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    Wiring unit
    81.
    发明申请
    Wiring unit 失效
    接线单元

    公开(公告)号：US20020007967A1

    公开(公告)日：2002-01-24

    申请号：US09887093

    申请日：2001-06-25

    Applicant: Yazaki Corporation

    Inventor： Makoto Yamanashi ,  Takao Murakami ,  Hiroyuki Suzuki

    IPC: H05K001/11

    CPC classification number: H01R12/774 ,  H01R12/523 ,  H01R12/613 ,  H01R12/78 ,  H05K3/368 ,  H05K2201/10303 ,  H05K2201/10333 ,  H05K2201/10962

    Abstract: A wiring unit 1 is provided with a plurality of printed circuit boards 2 which are successively stacked and pin units 3. The printed circuit boards 2 each has a conductor pattern 7 formed on the surface 6a of an insulating plate 6. The conductor pattern 7 is composed of a first plurality of belt-like conductors 11 and a second plurality of belt-like conductors 12. Through-holes 13 are formed at points 14 where the belt-like conductors 11 and 12 cross each other. The pin units 21 each is composed of a conductive pin 20 and a C-bush 21. The C-bush 21 is provided with a pair of spring segment segments 24. The C-bush 21 is press-fit into the through-hole 13 to sandwich the printed circuit board 2 between the pair of spring segments 24. The C-bush 21 is communicated with the conductor pattern 7. The pin 20 is inserted into the through-hole 13 into which the C-bush 21 is press-fit. The conductive pin 20 is communicated with the C-bush 21. In this configuration, the wiring unit can be minimized in production cost and size.

    Abstract translation: 布线单元1设置有多个依次堆叠的印刷电路板2和针单元3.印刷电路板2各自具有形成在绝缘板6的表面6a上的导体图案7.导体图案7是 由第一多个带状导体11和第二多个带状导体12组成。在带状导体11和12彼此交叉的点14处形成通孔13。 销单元21各自由导电销20和C形衬套21构成.C-衬套21设置有一对弹簧段段24.将C形衬套21压配合到通孔13中 将印刷电路板2夹在该对弹簧片24之间.C-衬套21与导体图形7连通。销20被插入通孔13中，C衬套21被压入其中 。 导电销20与C型衬套21连通。在这种结构中，布线单元的生产成本和尺寸可以最小化。

    Ball grid array package with detachable module
    82.
    发明授权
    Ball grid array package with detachable module 失效
    具有可拆卸模块的球栅阵列封装

    公开(公告)号：US5642265A

    公开(公告)日：1997-06-24

    申请号：US346499

    申请日：1994-11-29

    Applicant: Robert H. Bond ,  Harry M. Siegel

    Inventor： Robert H. Bond ,  Harry M. Siegel

    IPC: H01L23/58 ,  H05K1/18 ,  H05K3/30 ,  H05K3/32 ,  H05K7/10 ,  H05K7/02

    CPC classification number: H05K3/301 ,  H01L23/58 ,  H05K1/181 ,  H05K7/1092 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K2201/10037 ,  H05K2201/10068 ,  H05K2201/10333 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K3/325 ,  Y02P70/611 ,  Y10T29/49144

    Abstract: A system for packaging integrated circuit components including a ball grid array substrate with a plurality of solder balls coupled to the substrate. A semiconductor device is mounted on the substrate and electrically coupled to the solder balls. One or more terminals are coupled to the substrate and electrically coupled to said semiconductor device. A detachable module contains auxiliary component. The module comprises a body portion for containing the component and one or more electrical connectors for mating with respective terminals to hold the module to the substrate and to electrically couple the component with the semiconductor device. The terminals may also be connected to the solder balls such that a component may be optionally provided either on the circuit board or in the detachable module.

    Abstract translation: 一种用于封装集成电路部件的系统，包括具有耦合到所述衬底的多个焊球的球栅阵列衬底。 半导体器件安装在衬底上并电耦合到焊球。 一个或多个端子耦合到衬底并电耦合到所述半导体器件。 可拆卸模块包含辅助部件。 模块包括用于容纳部件的主体部分和用于与各个端子配合的一个或多个电连接器，以将模块保持在基板上，并将部件与半导体器件电耦合。 端子也可以连接到焊球，使得部件可以可选地设置在电路板上或可拆卸模块中。

    Panel board
    83.
    发明授权
    Panel board 失效
    面板

    公开(公告)号：US5159536A

    公开(公告)日：1992-10-27

    申请号：US193924

    申请日：1988-05-13

    Applicant: Shaun D. Silverio

    Inventor： Shaun D. Silverio

    IPC: H05K1/00 ,  H05K1/02 ,  H05K3/22 ,  H05K7/08

    CPC classification number: H05K1/0262 ,  H05K3/222 ,  H05K7/08 ,  H05K1/0287 ,  H05K2201/093 ,  H05K2201/09609 ,  H05K2201/10287 ,  H05K2201/10333 ,  H05K2201/10689

    Abstract: A multilayer panel board for mounting electronic components that have respectively different voltage requirements at specific leads of the components; in the board, conductive layers carry the different voltages across the board; terminals at locations across the board receive leads of the electronic components, some of these terminals being electrically connected directly to selected conductive layers at the locations to deliver corresponding voltages from the conductive layers to the specific leads; and the terminals are arranged in a pattern that permits at least one common region of the board to be occupied at a given time by any one of at least two different types of electronic components having respectively different voltage requirements, with the voltage requirements of the electronic component at the specific leads being served directly from the conductive layers via the terminals, whereby the common region need not be committed in advance to serve only one type of electronic component. In another aspect, a multilayer panel board has rows and columns of electrical socket terminals for receiving component pins; at least some of the rows are spaced apart from the next adjacent row by a spacing that is the same as the spacing between the parallel rows of pins of one type of component, and at least some of the columns are spaced apart from the next adjacent column by a spacing that is the same as the spacing between the parallel rows of pins of another type of component. In another aspect, at least one exposed conductive layer includes an electrically isolated region that can be dedicated to a voltage different from the remainder of the conductive layer.

    Abstract translation: 一种用于安装在组件的特定引线上具有不同电压要求的电子部件的多层面板板; 在电路板上，导电层承载不同电压; 位于整个电路板的位置的端子接收电子部件的引线，这些端子中的一些端子在位置处直接电连接到选定的导电层，以将相应的电压从导电层递送到特定引线; 并且端子被布置成图案，其允许板的至少一个公共区域在给定时间由具有不同电压要求的至少两种不同类型的电子部件中的任何一种而被占用，电子元件的电压要求 通过端子直接从导电层提供特定引线的分量，由此公共区域不需要预先提交以仅服务于一种类型的电子部件。 在另一方面，多层面板板具有用于接收组件销的电插座端子的行和列; 至少一些行与下一个相邻的行间隔开一个间隔，该间隔与一种类型的部件的销的平行排之间的间隔相同，并且至少一些列与下一个相邻的行间隔开 列的间隔与另一种类型的部件的销的平行排列之间的间隔相同。 在另一方面，至少一个暴露的导电层包括可以专用于与导电层的其余部分不同的电压的电隔离区域。

    Electrical junction box and method for its manufacture
    84.
    发明授权
    Electrical junction box and method for its manufacture 失效
    电接线盒及其制造方法

    公开(公告)号：US4944684A

    公开(公告)日：1990-07-31

    申请号：US212966

    申请日：1988-06-28

    Applicant: Joseph D. Leibowitz

    Inventor： Joseph D. Leibowitz

    IPC: H01R9/24 ,  H01R31/02 ,  H05K1/00 ,  H05K1/02 ,  H05K3/30 ,  H05K3/46 ,  H05K7/02

    CPC classification number: H05K3/4611 ,  H01R31/02 ,  H05K1/0263 ,  H05K7/026 ,  H01R9/2466 ,  H05K1/0298 ,  H05K2201/0352 ,  H05K2201/10295 ,  H05K2201/10333 ,  H05K2201/1059 ,  H05K3/308

    Abstract: An improved electrical junction box includes a housing, a multilayer printed circuit board supported by the interior of the housing and an array of electrical connectors supported by the exterior of the housing. The electrical connectors make electrical contact with one or more circuit traces in the multilayer circuit board. The circuit traces are of varying thicknesses according to the current levels to be conducted by the traces, thus minimizing the amount of copper required to fabricate the junction box. The circuit traces with the greater thicknesses are positioned in the outer layers of the circuit board to enhance heat dissipation from the circuit board.

    Abstract translation: 改进的电接线盒包括壳体，由壳体的内部支撑的多层印刷电路板和由壳体的外部支撑的电连接器阵列。 电连接器与多层电路板中的一个或多个电路迹线电接触。 电路迹线根据由走线进行的电流水平而具有不同的厚度，从而最小化制造接线盒所需的铜的量。 具有较大厚度的电路迹线位于电路板的外层中，以增强电路板的散热。

    Terminal positioning method and construction
    85.
    再颁专利
    Terminal positioning method and construction 失效
    终端定位方法与施工

    公开(公告)号：USRE32540E

    公开(公告)日：1987-11-10

    申请号：US839957

    申请日：1986-03-17

    Applicant: James V. Murphy

    Inventor： James V. Murphy

    IPC: B65D73/00 ,  B65D73/02 ,  H01R4/02 ,  H01R43/20 ,  H05K3/30

    CPC classification number: H05K3/306 ,  B65D73/0042 ,  H01R12/58 ,  H01R4/02 ,  H01R43/205 ,  H05K2201/10333 ,  H05K2201/10424 ,  H05K2203/0195 ,  Y10T29/49153

    Abstract: An improved method and construction for positioning a plurality of socket terminals on an electrical circuit board in a predetermined configuration prior to the solder connection thereto. A sheet of electrically insulative, flexible, resinous plastic material is provided with a plurality of holes in an array conforming to the desired positioning of the sockets on the circuit boards. The socket terminals are provided with an enlarged generally cylindrical head including an intermediate groove such that the heads extend into the holes and are adapted for frictional snap engagement with the sheet. The sheet with the array of sockets temporarily held thereby is positioned on the circuit board which is then conventionally soldered so as to electrically and mechanically fix the sockets to the board. Thereafter, the sheet may be removed. The enlarged head of the circuit terminal is provided with leading edge sheet contacting surface to enable the terminals to be push positioned into the holes without injuring the sheet.

    Strip for holding and protecting electrical contacts
    86.
    发明授权
    Strip for holding and protecting electrical contacts 失效
    用于保持和保护电气触点的带子

    公开(公告)号：US4615927A

    公开(公告)日：1986-10-07

    申请号：US715133

    申请日：1985-03-22

    Applicant: Hubert A. Holzmann

    Inventor： Hubert A. Holzmann

    IPC: H01R43/02 ,  H01R12/04 ,  H01R12/34 ,  H01R13/436 ,  H01R43/20 ,  H05K3/30 ,  H05K3/34 ,  B65D73/02

    CPC classification number: H01R43/205 ,  H05K3/306 ,  H01R13/436 ,  H05K2201/10333 ,  H05K2201/10424 ,  H05K3/301 ,  Y10S269/903 ,  Y10T428/1397

    Abstract: The contacts (4) have a body (4a) intended to pass through an opening in a card (5) and to be brazed on one side (5a) thereof, and a head (4b) of larger width than the body (4a), intended to be positioned on the other side (5b) of the card, this head (4b) being intended to receive a complementary contact.The strip is formed of a band (1) of plastic material resisting the heat released during brazing and having cells (2) opening on one side, these cells being adapted to receive sealingly, by elastic deformation, the heads (4b) of the contacts (4) and being spaced apart according to a given pitch.With this type of strip, a large number of contacts (4) can be positioned in a single operation on a printed circuit card (5), the heads (4b) of the contacts being protected during the brazing and washing operations from contaminants.

    Abstract translation: 触头（4）具有用于穿过卡（5）中的开口并被钎焊在其一侧（5a）上的主体（4a）和宽度大于主体（4a）的头部（4b） ，旨在定位在卡的另一侧（5b）上，该头部（4b）旨在接收互补触点。 带材由塑料材料的带（1）形成，抵抗钎焊期间释放的热量并且具有在一侧开口的电池（2），这些电池适于通过弹性变形密封地接触触头的头部（4b） （4）并且根据给定的间距间隔开。 对于这种类型的条，可以在印刷电路卡（5）上的单个操作中定位大量的触点（4），在由钎焊和洗涤操作期间，触点的头部（4b）被污染物保护。

    Miniature socket assembly
    87.
    发明授权
    Miniature socket assembly 失效
    微型插座总成

    公开(公告)号：US4037899A

    公开(公告)日：1977-07-26

    申请号：US644666

    申请日：1975-12-29

    Applicant: Kenneth E. Crowell

    Inventor： Kenneth E. Crowell

    IPC: H01R12/55 ,  H05K3/34 ,  H05K1/10

    CPC classification number: H05K3/3452 ,  H01R12/58 ,  H01R12/718 ,  H05K2201/10333 ,  H05K2203/0557

    Abstract: An improved socket assembly is disclosed which is especially suited for use with printed circuitry. The socket is mounted on an associated printed circuit board and is adapted to receive and retain guide pins of electronic circuit modules or the like. The socket assembly further includes a non-metallic insert, such as Teflon or equivalent material, which is introduced into the socket before soldering. The insert is unaffected by the molten solder or flux and prevents entry of contaminating material into the interior of the socket during the soldering process. The insert is removable by the insertion of a module guide pin during assembly of the component mounting board.

    Abstract translation: 公开了一种改进的插座组件，其特别适用于印刷电路。 插座安装在相关的印刷电路板上，并且适于接收和保持电子电路模块等的引导销。 插座组件还包括非金属插入件，例如特氟隆或等效材料，其在焊接之前被引入插座中。 插入件不受熔融焊料或焊剂的影响，并防止在焊接过程中污染材料进入插座内部。 通过在组件安装板的组装过程中插入模块导销可以拆卸插入件。

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