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公开(公告)号：US20140049928A1
公开(公告)日：2014-02-20
申请号：US13593131
申请日：2012-08-23
申请人： Tatsuro Sawatari , Eiji Mugiya , Hiroshi Nakamura
发明人： Tatsuro Sawatari , Eiji Mugiya , Hiroshi Nakamura
IPC分类号： H05K1/18
CPC分类号： H05K1/185 , H01L24/19 , H01L2224/04105 , H01L2924/12042 , H05K3/4679 , H01L2924/00
摘要： Provided is a substrate with a built-in electronic component that can avoid as much as possible the occurrence of malfunctions in the electronic component due to moisture entering, even when an electronic component, provided with a structure in which a terminal pad is present where a hole in the sealing part provided on the main body of a component is located, is built into the substrate. A SAW filter 12 built into a substrate 11 is provided with a structure that has terminal pads 12c to 12e on the bottom of respective holes 12f1 in a sealing part 12f. The lower surfaces of respective conductive vias 11d2 are connected to the upper surfaces of the terminal pads 12c to 12e through the respective holes 12f1 such that a ring-shaped gap CC is formed between outer surfaces of the conductive vias 11d2 and inner surfaces of the holes 12f1. Each ring-shaped gap CC is filled with a part that is integral with a first insulating layer 11c.
摘要翻译： 提供一种具有内置电子部件的基板，即使当设置有存在终端焊盘的结构的电子部件时，尽可能避免由于水分进入而导致的电子部件故障的发生，其中， 位于组件主体上的密封部分的孔位于衬底内。 内置于基板11中的SAW滤波器12具有在密封部12f中的各个孔12f1的底部具有端子焊盘12c〜12e的结构。 各个导电通路11d2的下表面通过相应的孔12f1连接到端子焊盘12c至12e的上表面，使得在导电通孔11d2的外表面和孔的内表面之间形成环形间隙CC 12f1。 每个环形间隙CC都填充有与第一绝缘层11c成一体的部分。
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公开(公告)号：US08536959B1
公开(公告)日：2013-09-17
申请号：US13589531
申请日：2012-08-20
申请人： Eiji Mugiya , Tetsuo Saji , Takashi Matsuda , Hiroshi Nakamura
发明人： Eiji Mugiya , Tetsuo Saji , Takashi Matsuda , Hiroshi Nakamura
CPC分类号： H03H9/6483 , H03H9/02897 , H03H9/0538 , H03H9/1085 , H05K1/0271 , H05K1/056 , H05K1/185 , H05K3/4644
摘要： Provided is a substrate with a built-in electronic component that can minimize occurrence of functional anomaly, damage, or the like in a filter function section of an elastic wave filter that is caused by a deformation of a hollow cover of the elastic wave filter that is built into the substrate. The substrate with a built-in electronic component includes: an SAW filter built into a substrate, a filter function section of the SAW filter being covered by a hollow cover; and a stress absorbing layer that faces the hollow cover of the SAW filter through an insulating layer in the substrate.
摘要翻译： 本发明提供一种具有内置电子部件的基板，其能够使由弹性波滤波器的中空盖的变形引起的弹性波滤波器的滤波器功能部中的功能异常，损伤等的发生最小化， 内置于基材中。 具有内置电子部件的基板包括：内置于基板的SAW滤波器，SAW滤波器的滤波器功能部分被中空盖覆盖; 以及通过基板中的绝缘层面向SAW滤波器的中空盖的应力吸收层。
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3.发明申请公开(公告)号：US20090084596A1
公开(公告)日：2009-04-02
申请号：US12200920
申请日：2008-08-28
CPC分类号： H05K1/185 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/2518 , H01L2224/73267 , H01L2224/92244 , H01L2924/14 , H01L2924/3025 , H01L2924/351 , H05K1/056 , H05K3/445 , H05K3/4608 , H05K3/4661 , H05K2201/0195 , H05K2201/0209 , H05K2201/10636 , H05K2203/1152 , H05K2203/1469 , Y02P70/611 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , H01L2924/00
摘要： An electronic part-incorporated multilayer substrate is provided. The multi-layer substrate includes a core formed with a plurality of holes capable of containing an electronic part, a bottom insulating resin layer formed on a bottom surface of the core, a top insulating resin layer formed on a top surface of the core, a wiring layer selectively formed on an outer surface of the bottom insulating resin layer or top insulating resin layer, and an electronic part contained in any of the holes.Both of the bottom and top insulating resin layers have a structure that is a combination of a resin which is changed to cohesiveness when heated and which undergoes smaller plastic deformation when heated to a higher temperature and an insulating resin layer which has a thickness sufficient to maintain insulation between the electronic part or a conductor of the core and the wiring layer and which inherently undergoes small plastic deformation. Thus, the electronic part can be securely and sealed in the hole without using an adhesive separately.
摘要翻译： 提供了一种电子部件合并的多层基板。 多层基板包括形成有能够容纳电子部件的多个孔的芯，形成在芯的底面的底部绝缘树脂层，形成在芯的顶面上的顶部绝缘树脂层， 选择性地形成在底部绝缘树脂层或顶部绝缘树脂层的外表面上的布线层和容纳在任何孔中的电子部件。 底部和顶部绝缘树脂层都具有这样的结构，即当被加热时变为凝聚性的树脂和加热到较高温度时变得较小的塑性变形的树脂和具有足以维持的厚度的绝缘树脂层的组合 电子部件或芯体的导体与布线层之间的绝缘，其固有地经历小的塑性变形。 因此，电子部件可以牢固地密封在孔中而不使用粘合剂。
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公开(公告)号：US20060186519A1
公开(公告)日：2006-08-24
申请号：US11334106
申请日：2006-01-17
申请人： Taizo Inoue , Kenzo Kitazaki , Hisashi Shigetani , Eiji Mugiya
发明人： Taizo Inoue , Kenzo Kitazaki , Hisashi Shigetani , Eiji Mugiya
IPC分类号： H01L23/02
CPC分类号： H05K3/3436 , H01L24/11 , H01L24/13 , H01L24/81 , H01L2224/05001 , H01L2224/05022 , H01L2224/05111 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05568 , H01L2224/05647 , H01L2224/05655 , H01L2224/1147 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/131 , H01L2224/13147 , H01L2224/13155 , H01L2224/1329 , H01L2224/133 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/1033 , H01L2924/14 , H05K3/3463 , H05K2201/10992 , Y02P70/613 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： A semiconductor device comprises columnar electrodes including columnar portions and ball-shaped low-melting point layers joined to the top surfaces of columnar portions. The amount of plating of the low-melting point layer and the cross-sectional area of the columnar portion are adjusted in such a way that the relationship represented by A≦1.3×B1.5 is satisfied, where the volume of each of the low-melting point layers is represented by A and the area of the top surface of each of the columnar portions is represented by B. Consequently, the low-melting point layer is prevented from trickling on a side surface of the columnar portion during formation of the ball by reflow of the low-melting point layer.
摘要翻译： 半导体器件包括柱形电极，其包括柱状部分和与柱状部分的顶表面接合的球形低熔点层。 调节低熔点层的镀层量和柱状部分的横截面积，使得满足由A <= 1.3×B <1.5>所表示的关系，其中 每个低熔点层的体积由A表示，并且每个柱状部分的顶表面的面积用B表示。因此，防止低熔点层在 通过低熔点层的回流而在球形成期间的柱状部分。
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5.发明授权公开(公告)号：US08314343B2
公开(公告)日：2012-11-20
申请号：US12200920
申请日：2008-08-28
CPC分类号： H05K1/185 , H01L24/24 , H01L24/82 , H01L2224/04105 , H01L2224/2518 , H01L2224/73267 , H01L2224/92244 , H01L2924/14 , H01L2924/3025 , H01L2924/351 , H05K1/056 , H05K3/445 , H05K3/4608 , H05K3/4661 , H05K2201/0195 , H05K2201/0209 , H05K2201/10636 , H05K2203/1152 , H05K2203/1469 , Y02P70/611 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49155 , H01L2924/00
摘要： In a multi-layer substrate including a core formed with a plurality of holes capable of containing an electronic part, a bottom insulating resin layer formed on a bottom surface of the core, a top insulating resin layer formed on a top surface of the core, a wiring layer selectively formed on an outer layer of the bottom insulating resin layer or top insulating resin layer, and an electronic part contained in the holes, both of the bottom and top insulating resin layers have a structure that is a combination of a resin which is changed to cohesiveness when heated and which undergoes smaller plastic deformation when heated to a higher temperature and an insulating resin layer which has a thickness sufficient to maintain insulation between the electronic part or a conductor of the core and the wiring layer and which inherently undergoes small plastic deformation, so that the electronic part can be securely and sealed in the holes without using a particular adhesive.
摘要翻译： 在包括形成有能够容纳电子部件的多个孔的芯的多层基板中，形成在芯的底面上的底部绝缘树脂层，形成在芯的顶面上的顶部绝缘树脂层， 选择性地形成在底部绝缘树脂层或顶部绝缘树脂层的外层上的布线层和包含在孔中的电子部件，两个顶部和顶部绝缘树脂层都具有以下结构：树脂的组合 在加热时变为粘结性，当被加热到较高温度时会变得较小的塑性变形，并且绝缘树脂层具有足以保持电子部件或芯的导体与布线层之间的绝缘的厚度并且固有地经历小的绝缘树脂层 塑性变形，使得电子部件可以牢固地密封在孔中而不使用特定的粘合剂。
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