公开(公告)号：US20030231819A1

公开(公告)日：2003-12-18

申请号：US10170714

申请日：2002-06-12

申请人： MCNC

发明人： William Devereux Palmer ,  Richard LaBennett

IPC分类号： G02B006/12

CPC分类号： G02B6/1221 ,  G02B6/132 ,  G02B6/138 ,  G02B2006/12147 ,  G02B2006/1215

摘要： A flexible optoelectronic circuit is assembled on and released from a substrate, and therefore independent of a substrate. The substrate includes semiconductor substrates having a release layer. The release layer is etched to release the optoelectronic circuit such that the resulting circuit is flexible. Both optical elements, such as waveguides, and conductive elements are formed in layers, generally between insulating layers. The elements may be formed and patterned using standard semiconductor manufacturing techniques.

摘要翻译： 柔性光电子电路组装在衬底上并从衬底释放，因此独立于衬底。 衬底包括具有剥离层的半导体衬底。 蚀刻释放层以释放光电子电路，使得所得到的电路是柔性的。 两个光学元件，例如波导和导电元件，通常形成在绝缘层之间的层中。 元件可以使用标准半导体制造技术形成和图案化。

公开(公告)号：US20030167139A1

公开(公告)日：2003-09-04

申请号：US09842834

申请日：2001-04-26

申请人： MCNC

发明人： John C. Swartz ,  Mark W. Roberson ,  Sarah Vargas-Hurlston ,  Charles Kenneth Williams ,  Joseph E. Mancusi

IPC分类号： G06F011/00 ,  G06F015/00 ,  G01R027/00

CPC分类号： G01R31/001 ,  G01R29/0878 ,  G01R31/007

摘要： An electromagnetic emission source identification apparatus is provided, the identification apparatus comprising a sensor device, a data transmitter, and a computer device. The sensor device is configured to sense an electromagnetic emission from a source, wherein the electromagnetic emission is sensed by the sensor device as corresponding sensed emission data. The data transmitter is in communication with the sensor device and is configured to transmit the sensed emission data from the sensor device. The computer device is configured to be in communication with the data transmitter. The computer device is further configured to process digital emission data, the digital emission data corresponding to the sensed emission data, so as to determine an identification indicator, an operational characteristic indicator, and/or an accessory characteristic indicator corresponding to the source. The processed digital emission data for the source is then compared to the corresponding identification indicator, operational characteristic indicator, and/or accessory characteristic indicator of each of a plurality known sources in a database operably engaged with the computer device so as to determine a best-match known source corresponding to the source. Associated methods as well as an associated computer device and computer software program product are also provided.

摘要翻译： 提供了一种电磁发射源识别装置，该识别装置包括传感器装置，数据发送器和计算机装置。 传感器装置被配置为感测来自源的电磁发射，其中电磁辐射由传感器装置感测为对应的感测发射数据。 数据发射器与传感器设备通信并被配置为从传感器设备传输感测到的发射数据。 计算机设备被配置为与数据发送器通信。 计算机设备还被配置为处理数字发射数据，对应于所感测的发射数据的数字发射数据，以便确定对应于源的识别指示符，操作特征指示符和/或附件特征指示符。 然后将用于源的经处理的数字发射数据与可操作地与计算机设备接合的数据库中的多个已知源中的每个的相应识别指示符，操作特征指示符和/或附件特征指示符进行比较，以便确定最佳 - 匹配已知源对应的源。 还提供了相关方法以及相关联的计算机设备和计算机软件程序产品。

公开(公告)号：US20030075767A1

公开(公告)日：2003-04-24

申请号：US10045356

申请日：2001-10-23

申请人： MCNC

发明人： John M. Lannon JR. ,  David E. Dausch ,  Dorota Temple

IPC分类号： H01L027/14 ,  H01L029/82 ,  H01L029/84

CPC分类号： B82Y25/00 ,  G01J4/00 ,  H01F10/3254 ,  H01F41/325 ,  H01L31/0216 ,  H01L31/02327

摘要： The present invention provides for an improved polarized-light detector device. The device comprises a photodiode having a first contact disposed on the backside of a light-sensing medium and a second contact disposed on the frontside of the light-sensing medium. A spin filter medium is disposed between the backside of the light-sensing medium and the first contact. The application of a magnetic field aligns the magnetic moments in the spin-filter medium to cause the device to discriminate between different polarizations of an optical signal. The polarization discrimination is affected by introducing a net magnetization into the spin filter medium, thereby allowing selected spin-polarized electrons to either be transmitted through the spin filter medium to the point of detection or deflected from further transmission. Additionally, the invention is embodied in a polarization-selective-light detector array and methods for discriminating a polarized optical signal and selective optical wavelength detection.

摘要翻译： 本发明提供一种改进的偏振光检测器装置。 该装置包括光电二极管，其具有设置在光感测介质的背面上的第一触点和设置在光感测介质的前侧上的第二触点。 旋转过滤介质设置在光感测介质的背面与第一接触件之间。 磁场的应用使自旋滤波器介质中的磁矩对准以使器件鉴别光信号的不同极化。 通过向自旋过滤介质中引入净磁化，从而允许选定的自旋极化电子通过自旋过滤介质传输到检测点或进一步传输偏转，影响极化鉴别。 此外，本发明体现在偏振选择光检测器阵列中以及用于鉴别偏振光信号和选择性光波长检测的方法。

公开(公告)号：US20020089254A1

公开(公告)日：2002-07-11

申请号：US10053439

申请日：2002-01-16

申请人： MCNC

发明人： David E. Dausch ,  Gary E. McGuire

IPC分类号： H02N002/00 ,  H01L041/04

CPC分类号： H01H50/005 ,  H01H57/00 ,  H01H2057/006 ,  H01L41/0973

摘要： A miniature electrical relay including a piezoelectric actuating element where the piezoelectric actuating element includes a piezoelectric thin-film material sandwiched in between two metal electrode layers that function as piezoelectric electrodes. The metal electrode layers are connected to a positive and negative terminal, respectively, of a power source, which results in actuation of the piezoelectric actuating element. The piezoelectric actuating element is affixed to a deformable metal contact through an insulating layer, such that when actuated, the piezoelectric actuating element selectively deforms the deformable metal contact to cause the contact to move into or out of electrical and mechanical connection with a fixed metal contact. A method of making the miniature piezoelectric includes providing a support structure, depositing a first contact on a first portion of the support structure, depositing a second contact on a second portion of the support structure, wherein the second contact is deformable with respect to the first contact for selectively engaging the first contact, and fabricating a piezoelectric actuator that selectively deforms the second contact relative to the first contact.

摘要翻译： 一种包括压电致动元件的微型继电器，其中压电致动元件包括夹在两个用作压电电极的金属电极层之间的压电薄膜材料。 金属电极层分别连接到电源的正极和负极端子，这导致压电致动元件的致动。 压电致动元件通过绝缘层固定到可变形的金属接触件上，使得当致动时，压电致动元件选择性地使可变形的金属接触件变形，以使接触件进入或移出与固定金属接触件的电和机械连接 。 制造微型压电体的方法包括提供支撑结构，在支撑结构的第一部分上沉积第一触点，在支撑结构的第二部分上沉积第二触点，其中第二触点相对于第一触点可变形 用于选择性地接合第一接触件，以及制造压电致动器，其选择性地相对于第一接触件使第二接触件变形。

公开(公告)号：US6124663A

公开(公告)日：2000-09-26

申请号：US382790

申请日：1999-08-25

申请人： John M. Haake ,  Vijayakumar R. Dhuler ,  Robert L. Wood

发明人： John M. Haake ,  Vijayakumar R. Dhuler ,  Robert L. Wood

IPC分类号： G02B6/35 ,  G02B6/42 ,  H01L37/00 ,  H03H37/32

CPC分类号： G02B6/3508 ,  G02B6/4226 ,  G02B6/3544 ,  G02B6/3576 ,  G02B6/3584 ,  G02B6/3596

摘要： A fiber optic connector is provided that is capable of precisely aligning an optical fiber with another optical element by using a MEMS positioning apparatus subsystem capable of being manufactured in an affordable, repeatable and reliable manner which can precisely microposition an optical fiber relative to another optical element in each of the X, Y and Z directions.

摘要翻译： 提供一种光纤连接器，其能够通过使用能够以可承受的，可重复和可靠的方式制造的MEMS定位装置子系统来将光纤与另一光学元件精确对准，其可以相对于另一光学元件精确地定位光纤 在X，Y和Z方向中的每一个。

公开(公告)号：US6025767A

公开(公告)日：2000-02-15

申请号：US692502

申请日：1996-08-05

申请人： Mark D. Kellam ,  Michele J. Berry

发明人： Mark D. Kellam ,  Michele J. Berry

IPC分类号： B81B3/00 ,  B81C1/00 ,  B81C3/00 ,  H01H1/66 ,  H01H11/00 ,  H01H45/02 ,  H01H50/00 ,  H01H50/02 ,  H01H67/02

CPC分类号： H01H50/005 ,  H01H1/66 ,  H01H2050/025

摘要： A micro-relay module includes a substrate and a lid in spaced apart relation, and a solder ring which bonds the lid to the substrate to define a chamber therebetween. A micromachined relay is integrally formed on the substrate or on the lid within the chamber. A gas is contained in the chamber at a gas pressure which is above atmospheric pressure. Input/output pads are included outside the chamber and electrically connected to the micromachined relay. Large numbers of encapsulated modules may be fabricated on a single substrate by integrally forming an array of relays on a face of a first substrate. A second substrate is placed adjacent the face with a corresponding array of solder rings therebetween, such that a respective solder ring surrounds a respective relay. The solder rings are reflowed in a gas atmosphere which is above atmospheric pressure to thereby form an array of high pressure gas encapsulating chambers. The first and second substrates are then singulated for form a plurality of individual micro-relay modules.

摘要翻译： 微型继电器模块包括基板和间隔开的盖子，以及焊接环，其将盖子结合到基板以在其间限定室。 微机械继电器一体地形成在基板上或室内的盖上。 气体在高于大气压的气体压力下容纳在腔室中。 输入/输出焊盘包括在室外，并电连接到微加工继电器。 通过在第一衬底的表面上整合形成继电器阵列，可以在单个衬底上制造大量的封装模块。 第二衬底被放置成与面对相邻的焊接环阵列相邻，使得相应的焊锡环围绕相应的继电器。 焊锡环在高于大气压的气体气氛中回流，从而形成高压气体封装室阵列。 然后将第一和第二衬底分成多个单独的微型继电器模块。

公开(公告)号：US5909078A

公开(公告)日：1999-06-01

申请号：US767192

申请日：1996-12-16

申请人： Robert L. Wood ,  Vijayakumar R. Dhuler

发明人： Robert L. Wood ,  Vijayakumar R. Dhuler

IPC分类号： B81B3/00 ,  F03G7/06 ,  G02B6/38 ,  G02B6/42 ,  H01H1/00 ,  H01H9/14 ,  H01H61/00 ,  H02N11/00 ,  F01L1/00 ,  H01G7/00

CPC分类号： F03G7/06 ,  B81B3/0024 ,  B81B2201/031 ,  B81B2201/054 ,  B81B2203/0109 ,  B81B2203/051 ,  G02B6/3803 ,  G02B6/4226 ,  H01H1/0036 ,  H01H2001/0042 ,  H01H2001/0068 ,  H01H2061/006 ,  H01H61/00 ,  H01H9/14

摘要： Microelectromechanical actuators include at least one arched beam which extends between spaced apart supports on a microelectronic substrate. The arched beams are arched in a predetermined direction and expand upon application of heat thereto. A coupler mechanically couples the plurality of arched beams between the spaced apart supports. Heat is applied to at least one of the arched beams to cause further arching as a result of thermal expansion thereof, and thereby cause displacement of the coupler along the predetermined direction. Internal heating of the arched beams by passing current through the arched beams may be used. External heating sources may also be used. The coupler may be attached to a capacitor plate to provide capacitive sensors such as flow sensors. The coupler may also be attached to a valve plate to provide microvalves. Compensating arched beams may be used to provide ambient temperature insensitivity.

摘要翻译： 微机电致动器包括至少一个拱形梁，其在微电子衬底上的间隔开的支撑件之间延伸。 拱形梁在预定方向上拱形并且在施加热量时膨胀。 耦合器在间隔开的支撑件之间机械耦合多个拱形梁。 对至少一个拱形梁施加热量，由于其热膨胀而导致进一步的拱起，从而引起联接器沿着预定方向的位移。 可以使用通过拱形梁使电流通过拱形梁的内部加热。 也可以使用外部加热源。 耦合器可以附接到电容器板以提供诸如流量传感器的电容式传感器。 联接器还可以附接到阀板以提供微型阀。 补偿拱形梁可用于提供环境温度不敏感性。

公开(公告)号：US5767010A

公开(公告)日：1998-06-16

申请号：US744122

申请日：1996-11-05

申请人： Joseph Daniel Mis ,  Gretchen Maerker Adema ,  Mark D. Kellam ,  W. Boyd Rogers

发明人： Joseph Daniel Mis ,  Gretchen Maerker Adema ,  Mark D. Kellam ,  W. Boyd Rogers

IPC分类号： H01L21/288 ,  H01L21/60 ,  H01L23/485 ,  H01L21/44

CPC分类号： H01L24/03 ,  H01L21/2885 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05147 ,  H01L2224/05171 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/10145 ,  H01L2224/11001 ,  H01L2224/11462 ,  H01L2224/11472 ,  H01L2224/11474 ,  H01L2224/11849 ,  H01L2224/13116 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14

摘要： A method for fabricating solder bumps on a microelectronic device having contact pads includes the steps of depositing a titanium barrier layer on the device, forming an under bump metallurgy layer on the titanium barrier layer, and forming one or more solder bumps on the under bump metallurgy layer. The solder bump or bumps define exposed portions of the under bump metallurgy layer which are removed, and then the exposed portion of the titanium barrier layer is removed. The titanium barrier layer protects the underlying microelectronic device from the etchants used to remove the under bump metallurgy layer. The titanium layer also prevents the under bump metallurgy layer from forming a residue on the underlying microelectronic device. Accordingly, the titanium barrier layer allows the under bump metallurgy layer to be quickly removed without leaving residual matter thereby reducing the possibility of electrical shorts between solder bumps.

摘要翻译： 一种用于在具有接触焊盘的微电子器件上制造焊料凸块的方法包括以下步骤：在该器件上沉积钛阻挡层，在该钛阻挡层上形成凸块下的冶金层，以及在该凸起下的冶金学上形成一个或多个焊料凸点 层。 焊料凸块或凸点限定突出的冶金层的暴露部分被去除，然后去除钛阻挡层的暴露部分。 钛阻挡层保护下面的微电子器件不被用于去除凸块下金属层的蚀刻剂。 钛层还防止下凸块冶金层在下面的微电子器件上形成残留物。 因此，钛阻挡层允许下凸块冶金层快速去除而不留下残留物，从而减少焊料凸块之间的电短路的可能性。

公开(公告)号：US5638469A

公开(公告)日：1997-06-10

申请号：US108042

申请日：1993-08-16

申请人： Michael R. Feldman ,  Iwona Turlik ,  Gretchen M. Adema

发明人： Michael R. Feldman ,  Iwona Turlik ,  Gretchen M. Adema

IPC分类号： G02B6/10 ,  G02B6/42 ,  G02B6/43 ,  H01L23/48 ,  G03H1/00

CPC分类号： H01L24/73 ,  G02B6/43 ,  H01L23/48 ,  G02B6/4232 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15192

摘要： A multichip module having high density optical and electrical interconnections between integrated circuit chips includes a substrate overlaying an array of integrated circuit chips. An optical transmitter generates a first optical beam through the substrate and an optical detector receives a second optical beam through the substrate. A hologram is positioned in the path of at least one of the first and second optical beams. An array of electrical contact pads is located on the substrate corresponding to the array of electrical contact pads on the respective integrated circuit chips. A pattern of electrical interconnection lines is located on the substrate for electrically interconnecting the integrated circuit chips. A solder bump between electrical contact pads on the substrate and on the integrated circuit chips establish electrical connections between the substrate and the integrated circuit chips, and also facilitate alignment of the integrated circuit chips with respect to the substrate. The optical transmitter and detector may be mounted on/in the substrate or on/in the integrated circuit chips. The optical transmitter and detector may also be used to provide optical connections external to the microelectronic module, using a holographic substrate to optically link modules. The substrate may also be used to establish optical alignment of the hologram to an underlying optical emitter and/or optical detector without establishing electrical connections thereto.

摘要翻译： 在集成电路芯片之间具有高密度光电互连的多芯片模块包括覆盖集成电路芯片阵列的衬底。 光学发射器通过衬底产生第一光束，并且光学检测器接收穿过衬底的第二光束。 全息图位于第一和第二光束中的至少一个光路的路径中。 电接触焊盘的阵列位于相应于相应集成电路芯片上的电接触焊盘阵列的衬底上。 电互连线的图案位于基板上，用于电连接集成电路芯片。 衬底上和集成电路芯片之间的电接触焊盘之间的焊料凸块建立了衬底和集成电路芯片之间的电连接，并且还有助于集成电路芯片相对于衬底的对准。 光发射机和检测器可以安装在基板上或集成电路芯片中/之上。 光学发射器和检测器也可用于提供微电子模块外部的光学连接，使用全息基板来光学连接模块。 衬底也可用于建立全息图与下面的光发射器和/或光学检测器的光学对准，而不建立与其的电连接。

公开(公告)号：US5479061A

公开(公告)日：1995-12-26

申请号：US999161

申请日：1992-12-31

申请人： Stephen M. Bobbio ,  Thomas D. DuBois ,  Bruce W. Dudley ,  Susan K. Jones ,  Mark D. Kellam ,  Farid M. Tranjan

发明人： Stephen M. Bobbio ,  Thomas D. DuBois ,  Bruce W. Dudley ,  Susan K. Jones ,  Mark D. Kellam ,  Farid M. Tranjan

IPC分类号： H02N1/00

CPC分类号： H02N1/006

摘要： An electrically and mechanically robust microelectromechanical transducer is formed of a pleated dielectric sheet having patterned electrical conductors on the opposing faces thereof. The pleats define a plurality of spaced apart walls, with each wall including an electrically conductive portion at one side thereof. Positive and negative voltages, applied to opposite faces of the pleated sheet, cause the walls to move towards one another by electrostatic attraction. The walls can also move away from one another by electrostatic repulsion upon application of appropriate voltages. The microelectromechanical transducer may be fabricated by fabricating a sheet with integral pleats or by forming a "self-pleating" flat sheet which forms pleats after conductor fabrication thereon.

摘要翻译： 电和机械鲁棒的微电子机械换能器由在其相对面上具有图案化电导体的折叠电介质片形成。 褶皱限定多个间隔开的壁，每个壁在其一侧包括导电部分。 施加到打褶片的相对面的正电压和负电压导致壁通过静电吸引而相互移动。 在施加适当的电压时，壁也可以通过静电排斥而相互远离。 微机电换能器可以通过制造具有整体褶皱的片材或者通过形成在其上制造导体之后形成褶皱的“自打褶”平板来制造。