections arranged around the circuit cell array all change their circuit configurations in accordance with a configuration data to be supplied. In some of these circuit blocks, at least a part of the circuit thereof is fixed at a predetermined circuit configuration, and a conversion of the configuration data based on proprietary information regarding the fixed circuit is performed at a supplier of the configuration data. Thus, a differential configuration data for portions of the circuit other than the fixed circuit portion is generated and supplied to the integrated circuit.
摘要:
The conventional semiconductor element testing equipment is arranged to position each probe accurately and need a burdensome operation for fixing, and includes only a limited number of electrode pads and chips to be tested at a batch. An equipment for testing a semiconductor element is arranged to keep each of electrode pads formed on a semiconductor element to be tested in direct contact with each of probes formed on a first substrate composed of silicon, one of electric connecting substrates disposed in the equipment. On the first substrate, each probe is formed on a cantilever and a wire is routed from a tip of each probe along a tip of the cantilever to the electrode pad formed on an opposite surface to the probe forming surface through an insulating layer.
摘要:
Signals received by antenna elements are respectively converted to lower frequency signals by the frequency converters. The lower frequency signals are then converted to the digital signals by A/D converters and supplied to a digital signal processing unit. The digital signal processing unit weights the digitized signals on the amplitude and the phase for each signal for optimally controlling the directivity. The weighted signals from the digital signal processing unit are converted to the analog signals by D/A converters and added by an adder. The added signal is then converted by a frequency converter to an original frequency of the received signals by the antenna elements.
摘要:
The directional antenna apparatus of a base station, after sensing the direction of an undesired wave, calculates the optimum amplitude weighting coefficients and optimum phase weighting coefficients for a plurality of directions between the move starting point and move end point of a mobile station and creates a reference table. Then, when receiving a request for communication from the mobile station, the directional antenna apparatus reads weighting coefficients from the reference table, sets them in each antenna element, and points the directivity toward the mobile station, and starts communication. Then, calculating the time when the mobile station arrives at the position corresponding to each direction from the destination of the mobile station and its moving speed, and reads one by one the optimum amplitude and phase weighting coefficients from the reference table, and sets them in each antenna element, and communicates with the mobile station, while tracking the mobile station.
摘要:
In an apparatus for controlling a multi-cylinder internal combustion engine with partial cylinder switch-off mechanism which is switchable between an all-cylinder operation mode in which all cylinders are operated and a partial-cylinder operation mode in which operation of partial cylinders is suspended, the operation of intake valves and exhaust valves is suspended or resumed in a predetermined order with respect to all of the suspended cylinders irrespective of a rotational frequency of the engine. There are provided a solenoid valve on an intake side and a solenoid valve on an exhaust side for switching input hydraulic pressures for hydraulically operated switching devices respectively on the intake side and on the exhaust side between the driving state and the drive-free state. At the time of switching the operation, one of the solenoid valves on the intake side and the exhaust side is driven in advance. The subsequent number of rotations of a crankshaft is counted. When the number of this counting has reached a predetermined value, the solenoid valve on the other side is driven.
摘要:
A semiconductor device, is provided will semiconductor chips having a plurality of electrodes for external connection, elastomer resin portions formed of an elastomer resin, which are bonded to the semiconductor chip excepting at least some of the plurality of electrodes, a tape layer of resin including tape wiring patterns on the surface thereof, a plurality of solder bumps for bonding the printed wiring pattern to the tape wiring patterns, leads for connecting the plurality of electrodes of the semiconductor chips to the tape wiring patterns, and seal resin for covering the leads and the plurality of electrodes which are connected by the leads. The elastomer resin has a modulus of transverse elasticity not less than 50 MPa and not more than 750 MPa.
摘要:
An electronic component unit is provided with two electronic components which are disposed in parallel with each other and each of which has an internal electric circuit therein. Electrode pads are provided on the opposed surfaces of the two electronic components and are electrically connected to the internal electric circuits. The pads on one of the electronic components are respectively electrically and mechanically connected to the corresponding pads on the other electronic component by solder bumps. The areas of the pads increase or decrease stepwise in the direction from the central portions toward the outer peripheral edges of the two electronic components, while the volumes of the solder bumps are constant. Alternatively, the volumes of the solder bumps decrease or increase in the direction from the central portions toward the outer peripheral edges of the two electronic components, while the areas of all pads are constant. Each of the pads of the two electronic components is bonded to an associated solder bump over the whole area of the pad, whereby the shapes of the solder bumps respectively connected to the pads of the two electronic components change in the direction from the central portions toward the outer peripheral edges of the two electronic components to provide the solder bumps with different durabilities to stress, thereby assuring high reliability of the connection between the two electronic components.