公开(公告)号：US08133957B2

公开(公告)日：2012-03-13

申请号：US12510491

申请日：2009-07-28

申请人： Yoshihira Hamamoto ,  Toshio Shiobara ,  Miyuki Wakao ,  Tsutomu Kashiwagi

发明人： Yoshihira Hamamoto ,  Toshio Shiobara ,  Miyuki Wakao ,  Tsutomu Kashiwagi

IPC分类号： C08G77/14

CPC分类号： C08G59/306 ,  C08G59/3254 ,  C08L83/06

摘要： A resin composition for encapsulating an optical semiconductor element that comprises components (A), (B) and (C) described below: (A) a branched silicone resin containing 2 to 6 epoxy groups, one or more (R1SiO3/2) units, two or more (R2R3SiO)n structures and 3 or more (R43-xR5xSiO1/2) units per molecule, in an amount of 100 parts by weight, wherein R1, R2, R3, R4 and R5 each represents a hydrogen atom, a hydroxyl group or a monovalent organic group of 1 to 20 carbon atoms which monovalent organic group may or may not contain an oxygen atom, provided that at least two of the R5 groups within each molecule represent an epoxy group and/or an epoxy group-containing non-aromatic group, n represents an integer of 3 to 20, and x represents an integer of 1 to 3, (B) a curing agent, in such an amount that a content of epoxy reactive groups in the component (B) ranges from 0.4 to 1.5 moles per 1 mol of epoxy groups within component (A), and (C) a curing catalyst, in an amount within a range from 0.01 to 3 parts by weight per 100 parts by weight of a combination of component (A) and component (B).

摘要翻译： 一种包含下述成分（A），（B）和（C）的光半导体元件的树脂组合物：（A）含有2〜6个环氧基的支链硅氧烷树脂，1个以上（R 1 SiO 3/2） 两个或多个（R 2 R 3 SiO）n结构和每个分子3个以上（R 43-x R 5 x SiO 1/2）单元，其量为100重量份，其中R 1，R 2，R 3，R 4和R 5各自表示氢原子，羟基 基团或1〜20个碳原子的一价有机基团，该一价有机基团可以含有或不含有氧原子，条件是每个分子中的至少两个R 5基团表示环氧基和/或含环氧基的非 - - 芳族基团，n表示3〜20的整数，x表示1〜3的整数，（B）固化剂，其量为组分（B）中环氧基反应性基团的含量为0.4 至组分（A）中每1mol环氧基团为1.5摩尔，和（C）固化催化剂，其量范围为fr 每100重量份组分（A）和组分（B）的组合0.01-1重量份。

公开(公告)号：US08124715B2

公开(公告)日：2012-02-28

申请号：US12938639

申请日：2010-11-03

申请人： Hayato Tanaka ,  Tsutomu Kashiwagi ,  Toshio Shiobara

发明人： Hayato Tanaka ,  Tsutomu Kashiwagi ,  Toshio Shiobara

IPC分类号： C08G77/20

CPC分类号： C08G77/26 ,  C07F7/0838 ,  C08G77/20 ,  H01L23/293 ,  H01L2924/0002 ,  H01L2924/00

摘要： The purpose of the present invention is to provide an isocyanuric ring-containing organopolysiloxane which can provide a cured product which can exploit the properties of a hydrosilylation (addition reaction), and is suitable for use in an encapsulating materials for an optical semiconductor. Thus, the present invention provides an organopolysiloxane having at least one isocyanuric ring in a molecule and vinyl siloxy groups at both terminals, and represented by the following formula (1): wherein X is, independently of each other, a monovalent organic group which does not have an unsaturated bond, R1 and R2 are, independently of each other, a methyl group or a phenyl group, and P is an integer of from 1 to 30.

摘要翻译： 本发明的目的是提供一种可以提供可以利用氢化硅烷化（加成反应）的性质的固化产物的异氰脲酸环的有机聚硅氧烷，并且适合用于光学半导体的封装材料。 因此，本发明提供了在分子中具有至少一个异氰脲酸酯环的两端的乙烯基甲硅烷氧基和由下式（1）表示的有机聚硅氧烷：其中，X彼此独立地为1价有机基， 不具有不饱和键，R 1和R 2彼此独立地为甲基或苯基，P为1〜30的整数。

公开(公告)号：US08057906B2

公开(公告)日：2011-11-15

申请号：US11529312

申请日：2006-09-29

申请人： Tsutomu Kashiwagi ,  Toshio Shiobara ,  Masanobu Sato ,  Koki Matsumoto

发明人： Tsutomu Kashiwagi ,  Toshio Shiobara ,  Masanobu Sato ,  Koki Matsumoto

IPC分类号： B32B9/04

CPC分类号： C08J7/047 ,  C08J2383/04 ,  C08J2483/00 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/16195 ,  Y10T428/31663 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A method of reducing surface tackiness of a silicone rubber cured product is provided. The method includes coating the surface of a cured product of a curable silicone rubber composition, which has a molar ratio within the composition of hydrogen atoms bonded to silicon atoms relative to alkenyl groups bonded to silicon atoms of 1.0 or greater, and which, following curing, exhibits a type A hardness prescribed in JIS K6253 of no more than 20, with a curable silicone resin layer which, following curing, exhibits a type D hardness prescribed in JIS K6253 of 30 or greater; and subsequently curing the silicone resin to form a cured resin layer with a thickness of no more than 0.5 mm. Adhesion of dirt to the surface can be prevented.

摘要翻译： 提供降低硅橡胶固化产物的表面粘性的方法。 该方法包括将可固化的硅橡胶组合物的固化产物的表面涂覆，该固化产物的摩尔比在与硅原子键合的氢原子的组成中相对于键合到硅原子的链烯基为1.0或更大，并且其在固化之后 表现出JIS K6253规定为不大于20的A型硬度，其中固化后的固化性有机硅树脂层表现出JIS K6253规定的D型硬度为30以上; 然后固化硅树脂以形成厚度不大于0.5mm的固化树脂层。 可以防止污垢附着到表面。

公开(公告)号：US20110241048A1

公开(公告)日：2011-10-06

申请号：US13074317

申请日：2011-03-29

申请人： Yusuke TAGUCHI ,  Toshio Shiobara

发明人： Yusuke TAGUCHI ,  Toshio Shiobara

IPC分类号： H01L33/60 ,  F21V7/22 ,  C08K3/22 ,  C08L63/00 ,  C08L83/04

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed herein is a resin composition including 100 parts by weight of an organic resin and 50 to 1,000 parts by weight of an inorganic filler, wherein 10 to 100% of the inorganic filler is composed of an oxide of a rare earth element.

摘要翻译： 本发明公开了一种树脂组合物，其包含100重量份的有机树脂和50至1,000重量份的无机填料，其中10至100重量％的无机填料由稀土元素的氧化物组成。

公开(公告)号：US20110046319A1

公开(公告)日：2011-02-24

申请号：US12860682

申请日：2010-08-20

申请人： Manabu Ueno ,  Toshio Shiobara ,  Tsutomu Kashiwagi

发明人： Manabu Ueno ,  Toshio Shiobara ,  Tsutomu Kashiwagi

IPC分类号： C08L83/06 ,  C08G77/16

CPC分类号： C08G77/50 ,  C08G77/16 ,  C08G77/18 ,  C08G77/24 ,  C08L83/14 ,  Y10T428/31663 ,  C08L83/00

摘要： The present invention provides an organopolysilmethylene represented by the following general formula (1): wherein R1 is, independently of each other, a group selected from the group consisting of an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group and a halogen atom; R2 is, independently of each other, a group selected from the group consisting of an unsubstituted or substituted monovalent hydrocarbon group having 1 to 10 carbon atoms other than an alkenyl group, an alkoxy group, a hydroxy group, a halogen atom and (R1)3SiCH2—, wherein R3 is, independently of each other, a group selected from the group consisting of a hydrogen atom and an alkyl group having 1 to 4 carbon atoms; k is an integer of 1 to 100; and n is an integer of 1 to 1000; and having, in a molecule, at least two out of alkoxy groups, hydroxy groups and halogen atoms bonded to one or more silicon atoms.

摘要翻译： 本发明提供由以下通式（1）表示的有机聚亚甲硅烷基：其中R 1彼此独立地为选自除烯基以外的未取代或取代的碳原子数1〜10的一价烃基 基团，烷氧基，羟基和卤素原子; R2彼此独立地选自除烯基，烷氧基，羟基，卤素原子以外的未取代或取代的碳原子数1〜10的一价烃基和（R1） 3SiCH 2 - ，其中R 3彼此独立地为选自氢原子和具有1至4个碳原子的烷基的基团; k为1〜100的整数， n为1〜1000的整数。 并且在一个分子中具有与一个或多个硅原子键合的烷氧基，羟基和卤素原子中的至少两个。

公开(公告)号：US07858198B2

公开(公告)日：2010-12-28

申请号：US12078909

申请日：2008-04-08

申请人： Tsutomu Kashiwagi ,  Toshio Shiobara

发明人： Tsutomu Kashiwagi ,  Toshio Shiobara

IPC分类号： B32B9/04 ,  C08L83/04

CPC分类号： C08L83/04 ,  C08G77/12 ,  C08G77/16 ,  C08G77/20 ,  C08G77/70 ,  H01L33/56 ,  Y10T428/31663 ,  C08L83/00

摘要： An addition curable adhesive silicone composition containing a phosphor dispersed uniformly therein is provided. The dispersive state of the phosphor remains stable over time. The composition, in an uncured state at room temperature, is either a solid or a semisolid, and is therefore easy to handle, and is suited to an adhesive silicone composition sheet which is able to be formed easily on an LED chip using a conventional assembly apparatus.

摘要翻译： 提供含有均匀分布的荧光体的可固化粘合性有机硅组合物。 荧光体的分散状态随时间保持稳定。 在室温未固化状态下的组合物是固体或半固体，因此易于处理，并且适用于能够使用常规组合容易地在LED芯片上形成的粘合性有机硅组合物片材 仪器。

公开(公告)号：US07683152B2

公开(公告)日：2010-03-23

申请号：US11131197

申请日：2005-05-18

申请人： Hideki Akiba ,  Nobuhiro Ichiroku ,  Toshio Shiobara

发明人： Hideki Akiba ,  Nobuhiro Ichiroku ,  Toshio Shiobara

IPC分类号： C08G77/24

CPC分类号： C08G77/455 ,  C08G73/106 ,  C08L63/00 ,  C08L79/08 ,  C08L83/10 ,  C08L2666/20 ,  C08L2666/22 ,  C08L2666/14

摘要： A partial block polyimide-polysiloxane copolymer is provided comprising repeat unit structures having structural formulae (1) and (2) wherein X is an aromatic or aliphatic ring-containing tetravalent organic radical, Y1 is a diamine residue, Y2 is a diaminosiloxane residue, Y1 and Y2 are contained in the copolymer in amounts of 99-20 mol % and 1-80 mol %, respectively, L and m each are an integer of 2-50. The copolymer has good adhesion to substrates, moisture-proof reliability and a low modulus of elasticity.

摘要翻译： 提供部分嵌段聚酰亚胺 - 聚硅氧烷共聚物，其包含具有结构式（1）和（2）的重复单元结构，其中X是含芳族或脂族环的四价有机基团，Y1是二胺残基，Y2是二氨基硅氧烷残基，Y1 和Y2分别以99-20摩尔％和1-80摩尔％的量包含在共聚物中，L和m各自为2-50的整数。 共聚物对基材的粘合性好，防潮可靠性和低弹性模量。

公开(公告)号：US20100001311A1

公开(公告)日：2010-01-07

申请号：US12496460

申请日：2009-07-01

申请人： Yusuke Taguchi ,  Toshio Shiobara

发明人： Yusuke Taguchi ,  Toshio Shiobara

IPC分类号： H01L33/00 ,  C08L63/00

CPC分类号： H01L23/49861 ,  C08G77/16 ,  C08G77/18 ,  C08L63/00 ,  C08L63/06 ,  C08L83/04 ,  C08L83/06 ,  H01L23/295 ,  H01L23/296 ,  H01L33/56 ,  H01L2924/0002 ,  C08L83/00 ,  C08L2666/14 ,  C08L2666/22 ,  H01L2924/00

摘要： A heat-curable silicone resin-epoxy resin composition that is ideal as a premolded package for a high-brightness LED or solar cell. The composition contains (A) a heat-curable silicone resin, (B) a combination of a triazine derivative epoxy resin and an acid anhydride, or a prepolymer obtained by reaction of them, (C) an inorganic filler, and (D) a curing accelerator. The composition exhibits excellent curability, and yields a uniform cured product that displays excellent retention of heat resistance and light resistance over long periods of time, and suffers minimal yellowing.

摘要翻译： 作为用于高亮度LED或太阳能电池的预先包装的理想的可热固化的有机硅树脂 - 环氧树脂组合物。 该组合物含有（A）可热固化的有机硅树脂，（B）三嗪衍生物环氧树脂和酸酐的组合，或通过它们反应获得的预聚物，（C）无机填料和（D） 固化促进剂。 该组合物表现出优异的固化性，并且产生均匀的固化产物，其在长时间内显示出优异的耐热性和耐光性保持性，并且几乎不发黄。

公开(公告)号：US07432603B2

公开(公告)日：2008-10-07

申请号：US11138378

申请日：2005-05-27

申请人： Eiichi Asano ,  Toshio Shiobara

发明人： Eiichi Asano ,  Toshio Shiobara

IPC分类号： H01L23/29 ,  C08L63/00 ,  B32B27/04 ,  B32B27/20 ,  B32B27/38 ,  H01L21/56

CPC分类号： C08G59/08 ,  C08G59/621 ,  C08G59/688 ,  Y10T428/31511 ,  Y10T428/31522 ,  Y10T428/31529

摘要： In an epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic compound, and (D) an inorganic filler, the inorganic compound (C) is an oxide of metal elements at least one of which is a metal element of Group II in the Periodic Table having a second ionization potential of up to 20 eV, typically Zn2SiO4, ZnCrO4, ZnFeO4 or ZnMoO4. When used for semiconductor encapsulation, the epoxy resin composition is highly reliable and cures into a product which is effective for minimizing electrical failure such as defective insulation due to a copper migration phenomenon.

摘要翻译： 在包含（A）环氧树脂，（B）固化剂，（C）无机化合物和（D）无机填料）的环氧树脂组合物中，无机化合物（C）是至少一种金属元素的氧化物 其中元素周期表中的II族金属元素具有高达20eV的第二电离电位，通常为Zn 2 SiO 4，ZnCrO 4， / SO 2，ZnFeO 4或ZnMoO 4。 当用于半导体封装时，环氧树脂组合物是高度可靠的并且固化成对于最小化电气故障有效的产品，例如由于铜迁移现象导致的不良绝缘。

公开(公告)号：US07345105B2

公开(公告)日：2008-03-18

申请号：US10737748

申请日：2003-12-18

申请人： Masachika Yoshino ,  Motoo Fukushima ,  Toshio Shiobara

发明人： Masachika Yoshino ,  Motoo Fukushima ,  Toshio Shiobara

IPC分类号： C08J3/00 ,  C08K3/08 ,  C08L67/00 ,  C08L79/00 ,  C08L83/00

CPC分类号： H05K3/321 ,  H05K2201/0245

摘要： A conductive adhesive composition is obtained by mixing a binder resin with 30-98 wt % based on the adhesive composition of a silver powder as a conductive agent. The silver powder contains a silver powder consisting of flat primary particles and having a massive agglomerate structure and a tap density of 0.1-1.5 g/cm3 in an amount of 30-98 wt % based on the adhesive composition. The conductive adhesive composition cures into a product having improved conductivity, adhesion, heat resistance, moisture resistance, ease of working and heat transfer.

摘要翻译： 通过将粘合剂树脂与基于作为导电剂的银粉的粘合剂组合物以30-98重量％混合来获得导电粘合剂组合物。 银粉含有由平坦的一次粒子构成的银粉，其具有大量的聚集体结构，并且基于粘合剂的30-198重量％的振实密度为0.1-1.5克/厘米3 组成。 导电性粘合剂组合物固化成具有改善的导电性，粘附性，耐热性，耐湿性，加工和热传递容易性的产品。