Cleaning liquid composition
    1.
    发明授权

    公开(公告)号:US11279904B2

    公开(公告)日:2022-03-22

    申请号:US16473625

    申请日:2017-12-26

    摘要: Provided is a cleaning liquid composition which is useful for cleaning of a substrate or the like that has been subjected to a chemical mechanical polishing (CMP) process, etc in the production steps of an electronic device such as a semiconductor element. A cleaning liquid composition according to the present invention is used for the purpose of cleaning a substrate that has a Cu wiring, and comprises one or more basic compounds and one or more nitrogen-containing monocyclic heterocyclic aromatic compounds that contain one or more carboxyl groups or ester groups, provided that in cases where one or more amino groups are contained therein, only amino groups directly bonded to a nitrogen-containing heterocyclic rind are contained. This cleaning liquid composition has a hydrogen ion concentration (pH) of 8-12.

    CLEANING LIQUID COMPOSITION
    7.
    发明申请
    CLEANING LIQUID COMPOSITION 审中-公开
    清洁液体组合物

    公开(公告)号:US20160083675A1

    公开(公告)日:2016-03-24

    申请号:US14784983

    申请日:2014-04-07

    IPC分类号: C11D7/32 H01L21/02 C11D7/36

    摘要: The purpose of the present invention is to provide a cleaning liquid composition useful in cleaning substrates, etc., which have undergone treatment such as chemical mechanical polishing (CMP) in a process for manufacturing electronic devices such as semiconductor elements. This cleaning liquid composition for cleaning substrates having Cu wiring includes one or more basic compounds and one or more heteromonocyclic aromatic compounds containing a nitrogen atom, and has a hydrogen ion concentration (pH) of 8-11.

    摘要翻译: 本发明的目的是提供一种清洁液体组合物,其用于清洁在半导体元件等电子器件的制造工序中经过化学机械研磨(CMP)等处理的基板等。 用于清洗具有Cu布线的基板的清洗液组合物包括一种或多种碱性化合物和一种或多种含有氮原子的杂环芳族化合物,其氢离子浓度(pH)为8-11。

    Etching solution composition for metal thin film consisting primarily of copper
    8.
    发明授权
    Etching solution composition for metal thin film consisting primarily of copper 失效
    主要由铜组成的金属薄膜蚀刻溶液组成

    公开(公告)号:US08580136B2

    公开(公告)日:2013-11-12

    申请号:US13358226

    申请日:2012-01-25

    CPC分类号: C23F1/18

    摘要: The problem of the present invention is to provide an etching solution composition that can etch with high accuracy a metal-laminated film pattern comprising thin films of copper and a copper alloy, can form an excellent pattern shape, and has practically excellent and stable characteristics with long solution life, and to provide an etching method using such etching solution composition. The present invention relates to an etching method for etching a metal-laminated film having a layer consisting of copper and a layer consisting of a copper alloy containing copper, using an etching solution composition comprising phosphoric acid, nitric acid, acetic acid and water, as well as to said etching solution composition.

    摘要翻译: 本发明的问题是提供一种可以高精度地蚀刻包含铜和铜合金薄膜的金属层叠膜图案的蚀刻溶液组合物,可以形成优异的图案形状,并且具有实际上优异且稳定的特性, 长的溶液寿命,并提供使用这种蚀刻溶液组合物的蚀刻方法。 本发明涉及使用包含磷酸,硝酸,乙酸和水的蚀刻溶液组合物蚀刻具有由铜构成的层的金属层压膜和含有铜的铜合金的层的蚀刻方法,作为 以及所述蚀刻溶液组合物。

    PHOTORESIST RESIDUE AND POLYMER RESIDUE REMOVING LIQUID COMPOSITION
    9.
    发明申请
    PHOTORESIST RESIDUE AND POLYMER RESIDUE REMOVING LIQUID COMPOSITION 审中-公开
    光催化剂残留物和聚合物残留物去除液体组合物

    公开(公告)号:US20130231271A1

    公开(公告)日:2013-09-05

    申请号:US13820265

    申请日:2011-09-02

    申请人: Takuo Ohwada

    发明人: Takuo Ohwada

    IPC分类号: G03F7/42 C11D7/26

    摘要: Provided are a photoresist residue and polymer residue removing liquid composition, and a method of removing the residue used therewith, for removing photoresist residue and polymer residue produced during a process of manufacturing a semiconductor circuit element having metallic wiring. Specifically, the composition does not contain nitrogen-containing organic hydroxyl compounds, ammonia or fluorine compounds, and contains an aliphatic polycarboxylic acid having a melting point of 25° C. or higher with an excellent residue removing property and having a metallic oxide main component as the residue removing component. The photoresist residue and polymer residue removing liquid composition, and the method of removing the residue used therewith, is capable of preventing the aliphatic polycarboxylic acid from being recrystallized by evaporation of water after a solution has adhered around a cleaning device liquid ejecting nozzle or a cleaning tank and a chamber. In the photoresist residue and polymer residue removing liquid composition containing the aliphatic polycarboxylic acid with a melting point of 25° C. or higher, the removing liquid contains an organic solvent that is miscible with water and has a vapor pressure of 17 mm Hg or less at 25° C. and a hydroxyl group within the structure.

    摘要翻译: 提供了光致抗蚀剂残留物和聚合物残渣除去液体组合物,以及除去其中使用的残留物的方法,用于除去在制造具有金属布线的半导体电路元件的工艺期间产生的光致抗蚀剂残留物和聚合物残留物。 具体而言,该组合物不含有含氮有机羟基化合物,氨或氟化合物,并且含有熔点为25℃以上且脂肪族除去性优异且具有金属氧化物主成分的脂肪族多元羧酸为 残渣除去组分。 光致抗蚀剂残渣和聚合物残渣除去液体组合物以及除去残留物的除去方法能够防止在溶液附着在清洗装置液体喷射喷嘴或清洗之后使水分蒸发而使脂肪族多元羧酸重结晶 坦克和一个房间。 在含有熔点为25℃以上的脂肪族多元羧酸的光致抗蚀剂残渣和聚合物残渣除去液组合物中,除去液含有与水混溶的有机溶剂,蒸气压为17mmHg以下 在25℃和该结构内的羟基。